Xilinx - XS2S30-5-CS144C

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XS2S30-5-CS144C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XS2S30-5-CS144C
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: FBGA; Package Shape: SQUARE; Qualification: Not Qualified;
Datasheet XS2S30-5-CS144C Datasheet
In Stock73
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.7 ns
No. of Inputs: 132
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 132
Position Of Terminal: Bottom
No. of Terminals: 144
Package Style (Meter): Grid Array, Fine Pitch
JESD-30 Code: S-PBGA-B144
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: FBGA
Width: 12 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Technology Used: CMOS
No. of Logic Cells: 972
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA144,13X13,32
Finishing Of Terminal Used: Tin Lead
Length: 12 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 240 °C (464 °F)
Power Supplies (V): 1.5/3.3,2.5 V
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