Lattice Semiconductor Field Programmable Gate Arrays (FPGA) 914

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LFMXO5-25-7BBG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160	1			Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm						160		14 mm
LFMXO5-25-9BBG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160	1			Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm						160		14 mm
ICE40LP8K-CM121	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93	1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm	No		e1	133 MHz		93	260 °C (500 °F)	5 mm
LCMXO2-1200HC-4TG144CR1	Lattice Semiconductor	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	1280	Yes	3.465 V		CMOS	108	2.5		2.5/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3			No		e3	133 MHz	30 s	108	260 °C (500 °F)
LCMXO2-256ZE-3UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44	1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LCMXO3LF-9400C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206	2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LFE3-70EA-6FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	380	250 °C (482 °F)	27 mm
LFE3-70EA-7FN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.335 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	420 MHz	30 s	380	250 °C (482 °F)	27 mm
LFE3-70EA-8FN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.281 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	500 MHz	30 s	380	250 °C (482 °F)	27 mm
LFXP2-40E-5FN484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V	5000	CMOS	363	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm
LCMXO2-4000HC-6TG144I	Lattice Semiconductor	FPGA		Gull Wing	144	QFP	Square	Plastic/Epoxy	4320	Yes	3.465 V			114	2.5	Tray	2.5/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3	133 MHz	30 s	114	260 °C (500 °F)	20 mm
LCMXO2-7000ZE-1TG144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6864	Yes	1.26 V			114	1.2	Tray	1.2 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s	114	260 °C (500 °F)	20 mm
LCMXO3L-2100E-5UWG49CTR50	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1				260 °C (500 °F)	3.185 mm
LCMXO3LF-9400C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	1175			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LFE2M20E-5FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2375		140	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	140	250 °C (482 °F)	17 mm
LFE3-70EA-6FN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	380	250 °C (482 °F)	27 mm
LFE3-70EA-7FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.335 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	420 MHz	30 s	380	250 °C (482 °F)	27 mm
LFE3-70EA-8FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	500 MHz	30 s	380	250 °C (482 °F)	27 mm
LFXP2-5E-5FT256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5000	Yes	1.26 V		CMOS	172	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	435 MHz	30 s	172	225 °C (437 °F)	17 mm
LIFCL-17-8MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm					30 s	48	260 °C (500 °F)	6 mm
LCMXO2-1200ZE-1UWG25ITR50	Lattice Semiconductor	FPGA		Ball	25	BGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160		18	1.2	Tape and Reel	1.2 V	Grid Array	BGA25,5X5,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B25	1	.615 mm	2.492 mm	No		e1	133 MHz	30 s	18	260 °C (500 °F)	2.546 mm
LCMXO2-640HC-6TG100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	640	Yes	3.465 V	80		78	2.5	Tray	2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e3			78		14 mm
LFE3-70EA-6LFN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	380	250 °C (482 °F)	27 mm
LFXP2-30E-5FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	29000	Yes	1.26 V	3625	CMOS	363	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm
LFXP3C-5TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	384	Yes	3.465 V	384	CMOS	62	1.8		1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.44 ns	384 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	375 MHz	40 s	62	260 °C (500 °F)	14 mm
LCMXO2-7000ZE-1FTG256I	Lattice Semiconductor	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	6864	Yes	1.26 V			206	1.2	Tray	1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s	206	260 °C (500 °F)	17 mm
LCMXO3D-9400HC-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206	2.5			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LCMXO3L-4300E-5UWG81CTR1K	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1				260 °C (500 °F)	3.797 mm
LCMXO3LF-1300E-5UWG36CTR50	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm								2.541 mm
LFE3-70EA-6LFN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	380	250 °C (482 °F)	27 mm
LCMXO2-1200HC-5SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square		1280	Yes	3.6 V	160		21	2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply				21	260 °C (500 °F)	5 mm
LCMXO2-7000HE-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6864	Yes	1.26 V			206	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO640C-3MN100I	Lattice Semiconductor	FPGA	Industrial	Ball	100	LFBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80		74	1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA100,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.35 mm	8 mm	No		e1		30 s	74	260 °C (500 °F)	8 mm
LFCPNX-100-8ASG256A	Lattice Semiconductor	FPGA
LIFCL-17-8BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	48	260 °C (500 °F)	14 mm
ICE40LP384-CM36TR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	25	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm			e1			25	260 °C (500 °F)	2.5 mm
ICE40LP384-CM36TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	25	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm			e1			25	260 °C (500 °F)	2.5 mm
LCMXO2-256HC-6SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square		256	Yes	3.465 V	32		21	2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply				21		5 mm
LCMXO2-7000ZE-1TG144I	Lattice Semiconductor	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6864	Yes	1.26 V			114	1.2	Tray	1.2 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s	114	260 °C (500 °F)	20 mm
LCMXO3LF-1300E-5UWG36ITR50	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160		28	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm						28		2.541 mm
LFE5U-85F-7BG381C	Lattice Semiconductor	FPGA																												3
LFE5UM5G-25F-8BG381C	Lattice Semiconductor	FPGA																												3									260 °C (500 °F)
LFE5UM5G-85F-8BG554I	Lattice Semiconductor	FPGA																									Tin Silver Copper			3					e1		30 s		260 °C (500 °F)
LFXP2-17E-5QN208I	Lattice Semiconductor	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS	146	1.2		1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	435 MHz	40 s	146	245 °C (473 °F)	28 mm
LCMXO3D-9400HC-6SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		9400	Yes	3.465 V	1175		58	2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	85 °C (185 °F)	6.7 ns	1175 CLBS	0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
LCMXO3L-2100E-5UWG49CTR1K	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1				260 °C (500 °F)	3.185 mm
LCMXO3L-4300E-5UWG81ITR1K	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1			63	260 °C (500 °F)	3.797 mm
LFD2NX-17-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.