Xilinx - XA3SD3400A-4CSG484I

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XA3SD3400A-4CSG484I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XA3SD3400A-4CSG484I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 1.8 mm;
Datasheet XA3SD3400A-4CSG484I Datasheet
In Stock243
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Organization: 5968 CLBS, 53712 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.8 mm
No. of Inputs: 309
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 249
Position Of Terminal: Bottom
No. of Terminals: 484
No. of Equivalent Gates: 53712
Package Style (Meter): Grid Array, Fine Pitch
Screening Level: AEC-Q100
JESD-30 Code: S-PBGA-B484
Maximum Clock Frequency: 667 MHz
Package Shape: Square
Package Code: FBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Technology Used: CMOS
No. of Logic Cells: 53712
No. of CLBs: 5968
JESD-609 Code: e1
Qualification: No
Package Equivalence Code: BGA484,22X22,32
Finishing Of Terminal Used: Tin Silver Copper
Length: 19 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2,1.2/3.3,2.5/3.3 V
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