Lattice Semiconductor Field Programmable Gate Arrays (FPGA) 914

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LIFCL-40-7BG256A	Lattice Semiconductor	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	74	260 °C (500 °F)	14 mm
LIFCL-40-9MG289I	Lattice Semiconductor	FPGA	Industrial	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1			Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm						74		9.5 mm
LCMXO2-2000HC-4FTG256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	2112	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	206	260 °C (500 °F)	17 mm
LCMXO2-4000HC-4BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LFE5U-12F-6BG381C	Lattice Semiconductor	FPGA		Ball	381	FBGA	Square	Plastic/Epoxy		Yes	1.155 V	1500		197	1.1			Grid Array, Fine Pitch	BGA381,20X20,32		1.045 V	.8 mm	85 °C (185 °F)		1500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B381	3	1.76 mm	17 mm						197	260 °C (500 °F)	17 mm
LCMXO2-4000HC-6QN84I	Lattice Semiconductor	FPGA	Industrial	No Lead	84	HVQCCN	Square	Plastic/Epoxy	4320	Yes	3.6 V			68	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC84,.27SQ,20		2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-N84	3	.95 mm	7 mm		Also Operates at 3.3 V nominal supply	e3			68	260 °C (500 °F)	7 mm
LFXP2-8E-5MN132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	86	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	435 MHz	40 s	86	260 °C (500 °F)	8 mm
LCMXO2280C-3TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		73	1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		40 s	73	260 °C (500 °F)	14 mm
LFCPNX-100-8CBG256C	Lattice Semiconductor	FPGA																												3									260 °C (500 °F)
LCMXO2-7000HC-6TG144I	Lattice Semiconductor	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6864	Yes	3.465 V			114	2.5	Tray	2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3		30 s	114	260 °C (500 °F)	20 mm
LCMXO3LF-1300E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	1300	Yes	1.26 V	160		100	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1			100	260 °C (500 °F)	6 mm
LIFCL-17-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm					30 s	48	260 °C (500 °F)	6 mm
LCMXO2-1200HC-5TG100I	Lattice Semiconductor	FPGA		Gull Wing	100	QFP	Square	Plastic/Epoxy	1280	Yes	3.465 V			79	2.5	Tray	2.5/3.3 V	Flatpack	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e3	133 MHz		79		14 mm
LFE5UM5G-85F-8BG756C	Lattice Semiconductor	FPGA																												3							30 s		260 °C (500 °F)
ICE40LP1K-CB121	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	92	1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	No		e1	133 MHz		92	260 °C (500 °F)	6 mm
LAMXO3LF-4300C-5BG256E	Lattice Semiconductor	FPGA
LCMXO2-1200HC-4SG32I	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square		1280	Yes	3.6 V	160		21	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		1 mm	5 mm		Also Operates at 3.3 V nominal supply				21		5 mm
LFXP2-5E-5MN132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	86	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	435 MHz	40 s	86	260 °C (500 °F)	8 mm
ICE40UL1K-CM36AITR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	BGA	Square	Plastic/Epoxy	1248	Yes	1.26 V	156	CMOS	26	1.2			Grid Array			1.14 V	.4 mm	100 °C (212 °F)	9 ns	156 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3		2.5 mm			e1			26	260 °C (500 °F)	2.5 mm
LCMXO3LF-2100E-5UWG49CTR1K	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1				260 °C (500 °F)	3.185 mm
LFE5U-12F-6TG144I	Lattice Semiconductor	FPGA																												3							30 s		260 °C (500 °F)
LFE5U-12F-7TG144I	Lattice Semiconductor	FPGA																												3							30 s		260 °C (500 °F)
LCMXO1200C-3TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1200	Yes	3.465 V	150		113	1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		40 s	113	260 °C (500 °F)	20 mm
LCMXO2280C-3FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		211	1.8		1.8/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	211	260 °C (500 °F)	17 mm
LFE5UM-85F-6BG554C	Lattice Semiconductor	FPGA																									Tin Silver Copper			3					e1		30 s		260 °C (500 °F)
LCMXO2-4000HC-4BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3LF-6900C-6BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.7 mm	17 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	17 mm
LIFCL-17-7BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	48	260 °C (500 °F)	14 mm
LIFCL-17-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm					30 s	48	260 °C (500 °F)	6 mm
LCMXO2-1200HC-6TG100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	QFP	Square	Plastic/Epoxy	1280	Yes	3.465 V			79	2.5	Tray	2.5/3.3 V	Flatpack	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e3	133 MHz	30 s	79	260 °C (500 °F)	14 mm
LCMXO2-4000HC-6FG484C	Lattice Semiconductor	FPGA	Other	Ball	484	HBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			278	2.5	Tray	2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	278	250 °C (482 °F)	23 mm
LFD2NX-17-7MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFE5U-12F-6MG285I	Lattice Semiconductor	FPGA																									Tin Silver Copper			3					e1		30 s		260 °C (500 °F)
LCMXO2-1200HC-5SG32I	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square		1280	Yes	3.6 V	160		21	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply				21	260 °C (500 °F)	5 mm
LFE2-12E-5TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500		93	1.2		1.2 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	311 MHz	40 s	93	260 °C (500 °F)	20 mm
LCMXO2280C-3TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		113	1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s	113	260 °C (500 °F)	20 mm
LCMXO3L-2100C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	264			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LFE5U-12F-6MG285C	Lattice Semiconductor	FPGA																									Tin Silver Copper			3					e1		30 s		260 °C (500 °F)
LFE5U-12F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	1500		118	1.1			Grid Array, Low Profile, Fine Pitch	BGA285,18X18,20		1.045 V	.5 mm	85 °C (185 °F)		1500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s	118	260 °C (500 °F)	10 mm
LIF-MD6000-6MG81I	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	1500			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm			1500 CLBS		Tin Silver Copper Over Nickel	Bottom	S-PBGA-B81	3	1 mm	4.5 mm							260 °C (500 °F)	4.5 mm
LAMXO3LF-2100C-5BG324E	Lattice Semiconductor	FPGA
LCMXO3L-4300E-5UWG81CTR50	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1				260 °C (500 °F)	3.797 mm
LFE5U-12F-7MG285C	Lattice Semiconductor	FPGA																									Tin Silver Copper			3					e1		30 s		260 °C (500 °F)
LFE5U-25F-6TG144I	Lattice Semiconductor	FPGA																												3							30 s		260 °C (500 °F)
LFE5U-85F-8BG381I	Lattice Semiconductor	FPGA																												3
LAMXO3LF-4300C-5BG324E	Lattice Semiconductor	FPGA
LCMXO3L-2100E-5MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	264			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1				260 °C (500 °F)	6 mm
LFCPNX-100-8ASG256C	Lattice Semiconductor	FPGA																												3									260 °C (500 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.