FBGA Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	No. of Outputs	Length
XCKU060-1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)	41460 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			624	23 mm
XCKU035-2SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)	25391 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			520	23 mm
XCKU095-L1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200		702	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)	67200 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm		Also Operates at 0.95 V nominal supply	702	23 mm
XCKU085-3SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			676	23 mm
XCKU060-1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)	41460 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			624	23 mm
XCKU115-2SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)	82920 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			832	23 mm
XCKU035-L1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)	25391 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm		Also Operates at 0.95 V nominal supply	520	23 mm
XCKU095-L1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200		702	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)	67200 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm		Also Operates at 0.95 V nominal supply	702	23 mm
XCKU060-1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)	41460 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			624	23 mm
XCKU085-1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			676	23 mm
XCKU025-2SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)	18180 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			312	23 mm
XCKU095-3SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200		702	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)	67200 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			702	23 mm
XCKU095-1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)	67200 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			702	23 mm
XCKU025-3SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)	18180 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			312	23 mm
XCKU115-1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)	82920 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			832	23 mm
XCKU060-L1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)	41460 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm		Also Operates at 0.95 V nominal supply	624	23 mm
XCKU025-L1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)	18180 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm		Also Operates at 0.95 V nominal supply	312	23 mm
XCKU060-2SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)	41460 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			624	23 mm
XCKU035-3SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	85 °C (185 °F)	25391 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			520	23 mm
XCKU085-3SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	85 °C (185 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			676	23 mm
XCKU115-L1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920		832	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)	82920 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm		Also Operates at 0.95 V nominal supply	832	23 mm
XCKU025-L1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	85 °C (185 °F)	18180 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm		Also Operates at 0.95 V nominal supply	312	23 mm
XCKU115-1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)	82920 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			832	23 mm
XCKU025-3SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	85 °C (185 °F)	18180 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			312	23 mm
XCKU060-L1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	85 °C (185 °F)	41460 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm		Also Operates at 0.95 V nominal supply	624	23 mm
XCKU085-2SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			676	23 mm
XCKU025-1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)	18180 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			312	23 mm
XCKU060-3SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460		624	1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)	41460 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			624	23 mm
XCKU085-2SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			676	23 mm
XCKU095-2SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)	67200 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm			702	23 mm
XCKU085-L1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)	62190 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm		Also Operates at 0.95 V nominal supply	676	23 mm
XCKU025-L1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312	0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)	18180 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.52 mm	23 mm		Also Operates at 0.95 V nominal supply	312	23 mm
5CGXFC9C6U19C8	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm
5CGXBC7C7U19C7N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm
5CGXBC7C7U19C6	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm
5CGXFC5E6U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm
5CGXBC9C6U19C7N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm
5CGXBC7D6U19I7N	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm				Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm
5CSXFC5C6U23I72	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	85000	Yes			CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm				Bottom	S-PBGA-B672			No		124
5CSEMA5U19C7SN	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm
5CGXFC4E6U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm
5CSEMA6U23C72	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	110000	Yes			CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm				Bottom	S-PBGA-B672			No		124
5CGXBC3E7U19C8	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm
5CGXBC4A7U19C8	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm
5CSEMA4U23C82N	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	40000	Yes			CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm				Bottom	S-PBGA-B672			No		124
5CGXBC7E7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm
5CGTFD5C5U19C6	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm
5CGXBC5F6U19I7N	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm				Bottom	S-PBGA-B484	1.9 mm	19 mm				19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.