Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
FPGA |
Military |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
MIL-STD-883 |
104 |
4000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
684 CLBS, 4000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P133 |
4.27 mm |
34.544 mm |
No |
55 MHz |
104 |
34.544 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
144 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
11000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
11000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P144 |
No |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
38535Q/M;38534H;883B |
104 |
8000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
5.2 ns |
684 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P132 |
4.318 mm |
34.544 mm |
No |
63 MHz |
104 |
34.544 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
547 |
No |
CMOS |
69 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
S-XPGA-P84 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
68 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
4000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
4000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P68 |
No |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
68 |
PGA |
Ceramic |
295 |
No |
CMOS |
38535Q/M;38534H;883B |
57 |
5 |
5 V |
Grid Array |
PGA68(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
No |
57 |
|||||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
104 |
4000 |
5 |
5 V |
Grid Array |
PGA133M,13X13 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
15 ns |
684 CLBS, 4000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P133 |
4.27 mm |
34.544 mm |
No |
MAX 92 I/OS; 565 flip-flops |
55 MHz |
104 |
34.544 mm |
||||||||||
Texas Instruments |
FPGA |
Industrial |
Pin/Peg |
100 |
PGA |
Square |
Ceramic |
451 |
No |
CMOS |
83 |
5 |
5 V |
Grid Array |
PGA100(UNSPEC) |
Field Programmable Gate Arrays |
85 °C (185 °F) |
-40 °C (-40 °F) |
Perpendicular |
S-XPGA-P100 |
No |
66 MHz |
83 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
177 |
PGA |
Square |
Ceramic |
1232 |
No |
CMOS |
140 |
5 |
5 V |
Grid Array |
HPGA177,15X15 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Perpendicular |
S-XPGA-P177 |
No |
39 MHz |
140 |
||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
547 |
CMOS |
1200 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4.7 ns |
547 CLBS, 1200 Gates |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
e0 |
44 MHz |
30 s |
225 °C (437 °F) |
27.94 mm |
|||||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
68 |
PGA |
Ceramic |
295 |
No |
CMOS |
57 |
5 |
5 V |
Grid Array |
PGA68(UNSPEC) |
Field Programmable Gate Arrays |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
No |
57 |
||||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
547 |
No |
5.5 V |
547 |
CMOS |
69 |
2000 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
19.332 ns |
547 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
5.21 mm |
27.94 mm |
No |
MAX 69 I/OS; 273 flip-flops |
69 |
27.94 mm |
|||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
547 |
No |
5.5 V |
547 |
CMOS |
38535Q/M;38534H;883B |
69 |
2000 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
19.332 ns |
547 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
5.21 mm |
27.94 mm |
No |
MAX 69 I/OS; 273 flip-flops |
69 |
27.94 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
684 |
No |
5.5 V |
684 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
6.1 ns |
684 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P132 |
4.318 mm |
34.544 mm |
No |
e0 |
54 MHz |
30 s |
225 °C (437 °F) |
34.544 mm |
||||||||||||
Texas Instruments |
FPGA |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
547 |
No |
CMOS |
69 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
69 |
|||||||||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Pin/Peg |
299 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
1024 |
No |
5.5 V |
1024 |
CMOS |
256 |
20000 |
5 |
5 V |
Grid Array |
PGA299,20X20 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4.5 ns |
1024 CLBS, 20000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P299 |
4.2418 mm |
52.324 mm |
No |
2560 flip-flops; typical gates = 20000-25000 |
133.3 MHz |
256 |
52.324 mm |
|||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
100 |
CMOS |
3000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
100 CLBS, 3000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C |
50 MHz |
27.94 mm |
|||||||||||||||||
Xilinx |
FPGA |
Industrial |
Pin/Peg |
132 |
PGA |
Square |
Plastic/Epoxy |
144 |
No |
CMOS |
96 |
5 |
5 V |
Grid Array |
PGA132,14X14 |
Field Programmable Gate Arrays |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Perpendicular |
S-PPGA-P132 |
No |
96 |
|||||||||||||||||||||
|
Xilinx |
FPGA |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
224 |
No |
5.5 V |
224 |
CMOS |
110 |
3500 |
5 |
5 V |
Grid Array |
PGA132,14X14 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
4.1 ns |
224 CLBS, 3500 Gates |
Perpendicular |
S-CPGA-P132 |
4.318 mm |
37.084 mm |
No |
Typical gates = 3500-4500 |
188 MHz |
110 |
37.084 mm |
||||||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
191 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
400 |
CMOS |
8000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
400 CLBS, 8000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P191 |
4.064 mm |
47.244 mm |
No |
1120 flip-flops; typical gates = 8000-10000 |
47.244 mm |
||||||||||||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
MIL-STD-883 |
Grid Array |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P84 |
5.207 mm |
27.94 mm |
No |
e4 |
27.94 mm |
|||||||||||||||||||||||
Xilinx |
FPGA |
Industrial |
Pin/Peg |
132 |
PGA |
Square |
Plastic/Epoxy |
224 |
No |
5.5 V |
224 |
CMOS |
110 |
3500 |
5 |
5 V |
Grid Array |
PGA132,14X14 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
7 ns |
224 CLBS, 3500 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-PPGA-P132 |
1 |
3.7338 mm |
37.084 mm |
No |
688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA |
100 MHz |
110 |
37.084 mm |
|||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
191 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
400 |
No |
5.5 V |
400 |
CMOS |
160 |
7000 |
5 |
5 V |
Grid Array |
PGA191M,18X18 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
125 °C (257 °F) |
2.7 ns |
400 CLBS, 7000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P191 |
4.318 mm |
47.244 mm |
No |
Typical gates = 7000-20000 |
111 MHz |
160 |
47.244 mm |
||||||||||
Xilinx |
FPGA |
Pin/Peg |
299 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
CMOS |
3.3 |
Grid Array |
2.54 mm |
Matte Tin |
Perpendicular |
S-CPGA-P299 |
4.318 mm |
52.324 mm |
No |
e3 |
52.324 mm |
|||||||||||||||||||||||||
|
Xilinx |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
144 |
No |
144 |
CMOS |
74 |
2000 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
4.1 ns |
144 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
5.207 mm |
27.94 mm |
No |
Typical gates = 2000-3000 |
188 MHz |
74 |
27.94 mm |
|||||||||||
Xilinx |
FPGA |
Commercial |
Pin/Peg |
175 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.25 V |
320 |
CMOS |
9000 |
5 |
Grid Array |
4.75 V |
2.54 mm |
70 °C (158 °F) |
9 ns |
320 CLBS, 9000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P175 |
3.5052 mm |
42.164 mm |
No |
MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C |
70 MHz |
42.164 mm |
||||||||||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.25 V |
144 |
CMOS |
2000 |
5 |
Grid Array |
4.75 V |
2.54 mm |
85 °C (185 °F) |
7 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Matte Tin |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
480 flip-flops; typical gates = 2000-3000 |
e3 |
100 MHz |
27.94 mm |
||||||||||||||
|
Xilinx |
FPGA |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
100 |
No |
5.5 V |
100 |
CMOS |
74 |
1500 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
3.3 ns |
100 CLBS, 1500 Gates |
Perpendicular |
S-CPGA-P84 |
5.207 mm |
27.94 mm |
No |
Typical gates = 1500-2000 |
227 MHz |
74 |
27.94 mm |
||||||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.25 V |
144 |
CMOS |
2000 |
5 |
Grid Array |
4.75 V |
2.54 mm |
85 °C (185 °F) |
5.5 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Matte Tin |
Perpendicular |
S-CPGA-P132 |
3.9116 mm |
37.084 mm |
No |
480 flip-flops; typical gates = 2000-3000 |
e3 |
125 MHz |
37.084 mm |
||||||||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
144 |
No |
CMOS |
MIL-STD-883 |
96 |
5 |
5 V |
Grid Array |
PGA132,14X14 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P132 |
4.318 mm |
37.084 mm |
No |
e4 |
230 MHz |
96 |
37.084 mm |
||||||||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
223 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
784 |
CMOS |
13000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
784 CLBS, 13000 Gates |
-55 °C (-67 °F) |
Matte Tin |
Perpendicular |
S-CPGA-P223 |
4.318 mm |
47.244 mm |
No |
e3 |
111 MHz |
47.244 mm |
||||||||||||||||
Xilinx |
FPGA |
Commercial |
Pin/Peg |
175 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.25 V |
320 |
CMOS |
9000 |
5 |
Grid Array |
4.75 V |
2.54 mm |
70 °C (158 °F) |
5.5 ns |
320 CLBS, 9000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P175 |
3.5052 mm |
42.164 mm |
No |
MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C |
125 MHz |
42.164 mm |
||||||||||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
132 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
144 |
No |
CMOS |
MIL-STD-883 |
96 |
5 |
5 V |
Grid Array |
PGA132,14X14 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
9 ns |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P132 |
4.318 mm |
37.084 mm |
No |
e4 |
70 MHz |
96 |
37.084 mm |
|||||||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
223 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
576 |
CMOS |
10000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
576 CLBS, 10000 Gates |
-55 °C (-67 °F) |
Matte Tin |
Perpendicular |
S-CPGA-P223 |
4.318 mm |
47.244 mm |
No |
e3 |
125 MHz |
47.244 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
100 |
No |
5.5 V |
100 |
CMOS |
74 |
1000 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
10 ns |
100 CLBS, 1000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
174 flip-flops; typical gates = 1000-1500 |
70 MHz |
74 |
27.94 mm |
|||||||||
|
Xilinx |
FPGA |
Pin/Peg |
299 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
484 |
15000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
5.6 ns |
484 CLBS, 15000 Gates |
Matte Tin |
Perpendicular |
S-CPGA-P299 |
4.2418 mm |
52.324 mm |
No |
23000 Logic gates can also be used |
e3 |
36 MHz |
52.324 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
100 |
No |
5.5 V |
100 |
CMOS |
74 |
2000 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4.1 ns |
100 CLBS, 2000 Gates |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700 |
190 MHz |
74 |
27.94 mm |
|||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
191 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
400 |
7000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
125 °C (257 °F) |
2.7 ns |
400 CLBS, 7000 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P191 |
5.207 mm |
47.244 mm |
Max usable 20000 Logic gates |
111 MHz |
47.244 mm |
||||||||||||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
223 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
1024 |
No |
5.25 V |
1024 |
CMOS |
256 |
20000 |
5 |
5 V |
Grid Array |
PGA223,18X18 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
4 ns |
1024 CLBS, 20000 Gates |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P223 |
1 |
4.064 mm |
47.244 mm |
No |
2560 flip-flops; typical gates = 20000-25000 |
e0 |
133.3 MHz |
256 |
47.244 mm |
|||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
MIL-STD-883 |
1800 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
1800 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
No |
|||||||||||||||||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
144 |
No |
144 |
CMOS |
MIL-STD-883 |
74 |
4200 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Field Programmable Gate Arrays |
2.54 mm |
125 °C (257 °F) |
14 ns |
144 CLBS, 4200 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P84 |
5.207 mm |
27.94 mm |
No |
e4 |
50 MHz |
74 |
27.94 mm |
||||||||||
Xilinx |
FPGA |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
144 |
CMOS |
2000 |
5 |
Grid Array |
4.5 V |
2.54 mm |
9 ns |
144 CLBS, 2000 Gates |
Matte Tin |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
480 flip-flops; typical gates = 2000-3000 |
e3 |
70 MHz |
27.94 mm |
|||||||||||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
120 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
CMOS |
MIL-STD-883 |
5 |
Grid Array |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Perpendicular |
S-CPGA-P120 |
4.318 mm |
34.544 mm |
No |
e4 |
34.544 mm |
|||||||||||||||||||||
Xilinx |
FPGA |
Other |
Pin/Peg |
223 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
1024 |
No |
5.25 V |
1024 |
CMOS |
256 |
20000 |
5 |
5 V |
Grid Array |
PGA223,18X18 |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
6 ns |
1024 CLBS, 20000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P223 |
1 |
4.064 mm |
47.244 mm |
No |
2560 flip-flops; typical gates = 20000-25000 |
90.9 MHz |
256 |
47.244 mm |
|||||||||
|
Xilinx |
FPGA |
Commercial |
Pin/Peg |
132 |
PGA |
Square |
Ceramic |
144 |
No |
CMOS |
96 |
5 |
5 V |
Grid Array |
PGA132,14X14 |
Field Programmable Gate Arrays |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P132 |
No |
325 MHz |
96 |
|||||||||||||||||||
Xilinx |
FPGA |
Pin/Peg |
156 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
CMOS |
5 |
Grid Array |
2.54 mm |
Perpendicular |
S-CPGA-P156 |
4.318 mm |
42.164 mm |
No |
42.164 mm |
|||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Pin/Peg |
175 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
320 |
No |
5.25 V |
320 |
CMOS |
144 |
5000 |
5 |
5 V |
Grid Array |
PGA176,16X16MOD |
Field Programmable Gate Arrays |
4.75 V |
2.54 mm |
85 °C (185 °F) |
7 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P175 |
3.81 mm |
42.164 mm |
No |
928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA |
100 MHz |
144 |
42.164 mm |
|||||||||
Xilinx |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
100 |
CMOS |
1500 |
5 |
Grid Array |
2.54 mm |
125 °C (257 °F) |
9 ns |
100 CLBS, 1500 Gates |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
4.318 mm |
27.94 mm |
No |
360 flip-flops; typical gates = 1500-2000 |
70 MHz |
27.94 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.