FBGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A200T-2SB484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.05 V						1		Grid Array, Fine Pitch			.95 V	.8 mm	85 °C (185 °F)	1.05 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484		2.44 mm	19 mm			e0					19 mm
XQ6SLX75T-2CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			292		1.23		Grid Array, Fine Pitch	BGA484,22X22,32		1.2 V	.8 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			292		19 mm
XQ6SLX75-L1CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		328			1,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	500 MHz	30 s	328	225 °C (437 °F)
XC6SLX150T-N3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	147443	Yes			CMOS		296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	806 MHz	30 s	296	225 °C (437 °F)
XA3SD1800A-4CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	AEC-Q100	309	37440	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	125 °C (257 °F)	0.71 ns	4160 CLBS, 37440 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	249	260 °C (500 °F)	19 mm
XC2S100E-6FGG676C	Xilinx	FPGA	Commercial Extended	B	676	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz				27 mm
XC6SLX45T-3NCS484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411			296		1.2		Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			296		19 mm
XC3S500E-5CPG132CS1	Xilinx	FPGA		Ball	132	FBGA	Square	Plastic/Epoxy	10476	Yes			CMOS		92			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays		.5 mm					Tin Silver Copper	Bottom	S-PBGA-B132	3			No		e1	657 MHz	30 s	85	260 °C (500 °F)
XC6SLX45T-3NCS484C	Xilinx	FPGA	Commercial	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411			296		1.2		Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	70 °C (158 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			296		19 mm
XC7A50T-1CSG225I	Xilinx	FPGA		Ball	225	FBGA	Square	Plastic	52160	Yes	1.05 V		CMOS		100		1	1 V	Grid Array, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B225				No			1098 MHz		100
XC6SLX45T-3CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS		296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	296	225 °C (437 °F)
XC6SLX150-L1CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS		330		1	1,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1			330		19 mm
XC6SLX100-2CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes			CMOS		338			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	338	225 °C (437 °F)
XQ6SLX75T-2CS484Q	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	292	225 °C (437 °F)
XC4VLX15-10SFG363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS		240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1536 CLBS		Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e1	1028 MHz	30 s	240	260 °C (500 °F)	17 mm
XCKU3P-L1SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340			304		0.72		Grid Array, Fine Pitch	BGA784,28X28,32		.698 V	.8 mm	100 °C (212 °F)		20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm			e1		30 s	304	250 °C (482 °F)	23 mm
XQ6SLX150-1LCSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519			338		1		Grid Array, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	125 °C (257 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			338		19 mm
XA6SLX4-2CPG196I	Xilinx	FPGA		Ball	196	FBGA	Square	Plastic/Epoxy	3840	Yes				AEC-Q100	106			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays		.5 mm					Tin Silver Copper	Bottom	S-PBGA-B196	3			No		e1	62.5 MHz		106
XCKU035-2SFVA784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391			520		0.95	0.95 V	Grid Array, Fine Pitch	BGA784,28X28,32	Field Programmable Gate Arrays	.922 V	.8 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm	No		e1			520		23 mm
XCKU5P-L2SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120			304		0.72		Grid Array, Fine Pitch	BGA784,28X28,32		.698 V	.8 mm	110 °C (230 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		Also Operates at 0.85 V nominal supply	e1		30 s	304	250 °C (482 °F)	23 mm
XA6SLX9-2CPG196I	Xilinx	FPGA		Ball	196	FBGA	Square	Plastic/Epoxy	9152	Yes				AEC-Q100	106			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays		.5 mm					Tin Silver Copper	Bottom	S-PBGA-B196	3			No		e1	62.5 MHz		106
XC6SLX45-L1CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	43661	Yes			CMOS		320			1,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	500 MHz	30 s	320	225 °C (437 °F)
XC4VFX12-10SFG363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS		240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1368 CLBS		Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e1	1028 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VLX15-12SFG363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS		240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1536 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e1	1205 MHz	30 s	240	260 °C (500 °F)	17 mm
XC6SLX100-N3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	101261	Yes			CMOS		338			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	806 MHz	30 s	338	225 °C (437 °F)
XC4VLX25-12SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm
XC6SLX75-N3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		328		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz	30 s	328	260 °C (500 °F)	19 mm
XC6SLX150T-N3CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		296		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz		296		19 mm
XC6SLX100-1LCSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	500 MHz				19 mm
XC6SLX45T-3NCSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz				19 mm
XC4VLX25-10SF363IS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		240		1.2	1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm		0.2 ns	2688 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XC6SLX45-2CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS		320			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	320	225 °C (437 °F)
XA3SD3400A-4CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	53712	Yes		5968	CMOS	AEC-Q100	309	53712		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm			5968 CLBS, 53712 Gates		Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	249	260 °C (500 °F)	19 mm
XC4VLX25-12SFG363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e1	1205 MHz	30 s	240	260 °C (500 °F)	17 mm
XC7A200T-3SBV484E	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.05 V	16825					1		Grid Array, Fine Pitch			.95 V	.8 mm		0.94 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	19 mm			e1					19 mm
XC6SLX75T-N3CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	74637	Yes			CMOS		292			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	806 MHz	30 s	292	225 °C (437 °F)
XC6SLX100T-N3CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		296		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz		296		19 mm
XC6SLX100-N3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		338		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz		338		19 mm
XC6SLX100T-N3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	101261	Yes			CMOS		296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	806 MHz	30 s	296	225 °C (437 °F)
XC7A50T-3CSG225E	Xilinx	FPGA		Ball	225	FBGA	Square	Plastic	52160	Yes	1.05 V		CMOS		100		1	1 V	Grid Array, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B225				No			1412 MHz		100
XC4VFX12-10SF363IS1	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes			CMOS		240			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B363	4			No		e0	1028 MHz	30 s	240	225 °C (437 °F)
XC7A30T-L2CSG225E	Xilinx	FPGA		Ball	225	FBGA	Square	Plastic	33600	Yes	1.05 V		CMOS		100		1	1 V	Grid Array, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns		0 °C (32 °F)		Bottom	S-PBGA-B225			13 mm	No			1286 MHz		100		13 mm
XC7A15-L2CSG324E	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	15360	Yes	1.05 V		CMOS		200		1	1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3		15 mm	No		e1	1286 MHz	30 s	200	260 °C (500 °F)	15 mm
XC7A15-1CSG324I	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	15360	Yes	1.05 V		CMOS		200		1	1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3		15 mm	No		e1	1098 MHz	30 s	200	260 °C (500 °F)	15 mm
XS2S30-5-CS144C	Xilinx	FPGA		Ball	144	FBGA	Square	Plastic/Epoxy	972	Yes			CMOS		132			1.5/3.3,2.5 V	Grid Array, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)	0.7 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3		12 mm	No		e0		30 s	132	240 °C (464 °F)	12 mm
XQ6SLX150-2CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes			CMOS		338			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	667 MHz		338
XQ6SLX75T-3CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	292	225 °C (437 °F)
XC2S100E-6FTGG256I	Xilinx	FPGA		B	256	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz				17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.