VFBGA Field Programmable Gate Arrays (FPGA) 180

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LIFCL-40-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
ICE40LP1K-CM81	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	63	1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm	No	e1	133 MHz	30 s	63	260 °C (500 °F)	4 mm
ICE40UP3K-UWG30ITR	Lattice Semiconductor	FPGA	Industrial	Ball	30	VFBGA	Rectangular	Plastic/Epoxy	2800	Yes	1.26 V	350	CMOS	21	1.2	Tape and Reel		Grid Array, Very Thin Profile, Fine Pitch	BGA30,5X6,16		1.14 V	.4 mm	100 °C (212 °F)	9 ns	350 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm				30 s	21	260 °C (500 °F)	2.537 mm
LFD2NX-40-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LIFCL-17-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
ICE40LP1K-CM36TR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	25	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm		e1			25	260 °C (500 °F)	2.5 mm
LCMXO3LF-9400E-6MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	9400	Yes	1.26 V	1175		206	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm		e1			206	260 °C (500 °F)	9 mm
ICE40LP8K-CM121	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93	1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm	No	e1	133 MHz		93	260 °C (500 °F)	5 mm
LCMXO2-256ZE-3UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44	1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No	e1		30 s	44	260 °C (500 °F)	4 mm
10M08DFV81C7G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No				250		4.496 mm
LCMXO3L-2100E-5UWG49CTR50	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm		e1				260 °C (500 °F)	3.185 mm
LIFCL-17-8MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
LCMXO3L-4300E-5UWG81CTR1K	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1				260 °C (500 °F)	3.797 mm
LCMXO3LF-1300E-5UWG36CTR50	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm							2.541 mm
ICE40LP384-CM36TR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	25	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm		e1			25	260 °C (500 °F)	2.5 mm
ICE40LP384-CM36TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	25	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm		e1			25	260 °C (500 °F)	2.5 mm
LCMXO3LF-1300E-5UWG36ITR50	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160		28	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm					28		2.541 mm
LCMXO3L-2100E-5UWG49CTR1K	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm		e1				260 °C (500 °F)	3.185 mm
LCMXO3L-4300E-5UWG81ITR1K	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1			63	260 °C (500 °F)	3.797 mm
LFD2NX-17-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
ICE40LP8K-CM121TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93	1.2	Tape and Reel		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16		1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm		e1	133 MHz		93	260 °C (500 °F)	5 mm
LCMXO3L-4300E-5UWG81ITR	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1			63	260 °C (500 °F)	3.797 mm
LCMXO3LF-4300E-5UWG81ITR	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1			63	260 °C (500 °F)	3.797 mm
ICE40LP4K-CM81TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	63	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm		e1		30 s	63	260 °C (500 °F)	4 mm
ICE40LP8K-CM121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93	1.2	Tape and Reel		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16		1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm		e1	133 MHz		93	260 °C (500 °F)	5 mm
LCMXO3L-1300E-5MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	1300	Yes	1.26 V	160		206	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm		e1			206	260 °C (500 °F)	9 mm
LCMXO3L-2100E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	264			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LCMXO3LF-2100E-5UWG49ITR1K	Lattice Semiconductor	FPGA		Ball	49	VFBGA	Rectangular	Plastic/Epoxy	2100	Yes	1.26 V	264		38	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm		e1			38	260 °C (500 °F)	3.185 mm
LFD2NX-17-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LCMXO3L-4300E-5UWG81CTR	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1				260 °C (500 °F)	3.797 mm
LCMXO3LF-2100E-5UWG49CTR50	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm		e1				260 °C (500 °F)	3.185 mm
LCMXO3LF-6900E-5MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	6900	Yes	1.26 V	858		206	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm		e1			206	260 °C (500 °F)	9 mm
LIF-MD6000-6UMG64I	Lattice Semiconductor	FPGA		Ball	64	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	1500			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm			1500 CLBS			Bottom	S-PBGA-B64		1 mm	3.5 mm							3.5 mm
LIFCL-17-8UWG72C	Lattice Semiconductor	FPGA	Other	Ball	72	VFBGA	Rectangular	Plastic/Epoxy	17000	Yes	1.05 V			24	1			Grid Array, Very Thin Profile, Fine Pitch	BGA72,8X9,16		.95 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	R-PBGA-B72	1	.608 mm	3.8074 mm				30 s	24	260 °C (500 °F)	4.1251 mm
ICE5LP4K-SWG36ITR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	26	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9 ns	440 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36	1	.491 mm	2.078 mm				30 s	26	260 °C (500 °F)	2.078 mm
ICE5LP4K-SWG36ITR50	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	440	CMOS		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)		440 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36	1	.491 mm	2.078 mm				30 s		260 °C (500 °F)	2.078 mm
LCMXO3L-4300E-5MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm		e1				260 °C (500 °F)	9 mm
LCMXO3L-4300E-5UWG81ITR50	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1			63	260 °C (500 °F)	3.797 mm
LCMXO3L-4300E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LCMXO3L-640E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	80			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LIFCL-40-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
ICE40LP384-CM49TR	Lattice Semiconductor	FPGA	Industrial	Ball	49	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	37	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B49	3	1 mm	3 mm		e1		30 s	37	260 °C (500 °F)	3 mm
LCMXO3LF-2100E-5UWG49ITR	Lattice Semiconductor	FPGA		Ball	49	VFBGA	Rectangular	Plastic/Epoxy	2100	Yes	1.26 V	264		38	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm		e1			38	260 °C (500 °F)	3.185 mm
ICE40LP1K-SWG16TR50	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160	CMOS		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B16		.491 mm	1.4 mm							1.48 mm
ICE40LP384-CM49TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	49	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	48	CMOS		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		48 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B49		1 mm	3 mm							3 mm
LCMXO3L-1300E-5MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	160			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm		e1				260 °C (500 °F)	9 mm
LCMXO3L-1300E-6MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	1300	Yes	1.26 V	160		206	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm		e1			206	260 °C (500 °F)	9 mm
LCMXO3LF-4300E-5UWG81ITR50	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1			63	260 °C (500 °F)	3.797 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.