Microchip Technology - AX2000-1CGS624M

LCMXO2-1200HC-4TG144C by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133 MHz. Operating at 85°C, it has 107 inputs/outputs and supports supply voltages of 2.5V/3.3V. Ideal for applications requiring high-speed processing in compact designs.

M2GL025TS-1FGG484I by Microchip Technology is a 27696 logic cell FPGA with 267 inputs/outputs. Operating at 1.2V, it has a temperature range of -40 to 100°C and comes in a square grid array package suitable for industrial applications.

Intel's 5CGXFC7C6F23I7N FPGA boasts 149500 logic cells, 240 inputs/outputs, and a max supply voltage of 1.13V. Ideal for applications requiring high-speed data processing and complex algorithm implementation in fields like telecommunications and automotive industries.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;

The Xilinx XC3S50A-4VQG100C is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at a max frequency of 667 MHz and has a combinatorial delay of 0.71 ns. Ideal for applications requiring high-speed processing and programmable logic capabilities in compact designs.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;

EP4CE15F17C8N by Altera is a Field Programmable Gate Array (FPGA) with 15408 logic cells, 963 CLBs, 165 inputs/outputs, and a maximum clock frequency of 472.5 MHz. It is suited for various applications that require programmable ICs and high-performance processing.

EP3C10E144C8N by Intel is a CMOS FPGA with 10320 logic cells and CLBs. Operating at 1.2V, it has a clock frequency of 472.5MHz. Ideal for applications requiring high-speed processing in compact designs like IoT devices and telecommunications equipment.

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology Used: CMOS;

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;

EP3C25F324I7N by Altera is a 1.2V CMOS FPGA with 24,624 logic cells, 215 inputs/outputs, and a maximum clock frequency of 472.5MHz. It is a versatile programmable IC suitable for industrial applications.

FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

ICE40HX4K-CB132 by Lattice Semiconductor is a FPGA with 3520 logic cells, 440 CLBs, and 95 inputs/outputs. Operating at max frequency of 133 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and very thin profile, it offers versatility in design while maintaining reliability.

FIELD PROGRAMMABLE GATE ARRAY;

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Microchip Technology's A3PN250-VQG100I is a CMOS FPGA with 6144 logic cells and 250,000 equivalent gates. It operates at a supply voltage range of 1.425V to 1.575V, suitable for industrial applications requiring high gate density and low power consumption in a compact flatpack package style.

FIELD PROGRAMMABLE GATE ARRAY;

A3P600-PQG208I by Microchip is a FPGA with 13824 CLBs and 600000 gates, operating at max 350 MHz. It has a supply voltage range of 1.425V to 1.575V, suitable for industrial applications requiring high-speed processing and programmable logic capabilities in compact form factors. The device comes in a PLASTIC/EPOXY package with GULL WING terminals, making it ideal for surface mount assembly processes.