Square Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
AGLN060V2-CSG81I	Microchip Technology	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	.8 mm	5 mm	No		e1		30 s		260 °C (500 °F)	5 mm
AGLN060V2-VQG100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.2			Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		1536 CLBS, 60000 Gates	-20 °C (-4 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm
AGLN125V2-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.2			Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm
APA600-BG456	Microchip Technology	FPGA	Commercial	Ball	456	BGA	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS		356	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA456,26X26,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	70 °C (158 °F)		600000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B456	3	2.54 mm	35 mm	No			180 MHz		356		35 mm
APA600-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS		370	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	25 mm	No		e1	180 MHz	30 s	370	250 °C (482 °F)	25 mm
AX250-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square	Ceramic, Metal-Sealed Cofired	4224	Yes	1.575 V	2816	CMOS	MIL-STD-883 Class B	248	250000	1.5		1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	2816 CLBS, 250000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	250000 system gates avaiable	e0	763 MHz		248		29.21 mm
AX250-FGG256	Microchip Technology	FPGA	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	4224	Yes	1.575 V	2816	CMOS		248	250000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)	0.99 ns	2816 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No	250000 system gates avaiable	e1	649 MHz	30 s	248	250 °C (482 °F)	17 mm
AX500-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square	Ceramic, Metal-Sealed Cofired	8064	Yes	1.575 V	5376	CMOS	MIL-STD-883 Class B	336	500000	1.5		1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	5376 CLBS, 500000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	500000 system gates avaiable	e0	763 MHz		336		29.21 mm
EP1S30F780C5N	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	32470	Yes	1.575 V	3819	CMOS		726		1.5		1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		3819 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1			726		29 mm
EP2C35F484C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS		322		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2076 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		306		23 mm
EP4CE10F17C7	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	645			179		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		179		17 mm
EP4CE15E22C6N	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	15408	Yes	1.25 V	963			81		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		81		20 mm
EP4CE15E22C8	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	15408	Yes	1.25 V	963			81		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144		1.65 mm	20 mm	No		e0	472.5 MHz		81		20 mm
EP4CE15E22C8LN	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	15408	Yes	1.03 V	963			81		1		1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	362 MHz		81		20 mm
EP4CE15E22I7N	Intel	FPGA		Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	15408	Yes	1.25 V	963			81		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm			963 CLBS		Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		81		20 mm
EP4CE15F17C6N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963			165		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		165		17 mm
EP4CE15F23C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963			346		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		346		23 mm
EP4CE15F23C9LN	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963			346		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	265 MHz		346		23 mm
EP4CE15F23I7	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963			346		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			963 CLBS		Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0			346		23 mm
EP4CE40F23I8LN	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475			331		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm			2475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	362 MHz		331		23 mm
EP4CE55F23C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491			327		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		327		23 mm
EP4CE55F23C9LN	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.03 V	3491			327		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	265 MHz		327		23 mm
EP4CGX30CF23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840			290		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		290		23 mm
EX64TQ64	Actel	FPGA	Commercial	Gull Wing	64	LFQFP	Square	Plastic/Epoxy	192	Yes	2.7 V	128	CMOS		41	3000	2.5		2.5,2.5/5 V	Flatpack, Low Profile, Fine Pitch	QFP64,.47SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	70 °C (158 °F)	1 ns	128 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.6 mm	10 mm	No	Also requires 2.5 V OR 3.3 V OR 5 V supply	e0	250 MHz		41		10 mm
EX64-TQ64	Microchip Technology	FPGA		Gull Wing	64	LFQFP	Square	Plastic/Epoxy		Yes	2.7 V	128	CMOS		41	3000	2.5			Flatpack, Low Profile, Fine Pitch	QFP64,.47SQ,20		2.3 V	.5 mm	70 °C (158 °F)	1 ns	128 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQFP-G64		1.6 mm	10 mm		2000 typical gates available		250 MHz		41		10 mm
LCMXO2-1200UHC-5FTG256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1280	Yes	3.465 V				206		2.5	Tray	2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	206	260 °C (500 °F)	17 mm
LCMXO2-1200ZE-1TG100CR1	Lattice Semiconductor	FPGA	Other	Gull Wing	100	QFP	Square	Plastic/Epoxy	1280	Yes	1.26 V				79		1.2	Tray	1.2 V	Flatpack	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	133 MHz	30 s	79	260 °C (500 °F)	14 mm
LCMXO2-256ZE-2UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V				44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LCMXO2-256ZE-2UMG64I	Lattice Semiconductor	FPGA		Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V				44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LCMXO2-4000HC-6TG144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4320	Yes	3.465 V				114		2.5	Tray	2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3		30 s	114	260 °C (500 °F)	20 mm
LCMXO2-640HC-6SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		640	Yes	3.6 V	80			40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
LCMXO2-7000HE-4TG144I	Lattice Semiconductor	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6864	Yes	1.26 V				114		1.2	Tray	1.2 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s	114	260 °C (500 °F)	20 mm
LCMXO2280C-3MN132I	Lattice Semiconductor	FPGA	Industrial	Ball	132	LFBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285			101		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		285 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		40 s	101	260 °C (500 °F)	8 mm
LCMXO2280C-4MN132I	Lattice Semiconductor	FPGA	Industrial	Ball	132	LFBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285			101		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		285 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		40 s	101	260 °C (500 °F)	8 mm
LCMXO3L-1300E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	1300	Yes	1.26 V	160			100		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1			100	260 °C (500 °F)	6 mm
LCMXO3LF-4300C-5BG324C	Lattice Semiconductor	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	540					2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.7 mm	15 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	15 mm
LFD2NX-17-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI		23		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-9BG196C	Lattice Semiconductor	FPGA	Other	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		92		1						.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B196			12 mm						92		12 mm
LFD2NX-40-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		23		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFE2-12E-5QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500			131		1.2		1.2 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	311 MHz	40 s	131	245 °C (473 °F)	28 mm
LFE2-70E-5FN900C	Lattice Semiconductor	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	70000	Yes	1.26 V	8500			583		1.2		1.2 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	311 MHz	40 s	583	250 °C (482 °F)	31 mm
LFE3-17EA-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V				222		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	375 MHz		222	250 °C (482 °F)	23 mm
LFE3-17EA-6FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V				222		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	375 MHz		222	250 °C (482 °F)	23 mm
LFE3-70EA-8FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V				295		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	500 MHz		295	250 °C (482 °F)	23 mm
LFEC6E-3QN208I	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6100	Yes	1.26 V	768			147		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.56 ns	768 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	420 MHz	40 s	147	245 °C (473 °F)	28 mm
LFXP2-17E-7FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS		201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LFXP2-30E-5FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	29000	Yes	1.26 V	3625	CMOS		201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LFXP2-40E-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V	5000	CMOS		363		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.