FBGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4VLX15-10SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS		240		1.2			Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1536 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX15-10SFG363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS		240		1.2			Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1536 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e1	1028 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VLX25-11SFG363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		240		1.2			Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			2688 CLBS		Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e1	1205 MHz	30 s	240	260 °C (500 °F)	17 mm
XC6SLX100-2CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		320		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	320	260 °C (500 °F)	19 mm
XC6SLX45T-3CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		290		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	3411 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	862 MHz	30 s	290	260 °C (500 °F)	19 mm
XCKU3P-2SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340			304		0.85			Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm			e1		30 s	304	250 °C (482 °F)	23 mm
XCKU5P-1SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120			304		0.85			Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm			e1		30 s	304	250 °C (482 °F)	23 mm
XCKU5P-2SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120			304		0.85			Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm			e1		30 s	304	250 °C (482 °F)	23 mm
XCKU5P-L1SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120			304		.72			Grid Array, Fine Pitch	BGA784,28X28,32		.698 V	.8 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		It also Operates at 0.85 V	e1		30 s	304	250 °C (482 °F)	23 mm
XQ7A200T-1RS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	HKMG		285		1		1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484		3.19 mm	19 mm	No		e0	1098 MHz		285		19 mm
M2S150-FCV484I	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	146124	Yes	1.26 V		CMOS		273		1.2	Tray	1.2 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B484		3.15 mm	19 mm	No	LG-MIN, WD-MIN	e0		30 s	273	240 °C (464 °F)	19 mm
XA6SLX45T-3CSG324Q	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic/Epoxy	43661	Yes				AEC-Q100	190				1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	190	260 °C (500 °F)
XC4VLX25-11SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		240		1.2			Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			2688 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX15-11SFG363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS		240		1.2			Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1536 CLBS		Tin Silver Copper	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e1	1205 MHz	30 s	240	260 °C (500 °F)	17 mm
XC4VLX25-10SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		240		1.2			Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XC6SLX75-L1CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831	CMOS		328		1		1,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	0.46 ns	5831 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	328	260 °C (500 °F)	19 mm
XC7A30T-2CSG324C	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	33600	Yes	1.05 V		CMOS		210		1		1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns		0 °C (32 °F)		Bottom	S-PBGA-B324			15 mm	No			1286 MHz		210		15 mm
XC4VLX25-10SFG363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes			CMOS		240				1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No		e1	1028 MHz	30 s	240	260 °C (500 °F)
XQ6SLX75T-3CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292				1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	862 MHz		292
XC4VFX12-11SFG363CS1	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes			CMOS		240				1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B363	4			No		e1	1181 MHz	30 s	240	260 °C (500 °F)
XA6SLX45T-3CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS	AEC-Q100	296				1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	296	225 °C (437 °F)
XQ7A50T-L1CS325I	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic	52160	Yes	.98 V	4075	HKMG		150		.95		0.95 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.92 V	.8 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B324	3		15 mm	No		e0	1098 MHz		150		15 mm
XQKU5P-2SFRB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		MIL-PRF-38535	304		0.85			Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B784	4	3.52 mm	23 mm			e0		20 s	304	225 °C (437 °F)	23 mm
XA6SLX16-3CSG225Q	Xilinx	FPGA		Ball	225	FBGA	Square	Plastic/Epoxy	14579	Yes				AEC-Q100	160				1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B225	3			No		e1	62.5 MHz	30 s	160	260 °C (500 °F)
XC4VLX15-11SF363I	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS		240		1.2			Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm			1536 CLBS		Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm
XC6SLX75-1LCS484C	Xilinx	FPGA	Commercial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831			328		1			Grid Array, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	70 °C (158 °F)	0.46 ns	5831 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			328		19 mm
XC4VLX15-11SFG363IS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS		240				1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No		e1	1205 MHz	30 s	240	260 °C (500 °F)
XC6SLX45-N3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic	43661	Yes			CMOS		320				1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	806 MHz	30 s	320	225 °C (437 °F)
XA6SLX9-3CSG324Q	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic/Epoxy	9152	Yes				AEC-Q100	200				1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	200	260 °C (500 °F)
XC6SLX75T-2CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		290		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	290	260 °C (500 °F)	19 mm
XA6SLX25-2CSG324Q	Xilinx	FPGA		Ball	324	FBGA	Square	Plastic/Epoxy	24051	Yes				AEC-Q100	226				1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B324	3			No		e1	62.5 MHz	30 s	226	260 °C (500 °F)
XC6SLX150-1LCSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	500 MHz				19 mm
XC6SLX100-3CS484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes			CMOS		338				1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	338	225 °C (437 °F)
XCKU5P-2SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120			304		0.85			Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm			e1		30 s	304	250 °C (482 °F)	23 mm
XC6SLX100T-4CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes			CMOS		296				1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	296	260 °C (500 °F)	19 mm
XA6SLX45T-2CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS	AEC-Q100	296				1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	667 MHz		296
XC6SLX75-N3CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		328		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz	30 s	328	260 °C (500 °F)	19 mm
XC4VFX12-11SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS		240		1.2			Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1181 MHz	30 s	240	225 °C (437 °F)	17 mm
XQ6SLX75-2CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		328				1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	667 MHz		328	260 °C (500 °F)
XC2S100E-6FGG676I	Xilinx	FPGA		B	676	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8			Grid Array, Fine Pitch			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz				27 mm
XC6SLX45T-4CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS		296				1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	296	260 °C (500 °F)	19 mm
XC6SLX75T-4CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292				1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	292	260 °C (500 °F)	19 mm
XC4VLX15-11SFG363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS		240				1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B363	4			No		e1	1205 MHz	30 s	240	260 °C (500 °F)
XQ6SLX75T-2CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292				1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	667 MHz		292
XA6SLX75-3CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			328		1.2			Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	125 °C (257 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			328		19 mm
XC4VLX15-10SF363CS2	Xilinx	FPGA		Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes			CMOS		240				1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B363	4			No		e0	1028 MHz	30 s	240	225 °C (437 °F)
XC6SLX75T-3CS484C	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes			CMOS		292				1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Lead	Bottom	S-PBGA-B484	3			No		e0	862 MHz	30 s	292	225 °C (437 °F)
XC4VLX25-11SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		240		1.2			Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.