QCCJ Field Programmable Gate Arrays (FPGA) 963

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3030A-6PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	135 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3020A-6PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 1500 Logic gates	e3	135 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3030-70PC84ISPC0107	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		1500	5		Chip Carrier			4.5 V	1.27 mm		9 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 1500-2000	e0	70 MHz				29.3116 mm
XC3030-125PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 1500-2000		125 MHz				29.3116 mm
XC8100-3PC44C	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	192	CMOS		600	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		192 CLBS, 600 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No	96 flip-flops; 3.3 V operation; OTP based						16.5862 mm
XC4006E-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	256	Yes	5.5 V	256	CMOS	128	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2 ns	256 CLBS, 4000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 6000 Logic gates	e0	125 MHz	30 s	128	225 °C (437 °F)	29.3116 mm
XC3120A-09PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.5 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 1500 Logic gates	e0	370 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3030-70PC44ISPC0107	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		1500	5		Chip Carrier			4.5 V	1.27 mm		9 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	360 flip-flops; typical gates = 1500-2000	e0	70 MHz				16.5862 mm
XC5204-6PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	120	Yes	5.25 V	120	CMOS	124	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.6 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 6000 Logic gates	e0	83 MHz	30 s	124	225 °C (437 °F)	29.3116 mm
XC4002XL-09CPGC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	64	CMOS		1000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Max usable 1600 Logic gates	e3	217 MHz				29.3116 mm
XC4010XL-09PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	400	Yes			CMOS	160		3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm					Tin Lead	Quad	S-PQCC-J84	3			No		e0	217 MHz	30 s	160	225 °C (437 °F)
XC3130A-2PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		1500	5		Chip Carrier			4.5 V	1.27 mm		2.2 ns	100 CLBS, 1500 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 2000 Logic gates	e3	323 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3030-100PC44CSPC0107	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	360 flip-flops; typical gates = 1500-2000		100 MHz				16.5862 mm
XC5202-5PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	4.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4005A-6PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	6 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	616 flip-flops; typical gates = 4000-5000	e0	90.9 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
5962-01-415-6542	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	74		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J84				No			100 MHz		74
XC4005-6PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.5 V	196	CMOS	112	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	6 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	616 flip-flops; typical gates = 4000-5000	e0	90.9 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC3030-100PC44CSPC0104	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	7 ns	100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		100 MHz				16.5862 mm
XC3042-70PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 2000-3000	e0	70 MHz				29.3116 mm
XC2064-100PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	600	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7.5 ns	64 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	122 flip-flops; typical gates = 600-1000	e0	100 MHz		58		24.2316 mm
XC6209-2PCG84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	2304	Yes	5.25 V	2304	CMOS		9000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3 ns	2304 CLBS, 9000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	2304 flip-flops; typical gates = 9000-13000	e3	111 MHz				29.3116 mm
XC3342A-3PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3330A-6PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3120-5PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.1 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 1000-1500	e0	188 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC4010XL-2PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS		7000	3.3		Chip Carrier			3 V	1.27 mm		1.5 ns	400 CLBS, 7000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e3	179 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3190-5PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	70	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	4.1 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500	e0	190 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3330A-3PC68C	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No							24.2316 mm
XC4006E-2PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	256	CMOS		4000	5		Chip Carrier			4.5 V	1.27 mm		1.6 ns	256 CLBS, 4000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 6000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3030-70PC84ISPC0104	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		3000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				29.3116 mm
XC3020-125PC84CSPC0110	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		125 MHz				29.3116 mm
XC5204-4PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	120	CMOS		4000	5		Chip Carrier			4.5 V	1.27 mm		3.8 ns	120 CLBS, 4000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 4000-6000	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3120A-09PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes			CMOS	64		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm					Tin Lead	Quad	S-PQCC-J84	3			No		e0	370 MHz	30 s	64	225 °C (437 °F)
XC4010XL-2PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS	160	7000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm		1.5 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e0	179 MHz	30 s	160	225 °C (437 °F)	29.3116 mm
XC3130-5PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	34	2000	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	190 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3120-4PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 1000-1500	e0	227 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC4005E-2PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.5 V	196	CMOS	112	3000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		1.6 ns	196 CLBS, 3000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e0	125 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC3120A-09PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.5 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Max usable 1500 Logic gates	e0	370 MHz		58		24.2316 mm
XC3342-100PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes			CMOS	74		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	100 MHz	30 s	74	225 °C (437 °F)
XC3130A-09PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.5 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	370 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC5402-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC4010XL-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS		7000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	1.6 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC5202-3PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS		2000	5		Chip Carrier			4.5 V	1.27 mm		3 ns	64 CLBS, 2000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 2000-3000	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3130A-2PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.2 ns	100 CLBS, 1500 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 2000 Logic gates	e0	323 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3330A-6PC44C	Xilinx	FPGA		J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No							16.5862 mm
XC5204-6PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	120	Yes	5.5 V	120	CMOS	124	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		5.6 ns	120 CLBS, 4000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 6000 Logic gates	e0	83 MHz	30 s	124	225 °C (437 °F)	29.3116 mm
XC3030-125PC44CSPC0104	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		125 MHz				16.5862 mm
XC4406-3PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC2018-100PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	74	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7.5 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	174 flip-flops; typical gates = 1000-1500	e0	100 MHz	30 s	74	225 °C (437 °F)	29.3116 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.