QCCJ Field Programmable Gate Arrays (FPGA) 963

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4010E-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS	160	7000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.7 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e0	111 MHz	30 s	160	225 °C (437 °F)	29.3116 mm
XC5406-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3030-50PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	34	3000	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	2.35 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops	e0	50 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC2064-100PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	34	600	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	8 ns	64 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	122 flip-flops; typical gates = 600-1000	e0	100 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3120-09PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm		1.5 ns	64 CLBS, 1000 Gates			Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Typical gates = 1000-1500		370 MHz				29.3116 mm
XC3195A-3PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	484	CMOS		6500	5		Chip Carrier			4.5 V	1.27 mm		2.7 ns	484 CLBS, 6500 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 7500 Logic gates	e3	270 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3020-70PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	9 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	70 MHz		58		24.2316 mm
XC3120A-2PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	2.2 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Max usable 1500 Logic gates	e0	323 MHz		58		24.2316 mm
XC5210-5PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	324	CMOS		10000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	4.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 16000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3020-125PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	256 flip-flops; typical gates = 1000-1500		125 MHz				29.3116 mm
XC3390L-8PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC4006E-2PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	256	Yes	5.5 V	256	CMOS	128	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		1.6 ns	256 CLBS, 4000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 6000 Logic gates	e0	125 MHz	30 s	128	225 °C (437 °F)	29.3116 mm
XC4010XL-09CPC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	950	Yes	3.6 V	400	CMOS	61	7000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e0	217 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC4305-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3120-3PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	2.7 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Typical gates = 1000-1500		270 MHz		58		24.2316 mm
XC5206-6PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	784	Yes	5.5 V	196	CMOS	65	6000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		5.6 ns	196 CLBS, 6000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 10000 Logic gates	e0	83 MHz	30 s	65	225 °C (437 °F)	29.3116 mm
XC4005XL-2PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS		3000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	1.5 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e3	179 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC2018-100PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1000	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	8 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	174 flip-flops; typical gates = 1000-1500	e0	100 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3130A-2PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	2.2 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 2000 Logic gates	e3	323 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3090-100PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	70	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	100 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC4008-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	770	Yes	5.25 V	324	CMOS	61	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4 ns	324 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	936 flip-flops; typical gates = 6500-8000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC4008E-4PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	324	CMOS		6000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	2.7 ns	324 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 8000 Logic gates	e3	111 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4002XL-1PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	3.6 V	64	CMOS	64	1000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm		1.3 ns	64 CLBS, 1000 Gates		Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 1600 Logic gates	e0	200 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3142-4PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	74	3000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	144 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	230 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC5210-4PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	324	CMOS		10000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3.8 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 16000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3142A-1PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.75 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 3000 Logic gates	e3	323 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4008-5PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	770	Yes	5.5 V	324	CMOS	61	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.5 ns	324 CLBS, 6500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	936 flip-flops; typical gates = 6500-8000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC3030-50PC68ISPC0104	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		3000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				24.2316 mm
XC3030-50PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	3000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68	1	4.699 mm	24.2316 mm	No	MAX 58 I/OS; 360 flip-flops		50 MHz		58		24.2316 mm
XC3020A-6PCG68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		5.08 mm	24.2316 mm		Max usable 1500 Logic gates		135 MHz				24.2316 mm
XC3020A-7PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	5.1 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 1500 Logic gates	e0	113 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3042-70PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	70 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3020A-3PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68				No		e0	270 MHz		58
XC2018-130PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	100 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	174 flip-flops; typical gates = 1000-1500		130 MHz		58		24.2316 mm
XC3142A-2PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	144	CMOS		2000	5		Chip Carrier			4.5 V	1.27 mm		2.2 ns	144 CLBS, 2000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 3000 Logic gates	e3	323 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC2064-130PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	600	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	64 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	122 flip-flops; typical gates = 600-1000	e0	130 MHz		58		24.2316 mm
XC4005A-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	616 flip-flops; typical gates = 4000-5000	e0	133.3 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC5202L-3PCG84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	64	CMOS		2000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 2000-3000	e3					29.3116 mm
XC4002XL-2PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	3.6 V	64	CMOS	64	1000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm		1.5 ns	64 CLBS, 1000 Gates		Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 1600 Logic gates	e0	179 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC5206L-3PCG84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS		6000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 6000-10000	e3					29.3116 mm
XC3064-70PC84ISPC0107	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	224	CMOS		3500	5		Chip Carrier			4.5 V	1.27 mm		9 ns	224 CLBS, 3500 Gates		Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	688 flip-flops; typical gates = 3500-4500	e0	70 MHz				29.3116 mm
XC5410L-4PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes						3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3090-100PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		5000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	928 flip-flops; typical gates = 5000-6000		100 MHz				29.3116 mm
XC4002A-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1600	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	64 CLBS, 1600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	256 flip-flops; typical gates = 1600-2000	e0	133.3 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC5402L-4PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes						3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3142L-2PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	3.6 V	144	CMOS	74	2000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	70 °C (158 °F)	2.2 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 2000-3000	e0	325 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3190A-09PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	70	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.5 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 6000 Logic gates	e0	370 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3130A-4PC44I	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		3.3 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	227 MHz	30 s	34	225 °C (437 °F)	16.5862 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.