Lattice Semiconductor Field Programmable Gate Arrays (FPGA) 914

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LCMXO2-1200HC-4MG132I	Lattice Semiconductor	FPGA	Industrial	Ball	132	BGA	Square	Plastic/Epoxy	1280	Yes	3.465 V			104	2.5	Tray	2.5/3.3 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	104	250 °C (482 °F)	8 mm
LCMXO2-1200UHC-4FTG256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1280	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	206	260 °C (500 °F)	17 mm
ICE40UP5K-SG48ITR	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		5280	Yes	1.26 V	660	CMOS	39	1.2	Tape and Reel		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.24SQ,20		1.14 V	.5 mm	100 °C (212 °F)		660 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm					30 s	39	260 °C (500 °F)	7 mm
LCMXO2-4000HC-4FTG256I	Lattice Semiconductor	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	17 mm
LCMXO2-256ZE-1TG100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	256	Yes	1.26 V			55	1.2	Tray	1.2 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3			55		14 mm
LCMXO2-256ZE-2SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square		256	Yes	1.26 V	32		21	1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No					21		5 mm
ICE40HX8K-CT256	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	206	1.2		1.2 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm	No			133 MHz		206		14 mm
ICE40LP1K-CM121	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	95	1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm	No		e1	133 MHz		95	260 °C (500 °F)	5 mm
LCMXO2-1200HC-4SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square		1280	Yes	3.6 V	160		21	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply				21	260 °C (500 °F)	5 mm
LCMXO2-2000HC-4BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2112	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	206	260 °C (500 °F)	14 mm
LFXP2-8E-5FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	201	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LFE5U-45F-7BG256I	Lattice Semiconductor	FPGA																									Tin Silver Copper			3					e1		30 s		260 °C (500 °F)
LFE5U-45F-8BG381I	Lattice Semiconductor	FPGA																												3									260 °C (500 °F)
LCMXO3LF-9400C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	1175			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO2-256ZE-1TG100I	Lattice Semiconductor	FPGA		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	256	Yes	1.26 V			55	1.2	Tray	1.2 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3			55		14 mm
LCMXO3LF-4300C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4300	Yes	3.465 V	540		206	2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-256ZE-1UMG64I	Lattice Semiconductor	FPGA		Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44	1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LCMXO2-640HC-4SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		640	Yes	3.6 V	80		40	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
ICE40HX8K-CB132	Lattice Semiconductor	FPGA	Industrial	Ball	132	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	95	1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1 mm	8 mm	No		e1	133 MHz	30 s	95	260 °C (500 °F)	8 mm
LCMXO2-256ZE-1SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square		256	Yes	1.26 V	32		21	1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No					21		5 mm
LCMXO2-1200HC-4TG144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	1280	Yes	3.465 V			107	2.5	Tray	2.5/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3	133 MHz	30 s	107	260 °C (500 °F)	20 mm
LCMXO2-256ZE-1UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44	1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LFE5U-25F-8BG381I	Lattice Semiconductor	FPGA																												3									260 °C (500 °F)
LFCPNX-100-7BBG484I	Lattice Semiconductor	FPGA																												3									260 °C (500 °F)
LCMXO2-1200ZE-1TG100I	Lattice Semiconductor	FPGA		Gull Wing	100	QFP	Square	Plastic/Epoxy	1280	Yes	1.26 V			79	1.2	Tray	1.2 V	Flatpack	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	133 MHz	30 s	79	260 °C (500 °F)	14 mm
LFE5UM-85F-8BG381I	Lattice Semiconductor	FPGA																												3
ICE40HX4K-TQ144	Lattice Semiconductor	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	107	1.2		1.2 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	7.3 ns	440 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm	No			133 MHz		107		20 mm
LFE5U-25F-6BG381I	Lattice Semiconductor	FPGA																												3									260 °C (500 °F)
LFXP2-5E-5TN144I	Lattice Semiconductor	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	100	1.2		1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	30 s	100	260 °C (500 °F)	20 mm
LCMXO256C-3TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	256	Yes	3.465 V	32		78	1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		30 s	78	260 °C (500 °F)	14 mm
LCMXO2-256ZE-1SG32I	Lattice Semiconductor	FPGA		No Lead	32	HVQCCN	Square		256	Yes	1.26 V	32		21	1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No					21		5 mm
LCMXO3LF-4300C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	540			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
ICE5LP2K-SG48ITR	Lattice Semiconductor	FPGA																												3							30 s		260 °C (500 °F)
LCMXO2-640UHC-4TG144I	Lattice Semiconductor	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	640	Yes	3.465 V			107	2.5	Tray	2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3		30 s	107	260 °C (500 °F)	20 mm
ICE40LP384-SG32TR1K	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square			Yes	1.26 V	48	CMOS		1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.5 mm	100 °C (212 °F)		48 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-XQCC-N32	3	1 mm	5 mm			e3				260 °C (500 °F)	5 mm
LFD2NX-40-7BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm			e1		30 s	111	260 °C (500 °F)	14 mm
LCMXO2-4000HC-4MG132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			104	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	104	250 °C (482 °F)	8 mm
LFE5U-12F-6BG256C	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	1500		197	1.1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		1.045 V	.8 mm	85 °C (185 °F)		1500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm			e1		30 s	197	260 °C (500 °F)	14 mm
ICE5LP1K-SG48ITR	Lattice Semiconductor	FPGA																												3							30 s		260 °C (500 °F)
LCMXO3LF-1300C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	160			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
ICE40LP384-SG32TR	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square		384	Yes	1.26 V	48	CMOS	21	1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.5 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-XQCC-N32	3	1 mm	5 mm			e3			21	260 °C (500 °F)	5 mm
LCMXO3LF-6900C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6900	Yes	3.465 V	858		206	2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-256HC-4SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		256	Yes	3.6 V	32		40	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
LCMXO2-256ZE-2SG32I	Lattice Semiconductor	FPGA		No Lead	32	HVQCCN	Square		256	Yes	1.26 V	32		21	1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No					21		5 mm
LFE5U-25F-6MG285C	Lattice Semiconductor	FPGA																									Tin Silver Copper			3					e1		30 s		260 °C (500 °F)
LFE5U-25F-8BG256I	Lattice Semiconductor	FPGA																									Tin Silver Copper			3					e1		30 s		260 °C (500 °F)
LCMXO3LF-6900C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LFCPNX-100-9LFG672I	Lattice Semiconductor	FPGA																												4									250 °C (482 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.