Square Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10CL016ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		340		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)		963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm		-40 to 125 °C range is available as extended industrial				340		19 mm
10CL040YF484C6G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	2475				1.2			Grid Array			1.15 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm								23 mm
10CL040YU484C6G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	2475				1.2			Grid Array, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.05 mm	19 mm			e1		30 s		260 °C (500 °F)	19 mm
10CL040ZF484I8G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475		325		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)		2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm		-40 to 125 °C range is available as extended industrial				325		23 mm
10CX085YF672E5G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	216		.9			Grid Array			.87 V		100 °C (212 °F)		31000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672									216
10CX085YF672I6G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	216		.9			Grid Array			.87 V		100 °C (212 °F)		31000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672									216
10M04DAF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250		246		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		250 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			246		17 mm
10M08DAF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			250		23 mm
10M16DAF256I6G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2			Grid Array	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			320		17 mm
10M16SCU324I7G	Intel	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				320		15 mm
10M25DAF484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			360		23 mm
10M25DCF484C7G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1563 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			360		23 mm
10M40SCE144C7G	Intel	FPGA	Commercial Extended	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	40000	Yes	3.15 V	2500		500		3		3/3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				500		20 mm
10M50DCF484C7G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3125 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			500		23 mm
1SG280HN1F43I2LG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes	.88 V	344125		704		0.85			Grid Array	BGA1760,42X42,40		.82 V	1 mm	100 °C (212 °F)		344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
5AGXFB7K4F40C4N	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	504000	Yes	1.13 V	19024		704		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		19024 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	3	2.7 mm	40 mm	No		e1	670 MHz		704		40 mm
5CEBA2U15C6N	Intel	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	176		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm	No					176		15 mm
5CEFA2M13C8N	Intel	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	223		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No					223		13 mm
5CEFA7F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
5CEFA7F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
5CGXBC5C6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	336		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			336		27 mm
5CGXFC3B6F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	31000	Yes	1.13 V		CMOS	224		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			224		23 mm
5CGXFC3B7F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	31500	Yes	1.13 V		CMOS	208		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1		30 s	208	260 °C (500 °F)	23 mm
5CGXFC4C7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	336		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			336		27 mm
5CGXFC7D6F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1			Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm			e1		30 s		260 °C (500 °F)	31 mm
5CGXFC9E6F35I7N	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	11356	CMOS	560		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		11356 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.4 mm	35 mm	No					560		35 mm
5SGSMD6N2F45C3N	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	583000	Yes	.88 V	22000	CMOS	840		.85		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		22000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
A1010B-PLG44I	Microsemi	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	295	CMOS		1200	5			Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	4.5 ns	295 CLBS, 1200 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQCC-J44	3	4.445 mm	16.51 mm	No	MAX 34 I/OS	e3					16.51 mm
A2F500M3G-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	11520	CMOS	66	500000	1.5		1.5,1.8,2.5,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		11520 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1	80 MHz	30 s	66	250 °C (482 °F)	17 mm
A3P030-QNG48	Microchip Technology	FPGA	Commercial	No Lead	48	HQCCN	Square			Yes	1.575 V	768	CMOS		30000	1.5			Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	85 °C (185 °F)		768 CLBS, 30000 Gates	0 °C (32 °F)		Quad	S-XQCC-N48	3		6 mm	No			350 MHz				6 mm
A3P030-VQG100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	768	CMOS		30000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		768 CLBS, 30000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	350 MHz				14 mm
A3P1000-2FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	350 MHz	20 s		225 °C (437 °F)	17 mm
A3P1000-FG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	300	1000000	1.5	Tray		Grid Array			1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0			300		23 mm
A3P1000L-1FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	177	1000000	1.2		1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s	177	250 °C (482 °F)	17 mm
A3P1000L-PQG208	Microsemi	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	154	1000000	1.2		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	70 °C (158 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz		154		28 mm
A3P125-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P125-VQ100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz				14 mm
A3P600-2FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
A3PE1500-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS	280	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s	280	250 °C (482 °F)	23 mm
A3PE3000-1PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	147	3000000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s	147	245 °C (473 °F)	28 mm
A3PE3000-2FG324I	Microchip Technology	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy		Yes	1.575 V	75264	CMOS		3000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324		1.78 mm	19 mm	No		e0					19 mm
A3PE3000-2PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	147	3000000	1.5		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
A3PE3000-FG324I	Microchip Technology	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	221	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324		1.78 mm	19 mm	No		e0	350 MHz		221		19 mm
A3PE3000L-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		341		23 mm
A3PE600-PQG208I	Microsemi	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	13824	Yes	1.575 V	13824	CMOS	147	600000	1.5		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz		147		28 mm
A42MX09-VQG100M	Microchip Technology	FPGA	Military	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	3.6 V	684	CMOS		14000	3.3	Tray		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	2.5 ns	684 CLBS, 14000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Also Operates at 5 V supply	e3	117 MHz				14 mm
A42MX16-FPL84	Microsemi	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	1232	CMOS		24000	3.3			Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	4 ns	1232 CLBS, 24000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e0	56 MHz				29.3116 mm
A54SX32A-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	174	48000	2.5		2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.1 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	278 MHz		174		29.21 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.