CGA Field Programmable Gate Arrays (FPGA) 27

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
XQR5VFX130-1CN1752V	Xilinx	FPGA	Military	1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired	131072	Yes	1.05 V	10240	CMOS				1			Grid Array			.95 V	1 mm	125 °C (257 °F)	0.11 ns	10240 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1752		8.8 mm	45 mm	No					45 mm
XQR5VFX130-1CN1752B	Xilinx	FPGA	Military	1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired	131072	Yes	1.05 V	10240	CMOS				1			Grid Array			.95 V	1 mm	125 °C (257 °F)	0.11 ns	10240 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1752		8.8 mm	45 mm	No					45 mm
XQRKU060-1CNA1509Y	Xilinx	FPGA	Military	1509	CGA	Square	120k Rad(Si)	Ceramic, Metal-Sealed Cofired	725550	Yes		41460		MIL-PRF-38535 CLASS Y	620			Box; Tray		Grid Array	CGA1509,39X39,40			1 mm	125 °C (257 °F)		41460 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1509		8.97 mm	40 mm		Tray contains 1 device			620	40 mm
AX2000-1CGS624M	Microchip Technology	FPGA	Military	624	CGA	Square		Ceramic, Metal-Sealed Cofired	32526	Yes	1.575 V	21504	CMOS		418	2000000	1.5	Box		Grid Array			1.425 V		125 °C (257 °F)		21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-X624					1060000 typical gates avaialable			418
RTAX2000S-CG1152E	Microsemi	FPGA	Military	1152	CGA	Square		Ceramic, Metal-Sealed Cofired	32256	No	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	CGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-X1152		3.575 mm	35 mm	No	250000 ASIC gates also available			684	35 mm
RTAX2000SCG1152E	Microchip Technology	FPGA	Military	1152	CGA	Square		Ceramic, Metal-Sealed Cofired	32256	No	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	CGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-X1152		3.575 mm	35 mm	No	250000 ASIC gates also available			684	35 mm
RT3PE3000L-CG484B	Microchip Technology	FPGA	Military	484	CGA	Square		Ceramic, Metal-Sealed Cofired	75264	No	1.575 V	75264	CMOS	MIL-STD-883 Class B	341	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	CGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-X484		6.19 mm	23 mm	No			250 MHz	341	23 mm
RT3PE3000L-CG484PROTO	Microchip Technology	FPGA		484	CGA	Square		Ceramic, Metal-Sealed Cofired		No	1.575 V	75264	CMOS			3000000	1.2			Grid Array			1.14 V	1 mm			75264 CLBS, 3000000 Gates			Perpendicular	S-CPGA-X484		6.19 mm	23 mm						23 mm
XQR5VFX130-1CF1752B	Xilinx	FPGA	Military	1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	1.05 V	10240	CMOS				1			Grid Array			.95 V	1 mm	125 °C (257 °F)		10240 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X1752		9.6 mm	45 mm			e0			45 mm
XQR4VFX140-10CF1509V	Xilinx	FPGA	Military	1509	CGA	Square		Ceramic, Metal-Sealed Cofired	142128	Yes	1.26 V	16128	CMOS	38535V;38534K;883S	768		1.2		1.2,2.5,3.3 V	Grid Array	PGA1509,39X39,39	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		16128 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1509		8.47 mm	40 mm	No			1028 MHz	768	40 mm
XQ2V3000-4CGG717M	Xilinx	FPGA		717	CGA	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	3584	CMOS			3000000	1.5			Grid Array			1.425 V	1.27 mm		0.44 ns	3584 CLBS, 3000000 Gates		Matte Tin	Bottom	S-CBGA-X717		3.3 mm	35 mm	No		e3	650 MHz		35 mm
XQR2V3000-4CGG717V	Xilinx	FPGA	Military	717	CGA	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	3584	CMOS			3000000	1.5			Grid Array			1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X717		3.3 mm	35 mm	No		e3	650 MHz		35 mm
XQR4VSX55-10CF1140V	Xilinx	FPGA	Military	1140	CGA	Square		Ceramic, Metal-Sealed Cofired	55296	Yes	1.26 V	6144	CMOS	38535V;38534K;883S	640		1.2		1.2,2.5,3.3 V	Grid Array	PGA1140,34X34,39	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6144 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1140		8.47 mm	35 mm	No			1028 MHz	640	35 mm
XQRKU060-1CNA1509B	Xilinx	FPGA	Military	1509	CGA	Square	120k Rad(Si)	Ceramic, Metal-Sealed Cofired	725550	Yes		41460		MIL-PRF-38535 Class B	620			Box; Tray		Grid Array	CGA1509,39X39,40			1 mm	125 °C (257 °F)		41460 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1509		8.97 mm	40 mm		Tray contains 1 device			620	40 mm
XQVR1000-4CG560B	Xilinx	FPGA	Military	560	CGA	Square		Ceramic	27648	Yes			CMOS		404				1.2/3.6,2.5 V	Grid Array	CGA560,33X33,50	Field Programmable Gate Arrays		1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-XBGA-X560				No				404
XQR2V3000-4CGG717M	Xilinx	FPGA	Military	717	CGA	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	3584	CMOS			3000000	1.5			Grid Array			1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Matte Tin	Bottom	S-CBGA-X717		3.3 mm	35 mm	No		e3	650 MHz		35 mm
XQR2V6000-4CF1144M	Xilinx	FPGA	Military	1144	CGA	Square		Ceramic, Metal-Sealed Cofired	76032	Yes	1.575 V	8448	CMOS		824	6000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	CGA1144,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.44 ns	8448 CLBS, 6000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X1144		7 mm	35 mm	No		e0	650 MHz	824	35 mm
XQR2V3000-4CG717V	Xilinx	FPGA	Military	717	CGA	Square		Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	CGA717,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X717		3.3 mm	35 mm	No		e0	650 MHz	516	35 mm
XQ2V6000-4CF1144M	Xilinx	FPGA	Military	1144	CGA	Square		Ceramic, Metal-Sealed Cofired	76032	Yes	1.575 V	8448	CMOS		824	6000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	CGA1144,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.44 ns	8448 CLBS, 6000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X1144	1	7 mm	35 mm	No		e0	650 MHz	824	35 mm
XQR2V6000-4CF1144H	Xilinx	FPGA	Military	1144	CGA	Square		Ceramic, Metal-Sealed Cofired	76032	Yes	1.575 V	8448	CMOS		824	6000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	CGA1144,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.44 ns	8448 CLBS, 6000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X1144	1	7 mm	35 mm	No		e0	650 MHz	824	35 mm
XQR2V3000-4CG717M	Xilinx	FPGA	Military	717	CGA	Square		Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	CGA717,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-X717		3.3 mm	35 mm	No			650 MHz	516	35 mm
XQR4VLX200-10CF1509V	Xilinx	FPGA	Military	1509	CGA	Square		Ceramic, Metal-Sealed Cofired	200448	Yes	1.26 V	22272	CMOS	38535V;38534K;883S	960		1.2		1.2,2.5,3.3 V	Grid Array	PGA1509,39X39,39	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		22272 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1509		8.47 mm	40 mm	No			1028 MHz	960	40 mm
XQV1000E-6CG560M	Xilinx	FPGA	Military	560	CGA	Square		Ceramic, Metal-Sealed Cofired	27648	Yes	1.89 V	6144	CMOS	38535Q/M;38534H;883B	404	1569178	1.8		1.2/3.6,1.8 V	Grid Array	CGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	125 °C (257 °F)		6144 CLBS, 1569178 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-X560		4.9 mm	42.5 mm	No			357.2 MHz	404	42.5 mm
XQ2V3000-4CG717M	Xilinx	FPGA	Military	717	CGA	Square		Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	3584	CMOS		516	3000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	CGA717,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.44 ns	3584 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X717	1	3.3 mm	35 mm	No		e0	650 MHz	516	35 mm
XQR5VFX130-1CF1752V	Xilinx	FPGA	Military	1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired	131072	Yes	1.05 V	10240	CMOS		836		1		1,1.2/3.3,2.5 V	Grid Array	HPGA1752,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)		10240 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-CBGA-X1752		9.6 mm	45 mm	No		e0	1098 MHz	836	45 mm
5962-0253001QZC	Xilinx	FPGA	Military	717	CGA	Square		Ceramic	32256	Yes			CMOS	38535Q/M;38534H;883B	516				1.5,1.5/3.3,3.3 V	Grid Array	CGA717,27X27,50	Field Programmable Gate Arrays		1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-XBGA-X717				No			400 MHz	516
XQR4VFX60-10CF1144V	Xilinx	FPGA	Military	1144	CGA	Square		Ceramic, Metal-Sealed Cofired	56880	Yes	1.26 V	6656	CMOS	38535V;38534K;883S	576		1.2		1.2,2.5,3.3 V	Grid Array	PGA1144,34X34,39	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		6656 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1144		9.56 mm	35 mm	No			1028 MHz	576	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.