FBGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP3C40U484A7

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

39600

CMOS

331

1.2

1.2/3.3 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.15 V

.8 mm

39600 CLBS

Bottom

S-PBGA-B484

2.05 mm

19 mm

No

331

19 mm

5CGXBC3E7U19I7N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC9D6U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC7A6U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC4F7U19I7N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGTFD5A5U19I7N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEMA2U23I7SN

Altera

FPGA

Ball

672

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B672

1.85 mm

23 mm

23 mm

5CGXBC3F7U19C7

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEMA6U19C61

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

110000

Yes

CMOS

66

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B484

No

66

5CSEBA6U23C6S

Altera

FPGA

Other

Ball

672

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

23 mm

5CGXFC5C7U19C7N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEMA5U23I7SN

Altera

FPGA

Ball

672

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B672

1.85 mm

23 mm

23 mm

5CGXBC9A6U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CEFA7U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEMA2U23A7SN

Altera

FPGA

Automotive

Ball

672

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

23 mm

5CGTFD9E5U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEMA5U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC7C6U19C7N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

149500

Yes

1.13 V

CMOS

240

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

No

240

19 mm

EP3CLS100U484C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

100448

Yes

1.25 V

100448

CMOS

278

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

100448 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.05 mm

19 mm

No

e0

450 MHz

20 s

278

220 °C (428 °F)

19 mm

5CGXFC7B7U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP3CLS70U484C7

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

70208

Yes

1.25 V

70208

CMOS

413

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

70208 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.05 mm

19 mm

No

e0

450 MHz

20 s

413

220 °C (428 °F)

19 mm

5CGXFC9D7U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC3E6U19I7N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEMA5U19C6

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP3C80U484A7N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

81264

Yes

CMOS

295

1.2/3.3 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

.8 mm

Tin/Silver/Copper

Bottom

S-PBGA-B484

No

e1

295

5CSEMA6U19C81N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

110000

Yes

CMOS

66

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B484

No

66

5CGXBC9E6U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC7E7U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEMA6U19C7S

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

10AS022C3U19E2SG

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

220000

Yes

.93 V

CMOS

192

.9

0.9 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

.87 V

.8 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

3.25 mm

19 mm

No

192

19 mm

5CGXBC7B7U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CEFA9U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP3C16U484C8

Altera

FPGA

Other

Ball

484

FBGA

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

346

1.2

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

15408 CLBS

0 °C (32 °F)

Tin Lead

Bottom

R-PBGA-B484

3

2.2 mm

19 mm

No

e0

472.5 MHz

20 s

346

220 °C (428 °F)

19 mm

5CGXBC5E7U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

10AS022C5U19I3SG

Altera

FPGA

Industrial

Ball

484

FBGA

Square

Plastic/Epoxy

220000

Yes

.93 V

8033

CMOS

192

.9

0.9 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

.87 V

.8 mm

100 °C (212 °F)

8033 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B484

3.25 mm

19 mm

No

192

19 mm

5CGXFC9D6U19C6

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEMA2U19C61

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

25000

Yes

CMOS

66

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B484

No

66

5CGXFC3E6U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CSEBA4U23I7S

Altera

FPGA

Ball

672

FBGA

Square

Plastic/Epoxy

40000

Yes

1.13 V

CMOS

145

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,28X28,32

Field Programmable Gate Arrays

1.07 V

.8 mm

Bottom

S-PBGA-B672

1.85 mm

23 mm

No

145

23 mm

5CGXBC5D6U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC9F6U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC5F7U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC5C7U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

77000

Yes

1.13 V

CMOS

224

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

No

224

19 mm

5CSEMA6U19I7SN

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC4B6U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGTFD5A5U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC7A7U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC5B6U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.