FBGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XA6SLX45-2CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411			320		1.23		Grid Array, Fine Pitch	BGA484,22X22,32		1.2 V	.8 mm	125 °C (257 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			320		19 mm
XA6SLX4-3CPG196I	Xilinx	FPGA		Ball	196	FBGA	Square	Plastic/Epoxy	3840	Yes				AEC-Q100	106			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays		.5 mm					Tin Silver Copper	Bottom	S-PBGA-B196	3			No		e1	62.5 MHz		106
XC4VFX12-11SFG363IS1	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes			CMOS		240			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B363	4			No		e1	1181 MHz	30 s	240	260 °C (500 °F)
XC4VLX15-11SFG363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS		240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1536 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e1	1205 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VFX12-10SFG363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS		240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e1	1028 MHz	30 s	240	260 °C (500 °F)	17 mm
XC2S50E-6FTGG256I	Xilinx	FPGA		B	256	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz				17 mm
XC7A200T-2SB484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.05 V						1		Grid Array, Fine Pitch			.95 V	.8 mm	85 °C (185 °F)	1.05 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484		2.44 mm	19 mm			e0					19 mm
XQ6SLX75T-2CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			292		1.23		Grid Array, Fine Pitch	BGA484,22X22,32		1.2 V	.8 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			292		19 mm
XQ6SLX75-L1CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		328			1,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	500 MHz	30 s	328	225 °C (437 °F)
XC6SLX150T-N3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	147443	Yes			CMOS		296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	806 MHz	30 s	296	225 °C (437 °F)
XA3SD1800A-4CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	AEC-Q100	309	37440	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	125 °C (257 °F)	0.71 ns	4160 CLBS, 37440 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	249	260 °C (500 °F)	19 mm
XC2S100E-6FGG676C	Xilinx	FPGA	Commercial Extended	B	676	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz				27 mm
XC6SLX45T-3NCS484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411			296		1.2		Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			296		19 mm
XC3S500E-5CPG132CS1	Xilinx	FPGA		Ball	132	FBGA	Square	Plastic/Epoxy	10476	Yes			CMOS		92			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays		.5 mm					Tin Silver Copper	Bottom	S-PBGA-B132	3			No		e1	657 MHz	30 s	85	260 °C (500 °F)
XC6SLX45T-3NCS484C	Xilinx	FPGA	Commercial	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411			296		1.2		Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	70 °C (158 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			296		19 mm
XC7A50T-1CSG225I	Xilinx	FPGA		Ball	225	FBGA	Square	Plastic	52160	Yes	1.05 V		CMOS		100		1	1 V	Grid Array, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B225				No			1098 MHz		100
XC6SLX45T-3CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS		296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	296	225 °C (437 °F)
XC6SLX150-L1CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS		330		1	1,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1			330		19 mm
XC6SLX100-2CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes			CMOS		338			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	338	225 °C (437 °F)
XQ6SLX75T-2CS484Q	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	292	225 °C (437 °F)
XC4VLX15-10SFG363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS		240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1536 CLBS		Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e1	1028 MHz	30 s	240	260 °C (500 °F)	17 mm
XCKU3P-L1SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340			304		0.72		Grid Array, Fine Pitch	BGA784,28X28,32		.698 V	.8 mm	100 °C (212 °F)		20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm			e1		30 s	304	250 °C (482 °F)	23 mm
XQ6SLX150-1LCSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519			338		1		Grid Array, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	125 °C (257 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			338		19 mm
XCKU095-2SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						702		23 mm
XCKU060-L1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460			624		0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				624		23 mm
XCKU115-L1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920			832		0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				832		23 mm
XCKU085-L1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190			676		0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				676		23 mm
XCKU040-3SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300			520		1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						520		23 mm
XCKU095-L1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200			702		0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				702		23 mm
XCKU060-2SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460			624		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						624		23 mm
XCKU095-3SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200			702		1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						702		23 mm
XCKU060-2SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460			624		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						624		23 mm
XCKU095-2SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						702		23 mm
XCKU060-3SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460			624		1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						624		23 mm
XCKU115-L1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920			832		0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				832		23 mm
XCKU025-1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180			312		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						312		23 mm
XCKU095-1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						702		23 mm
XCKU085-3SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190			676		1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						676		23 mm
XCKU025-1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180			312		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						312		23 mm
XCKU115-2SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920			832		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						832		23 mm
XCKU085-L1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190			676		0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				676		23 mm
XCKU060-1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460			624		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						624		23 mm
XCKU035-2SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391			520		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						520		23 mm
XCKU095-L1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200			702		0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				702		23 mm
XCKU085-3SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190			676		1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						676		23 mm
XCKU060-1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460			624		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						624		23 mm
XCKU115-2SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920			832		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						832		23 mm
XCKU035-L1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391			520		0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				520		23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.