Square Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7S25-1CSGA225Q	Xilinx	FPGA	Automotive	Ball	225	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1			Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm			e1	1098 MHz		150		13 mm
XC7A100T-1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7S25-L1CSGA324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825		150		0.95			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		150		15 mm
XC7S50-L1FTGB196I	Xilinx	FPGA	Industrial	Ball	196	BGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075		100		0.95			Grid Array	BGA196,14X14,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3			100		15 mm
XC3S200AN-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	195	200000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	160	260 °C (500 °F)	17 mm
XC7S25-L1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825		150		0.95			Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm			e1	1098 MHz		150		13 mm
XC7S25-1CSGA324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		150		15 mm
10M16SAU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3			Grid Array	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply	e1		30 s	320	260 °C (500 °F)	11 mm
LCMXO2-4000HC-4TG144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4320	Yes	3.465 V			114		2.5	Tray	2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3		30 s	114	260 °C (500 °F)	20 mm
XC7S6-1CSGA225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1			Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	469 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm			e1	1098 MHz		100		13 mm
XC7A35T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	2600 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A35T-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600		250		0.95			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
5CEBA7F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
M1A3P250-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s		245 °C (473 °F)	28 mm
A3P250-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	17 mm
LCMXO2-256HC-4SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square		256	Yes	3.465 V	32		21		2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	3	.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply				21		5 mm
XCAU25P-2FFVB676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	308437	Yes	.876 V	17625		280		0.85			Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		17625 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	280	250 °C (482 °F)	27 mm
10M04SCE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246		3		3/3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)		250 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				246		20 mm
A3P1000-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	17 mm
EP2C8Q208C8N	Intel	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	138		1.2		1.2,1.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		516 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also requires 3.3 V supply	e3	402.5 MHz		130		28 mm
LCMXO2-256HC-5SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square		256	Yes	3.465 V	32		21		2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply				21		5 mm
XC6SLX16-2CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	160		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	667 MHz	30 s	160	260 °C (500 °F)	13 mm
XC7A15T-2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A100T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	285		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
10M04SAM153C8G	Intel	FPGA	Other	Ball	153	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246		3			Grid Array	BGA153,15X15,20		2.85 V	.5 mm	85 °C (185 °F)		250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				246		8 mm
LCMXO2-256ZE-1MG132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			55		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		30 s	55	250 °C (482 °F)	8 mm
LCMXO2-1200HC-4TG144I	Lattice Semiconductor	FPGA		Gull Wing	144	QFP	Square	Plastic/Epoxy	1280	Yes	3.465 V			107		2.5	Tray	2.5/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3	133 MHz	30 s	107	260 °C (500 °F)	20 mm
EP4CGX15BF14C8N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	14400	Yes	1.24 V	900		72		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz		72		14 mm
XC6SLX45-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	316		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	316	250 °C (482 °F)	23 mm
XC7S50-1CSGA324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		250		15 mm
10M02SCE144A7G	Intel	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246		3		3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	125 °C (257 °F)		125 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				246		20 mm
XC3S50A-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	68	50000	1.2		1.2,1.2/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.71 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	667 MHz	30 s	62	260 °C (500 °F)	14 mm
A3P1000-PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	154	1000000	1.5	Tray	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	154	245 °C (473 °F)	28 mm
XC7A50T-1CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	85 °C (185 °F)	1.27 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	10 mm
XC7A50T-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1286 MHz	30 s	250	260 °C (500 °F)	17 mm
LCMXO2-1200HC-4TG100IR1	Lattice Semiconductor	FPGA		Gull Wing	100	QFP	Square	Plastic/Epoxy	1280	Yes	3.465 V		CMOS	80		2.5		2.5/3.3 V	Flatpack	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm					Matte Tin	Quad	S-PQFP-G100	3			No		e3	133 MHz		80
10M08SAM153I7G	Intel	FPGA	Industrial	Ball	153	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250		3			Grid Array	BGA153,15X15,20		2.85 V	.5 mm	100 °C (212 °F)		500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				250		8 mm
A3P250-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	350 MHz	30 s		260 °C (500 °F)	14 mm
5CEBA2F17C8N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	128		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
XC7S50-2FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1286 MHz		250		15 mm
M1A3P1000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
EP4CE40F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	2475		331		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz	30 s	331	260 °C (500 °F)	23 mm
XC7S6-1CPGA196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	469 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm
10M08SAU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250		3			Grid Array	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)		500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply	e1		30 s	250	260 °C (500 °F)	11 mm
XC7S50-2CSGA324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1286 MHz		250		15 mm
XC3S50AN-4TQG144CES	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	176			50000	3.3			Flatpack, Low Profile, Fine Pitch			3 V	.5 mm		4.97 ns	176 CLBS, 50000 Gates		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	280 MHz				20 mm
EP4CE10F17I7N	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	645		179		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			645 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	179	260 °C (500 °F)	17 mm
XC7S6-1CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.