FBGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2S100E-7FGG676C	Xilinx	FPGA		B	676	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz				27 mm
XA6SLX9-3CSG225I	Xilinx	FPGA		Ball	225	FBGA	Square	Plastic/Epoxy	9152	Yes				AEC-Q100	160			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B225	3			No		e1	62.5 MHz	30 s	160	260 °C (500 °F)
XC4VLX15-10SFG363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS		240			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No		e1	1028 MHz	30 s	240	260 °C (500 °F)
XC6SLX150-3NCSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz				19 mm
XC6SLX45T-2CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS		296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	296	225 °C (437 °F)
XC6SLX150-1LCSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	500 MHz				19 mm
XA6SLX75-2CS484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			328		1.23		Grid Array, Fine Pitch	BGA484,22X22,32		1.2 V	.8 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			328		19 mm
XA6SLX16-2CSG324Q	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic/Epoxy	14579	Yes				AEC-Q100	232			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	232	260 °C (500 °F)
XC7A200T-2SBV484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.05 V	16825					1		Grid Array, Fine Pitch			.95 V	.8 mm		1.05 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	19 mm			e1					19 mm
XC4VLX25-12SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy		Yes	1.26 V	2688	CMOS				1.2		Grid Array, Fine Pitch			1.14 V	.8 mm			2688 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0		30 s		225 °C (437 °F)	17 mm
XA6SLX9-3CSG324Q	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic/Epoxy	9152	Yes				AEC-Q100	200			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	200	260 °C (500 °F)
XC6SLX75T-2CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		290		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	290	260 °C (500 °F)	19 mm
XA6SLX25-2CSG324Q	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic/Epoxy	24051	Yes				AEC-Q100	226			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	226	260 °C (500 °F)
XC6SLX150-1LCSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	500 MHz				19 mm
XC6SLX100-3CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes			CMOS		338			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	338	225 °C (437 °F)
XCKU5P-2SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120			304		0.85		Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm			e1		30 s	304	250 °C (482 °F)	23 mm
XC6SLX100T-4CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes			CMOS		296			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	296	260 °C (500 °F)	19 mm
XA6SLX45T-2CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS	AEC-Q100	296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	667 MHz		296
XC6SLX75-N3CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		328		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz	30 s	328	260 °C (500 °F)	19 mm
XC4VFX12-11SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS		240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1181 MHz	30 s	240	225 °C (437 °F)	17 mm
XC6SLX75-1LCS484C	Xilinx	FPGA	Commercial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831			328		1		Grid Array, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	70 °C (158 °F)	0.46 ns	5831 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			328		19 mm
XC4VLX15-11SFG363IS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS		240			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No		e1	1205 MHz	30 s	240	260 °C (500 °F)
XC6SLX45-N3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	43661	Yes			CMOS		320			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	806 MHz	30 s	320	225 °C (437 °F)
XC6SLX100-3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes			CMOS		338			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	338	225 °C (437 °F)
XA6SLX9-2CSG225I	Xilinx	FPGA		Ball	225	FBGA	Square	Plastic/Epoxy	9152	Yes				AEC-Q100	160			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B225	3			No		e1	62.5 MHz	30 s	160	260 °C (500 °F)
XC6SLX75T-2CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	667 MHz	30 s	292	225 °C (437 °F)
XA6SLX75-3CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS	AEC-Q100	328			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	862 MHz		328
XC6SLX75T-3NCSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz				19 mm
XC7A200T-L1SBG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825			285		.95		Grid Array, Fine Pitch			.92 V	.8 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm			e1		30 s	285	250 °C (482 °F)	19 mm
XC2S50E-6FGG676C	Xilinx	FPGA		B	676	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz				27 mm
XC4VLX15-11SF363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS		240			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B363	4			No		e0	1205 MHz	30 s	240	225 °C (437 °F)
XC7A8-1CSG324C	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	8000	Yes	1.05 V		CMOS		200		1	1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.27 ns		0 °C (32 °F)		Bottom	S-PBGA-B324			15 mm	No			1098 MHz		200		15 mm
XC7Z030-L1SBG485I	Xilinx	FPGA SOC		Ball	485	FBGA	Square	Plastic/Epoxy	125000	Yes	1.05 V	9825			280	1900000	1		Grid Array, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	9825 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B485	4	2.44 mm	19 mm			e1		30 s	280	250 °C (482 °F)	19 mm
XC4VLX25-12SFG363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes			CMOS		240			1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No		e1	1205 MHz	30 s	240	260 °C (500 °F)
XC6SLX45T-3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS		296			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	296	225 °C (437 °F)
XS2S30-5-CS144I	Xilinx	FPGA		Ball	144	FBGA	Square	Plastic/Epoxy	972	Yes			CMOS		132			1.5/3.3,2.5 V	Grid Array, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays		.8 mm	100 °C (212 °F)	0.7 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3		12 mm	No		e0		30 s	132	240 °C (464 °F)	12 mm
XCKU085-1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						676		23 mm
XCKU085-2SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						676		23 mm
XCKU115-3SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920			832		1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						832		23 mm
XCKU025-3SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180			312		1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						312		23 mm
XCKU085-1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						676		23 mm
XCKU060-3SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460			624		1		Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						624		23 mm
XCKU035-L1SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391			520		0.9		Grid Array, Fine Pitch	BGA784,28X28,32		.88 V	.8 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm		Also Operates at 0.95 V nominal supply				520		23 mm
XCKU040-2SFVA784C	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300			520		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	85 °C (185 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						520		23 mm
XCKU115-1SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920			832		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						832		23 mm
XCKU025-2SFVA784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180			312		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						312		23 mm
XCKU025-2SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180			312		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						312		23 mm
XCKU095-1SFVA784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95		Grid Array, Fine Pitch	BGA784,28X28,32		.922 V	.8 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.52 mm	23 mm						702		23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.