Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
400 |
Yes |
CMOS |
160 |
3.3 |
3.3 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
.635 mm |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
No |
e0 |
217 MHz |
30 s |
160 |
225 °C (437 °F) |
||||||||||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
576 |
Yes |
5.5 V |
576 |
CMOS |
192 |
10000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
85 °C (185 °F) |
6 ns |
576 CLBS, 10000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
3.92 mm |
28 mm |
No |
1536 flip-flops; typical gates = 10000-13000 |
e0 |
90.9 MHz |
30 s |
192 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
64 |
1600 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
6 ns |
64 CLBS, 1600 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
2.87 mm |
14 mm |
No |
256 flip-flops; typical gates = 1600-2000 |
e0 |
90.9 MHz |
30 s |
64 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
6000 |
3.3 |
Flatpack |
3 V |
.65 mm |
85 °C (185 °F) |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Typical gates = 6000-10000 |
e0 |
28 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
576 |
CMOS |
10000 |
5 |
Flatpack |
4.5 V |
.65 mm |
2.7 ns |
576 CLBS, 10000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 13000 Logic gates |
e3 |
111 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
64 |
Yes |
CMOS |
64 |
3.3 |
3.3 V |
Flatpack |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
.5 mm |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
No |
e0 |
217 MHz |
30 s |
64 |
240 °C (464 °F) |
||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
CMOS |
10000 |
3.3 |
Flatpack |
3 V |
.65 mm |
85 °C (185 °F) |
1.6 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 13000 Logic gates |
e3 |
166 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
CMOS |
64 |
3.3 |
3.3 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
.635 mm |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
No |
e0 |
217 MHz |
30 s |
64 |
225 °C (437 °F) |
||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
120 |
CMOS |
4000 |
5 |
Flatpack |
4.5 V |
.65 mm |
3 ns |
120 CLBS, 4000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Typical gates = 4000-6000 |
e3 |
83 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
2700 |
Yes |
1.89 V |
CMOS |
202 |
1.8 |
1.8,2.5,3.3 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
100 °C (212 °F) |
0.47 ns |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
20 mm |
No |
e0 |
357 MHz |
30 s |
202 |
225 °C (437 °F) |
20 mm |
||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
144 |
Yes |
CMOS |
82 |
5 |
5 V |
Flatpack |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
No |
e0 |
30 s |
82 |
225 °C (437 °F) |
||||||||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
144 |
Yes |
CMOS |
82 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
.635 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
No |
e0 |
325 MHz |
30 s |
82 |
225 °C (437 °F) |
|||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack |
.65 mm |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
20 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
80 |
1500 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
2.7 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 2000 Logic gates |
e0 |
270 MHz |
30 s |
80 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
80 |
2000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
1.6 ns |
100 CLBS, 2000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 3000 Logic gates |
e0 |
125 MHz |
30 s |
80 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
320 |
Yes |
CMOS |
138 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
.635 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
No |
e0 |
30 s |
138 |
225 °C (437 °F) |
||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
576 |
CMOS |
10000 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
1.3 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 13000 Logic gates |
e3 |
166 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
3 V |
.65 mm |
85 °C (185 °F) |
1 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Can also use 40000 gates |
e0 |
263 MHz |
30 s |
224 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.25 V |
320 |
CMOS |
138 |
5000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
3.3 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 6000 Logic gates |
e0 |
227 MHz |
30 s |
138 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
144 |
Yes |
CMOS |
82 |
5 |
5 V |
Flatpack |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
.5 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
No |
e0 |
325 MHz |
30 s |
82 |
240 °C (464 °F) |
|||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
2.625 V |
2400 |
468252 |
2.5 |
Flatpack |
2.375 V |
.65 mm |
85 °C (185 °F) |
0.8 ns |
2400 CLBS, 468252 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e3 |
250 MHz |
20 mm |
||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
3.6 V |
400 |
CMOS |
7000 |
3.3 |
Flatpack |
3 V |
.65 mm |
1.3 ns |
400 CLBS, 7000 Gates |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 10000 Logic gates |
e3 |
200 MHz |
30 s |
245 °C (473 °F) |
20 mm |
|||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
196 |
CMOS |
3000 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
2.7 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 5000 Logic gates |
e3 |
111 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
484 |
CMOS |
15000 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
5.6 ns |
484 CLBS, 15000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
MAX available 23000 Logic gates |
e3 |
83 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
144 |
Yes |
5.5 V |
144 |
CMOS |
82 |
2000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
4.1 ns |
144 CLBS, 2000 Gates |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Typical gates = 2000-3000 |
e0 |
188 MHz |
30 s |
82 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.5 V |
196 |
CMOS |
112 |
4000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
85 °C (185 °F) |
4.5 ns |
196 CLBS, 4000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
3.92 mm |
28 mm |
No |
616 flip-flops; typical gates = 4000-5000 |
e0 |
133.3 MHz |
30 s |
112 |
225 °C (437 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.25 V |
144 |
CMOS |
2000 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
1.75 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
Max usable 3000 Logic gates |
e3 |
323 MHz |
30 s |
245 °C (473 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
400 |
Yes |
3.6 V |
400 |
CMOS |
160 |
7000 |
3.3 |
3.3 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
3 V |
.65 mm |
1.3 ns |
400 CLBS, 7000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 10000 Logic gates |
e0 |
200 MHz |
30 s |
160 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.25 V |
144 |
CMOS |
4200 |
5 |
Flatpack |
4.75 V |
.65 mm |
70 °C (158 °F) |
144 CLBS, 4200 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3.1496 mm |
14 mm |
No |
MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C |
e0 |
50 MHz |
20 mm |
|||||||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
CMOS |
64 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
.635 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
No |
e0 |
270 MHz |
30 s |
64 |
225 °C (437 °F) |
|||||||||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
576 |
Yes |
CMOS |
192 |
3.3 |
3.3 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
.635 mm |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
No |
e0 |
238 MHz |
30 s |
192 |
225 °C (437 °F) |
||||||||||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
144 |
Yes |
CMOS |
82 |
5 |
5 V |
Flatpack |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
.5 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
No |
e0 |
325 MHz |
30 s |
82 |
240 °C (464 °F) |
|||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
100 |
Yes |
5.5 V |
100 |
CMOS |
80 |
1500 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
3.3 ns |
100 CLBS, 1500 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 2000 Logic gates |
e0 |
227 MHz |
30 s |
80 |
225 °C (437 °F) |
20 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
484 |
CMOS |
6500 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
1.5 ns |
484 CLBS, 6500 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
Max usable 7500 Logic gates |
e3 |
370 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.25 V |
320 |
CMOS |
138 |
5000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
70 °C (158 °F) |
3.3 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
3.94 mm |
28 mm |
No |
MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500 |
e0 |
230 MHz |
30 s |
138 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
5.5 V |
64 |
CMOS |
64 |
1000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
4.1 ns |
64 CLBS, 1000 Gates |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Typical gates = 1000-1500 |
e0 |
188 MHz |
30 s |
64 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.89 V |
CMOS |
182 |
1.8 |
1.8,2.5,3.3 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.42 ns |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
20 mm |
No |
e0 |
400 MHz |
30 s |
182 |
225 °C (437 °F) |
20 mm |
||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
196 |
Yes |
5.5 V |
196 |
CMOS |
112 |
3000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
2.7 ns |
196 CLBS, 3000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 5000 Logic gates |
e0 |
111 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
224 |
Yes |
5.5 V |
224 |
CMOS |
120 |
3500 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
4.1 ns |
224 CLBS, 3500 Gates |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Typical gates = 3500-4500 |
e0 |
188 MHz |
30 s |
120 |
225 °C (437 °F) |
28 mm |
||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
484 |
CMOS |
15000 |
5 |
Flatpack |
4.5 V |
.65 mm |
3 ns |
484 CLBS, 15000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Typical gates = 15000-23000 |
e3 |
83 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.25 V |
1024 |
CMOS |
3000 |
5 |
Flatpack |
4.75 V |
.65 mm |
70 °C (158 °F) |
1024 CLBS, 3000 Gates |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
512 flip-flops; 3.3 V operation; OTP based |
20 mm |
||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
224 |
Yes |
5.25 V |
224 |
CMOS |
120 |
3500 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
2.7 ns |
224 CLBS, 3500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 4500 Logic gates |
e0 |
270 MHz |
30 s |
120 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
4320 |
Yes |
AEC-Q100 |
173 |
1.2,1.2/3.3,2.5 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
No |
e0 |
125 MHz |
30 s |
173 |
225 °C (437 °F) |
|||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
120 |
Yes |
5.25 V |
120 |
CMOS |
124 |
4000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
3 ns |
120 CLBS, 4000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
MAX available 6000 Logic gates |
e0 |
83 MHz |
30 s |
124 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack |
.65 mm |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
20 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
196 |
Yes |
5.25 V |
196 |
CMOS |
112 |
4000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
6 ns |
196 CLBS, 4000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
2.87 mm |
14 mm |
No |
616 flip-flops; typical gates = 4000-5000 |
e0 |
90.9 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
196 |
Yes |
5.5 V |
196 |
CMOS |
112 |
4000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
85 °C (185 °F) |
4.5 ns |
196 CLBS, 4000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
2.87 mm |
14 mm |
No |
616 flip-flops; typical gates = 4000-5000 |
e0 |
133.3 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Military |
Gull Wing |
240 |
QFP |
Square |
Plastic/Epoxy |
15552 |
Yes |
2.625 V |
3456 |
CMOS |
MIL-PRF-38535 |
166 |
661111 |
2.5 |
1.2/3.6,2.5 V |
Flatpack |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
125 °C (257 °F) |
0.8 ns |
661111 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e0 |
166 |
32 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.