Lattice Semiconductor Field Programmable Gate Arrays (FPGA) 914

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

LFE5UM-85F-7BG381I

Lattice Semiconductor

FPGA

3

LFXP15C-3FN484C

Lattice Semiconductor

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

1932

Yes

3.465 V

1932

CMOS

300

1.8

1.8/2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.71 V

1 mm

85 °C (185 °F)

0.63 ns

1932 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e1

375 MHz

40 s

300

250 °C (482 °F)

23 mm

LFXP15C-5FN256C

Lattice Semiconductor

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

1932

Yes

3.465 V

1932

CMOS

188

1.8

1.8/2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.71 V

1 mm

85 °C (185 °F)

0.44 ns

1932 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

375 MHz

40 s

188

250 °C (482 °F)

17 mm

LFXP2-17E-5QN208C

Lattice Semiconductor

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

17000

Yes

1.26 V

2125

CMOS

146

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.494 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

435 MHz

40 s

146

245 °C (473 °F)

28 mm

LFXP2-17E-5QN208C8W

Lattice Semiconductor

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

17000

Yes

1.26 V

CMOS

146

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

311 MHz

146

245 °C (473 °F)

28 mm

LFXP2-40E-7F484C

Lattice Semiconductor

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

40000

Yes

1.26 V

CMOS

363

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.304 ns

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e0

435 MHz

30 s

363

225 °C (437 °F)

23 mm

LFXP2-8E-6FT256I

Lattice Semiconductor

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

CMOS

201

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

0.399 ns

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

435 MHz

30 s

201

225 °C (437 °F)

17 mm

LFXP3C-3T144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

384

Yes

3.465 V

384

CMOS

100

1.8

1.8/2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.63 ns

384 CLBS

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

375 MHz

100

225 °C (437 °F)

20 mm

LFXP3C-4TN100C

Lattice Semiconductor

FPGA

Other

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

384

Yes

3.465 V

384

CMOS

62

1.8

1.8/2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.53 ns

384 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

375 MHz

40 s

62

260 °C (500 °F)

14 mm

LFXP3C-5TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

384

Yes

3.465 V

384

CMOS

100

1.8

1.8/2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.44 ns

384 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

375 MHz

40 s

100

260 °C (500 °F)

20 mm

LIFCL-40-8MG289I

Lattice Semiconductor

FPGA

Industrial

Ball

289

TFBGA

Square

Plastic/Epoxy

39000

Yes

1.05 V

9750

FDSOI

74

1

Grid Array, Thin Profile, Fine Pitch

BGA289,17X17,20

.95 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B289

1.2 mm

9.5 mm

74

9.5 mm

ICE40UP3K-UWG30ITR50

Lattice Semiconductor

FPGA

Ball

30

VFBGA

Rectangular

Plastic/Epoxy

2800

Yes

1.26 V

350

CMOS

21

1.2

Tape and Reel

Grid Array, Very Thin Profile, Fine Pitch

BGA30,5X6,16

1.14 V

.4 mm

100 °C (212 °F)

9 ns

350 CLBS

-40 °C (-40 °F)

Bottom

R-PBGA-B30

1

.6 mm

2.114 mm

30 s

21

260 °C (500 °F)

2.537 mm

ICE5LP2K-SG48ITR50

Lattice Semiconductor

FPGA

3

30 s

260 °C (500 °F)

LCMXO2-1200UHC-5FTG256I

Lattice Semiconductor

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

1280

Yes

3.465 V

206

2.5

Tray

2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

2.375 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Also Operates at 3.3 V nominal supply

e1

133 MHz

30 s

206

260 °C (500 °F)

17 mm

LCMXO2-1200ZE-1TG100CR1

Lattice Semiconductor

FPGA

Other

Gull Wing

100

QFP

Square

Plastic/Epoxy

1280

Yes

1.26 V

79

1.2

Tray

1.2 V

Flatpack

QFP100,.63SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

133 MHz

30 s

79

260 °C (500 °F)

14 mm

LCMXO2-256ZE-2UMG64C

Lattice Semiconductor

FPGA

Other

Ball

64

VFBGA

Square

Plastic/Epoxy

256

Yes

1.26 V

44

1.2

Tray

1.2 V

Grid Array, Very Thin Profile, Fine Pitch

BGA64,8X8,16

Field Programmable Gate Arrays

1.14 V

.4 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B64

3

1 mm

4 mm

No

e1

30 s

44

260 °C (500 °F)

4 mm

LCMXO2-256ZE-2UMG64I

Lattice Semiconductor

FPGA

Ball

64

VFBGA

Square

Plastic/Epoxy

256

Yes

1.26 V

44

1.2

Tray

1.2 V

Grid Array, Very Thin Profile, Fine Pitch

BGA64,8X8,16

Field Programmable Gate Arrays

1.14 V

.4 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B64

3

1 mm

4 mm

No

e1

30 s

44

260 °C (500 °F)

4 mm

LCMXO2-4000HC-6TG144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4320

Yes

3.465 V

114

2.5

Tray

2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Also Operates at 3.3 V nominal supply

e3

30 s

114

260 °C (500 °F)

20 mm

LCMXO2-640HC-6SG48C

Lattice Semiconductor

FPGA

No Lead

48

HVQCCN

Square

640

Yes

3.6 V

80

40

2.5

Tray

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

2.375 V

.5 mm

85 °C (185 °F)

80 CLBS

0 °C (32 °F)

Quad

S-XQCC-N48

3

1 mm

7 mm

Also Operates at 3.3 V nominal supply

40

260 °C (500 °F)

7 mm

LCMXO2-7000HE-4TG144I

Lattice Semiconductor

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6864

Yes

1.26 V

114

1.2

Tray

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

114

260 °C (500 °F)

20 mm

LCMXO2280C-3MN132I

Lattice Semiconductor

FPGA

Industrial

Ball

132

LFBGA

Square

Plastic/Epoxy

2280

Yes

3.465 V

285

101

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

100 °C (212 °F)

285 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

40 s

101

260 °C (500 °F)

8 mm

LCMXO2280C-4MN132I

Lattice Semiconductor

FPGA

Industrial

Ball

132

LFBGA

Square

Plastic/Epoxy

2280

Yes

3.465 V

285

101

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

100 °C (212 °F)

285 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

40 s

101

260 °C (500 °F)

8 mm

LCMXO3L-1300E-5MG121I

Lattice Semiconductor

FPGA

Ball

121

VFBGA

Square

Plastic/Epoxy

1300

Yes

1.26 V

160

100

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.5 mm

100 °C (212 °F)

160 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

6 mm

e1

100

260 °C (500 °F)

6 mm

LCMXO3LF-4300C-5BG324C

Lattice Semiconductor

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

3.465 V

540

2.5

Grid Array, Low Profile, Fine Pitch

2.375 V

.8 mm

85 °C (185 °F)

540 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.7 mm

15 mm

Also Operates at 3.3 V nominal supply

e1

30 s

260 °C (500 °F)

15 mm

LCMXO3LF-9400E-5BG256I

Lattice Semiconductor

FPGA

Tin Silver Copper

3

e1

30 s

260 °C (500 °F)

LFD2NX-17-9MG121I

Lattice Semiconductor

FPGA

Industrial

Ball

121

VFBGA

Square

Plastic/Epoxy

17000

Yes

1.05 V

4250

FDSOI

23

1

Grid Array, Very Thin Profile, Fine Pitch

BGA121,11X11,20

.95 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

6 mm

e1

30 s

23

260 °C (500 °F)

6 mm

LFD2NX-40-9BG196C

Lattice Semiconductor

FPGA

Other

Ball

196

Square

Plastic/Epoxy

39000

Yes

1.05 V

9750

FDSOI

92

1

.95 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B196

12 mm

92

12 mm

LFD2NX-40-9MG121I

Lattice Semiconductor

FPGA

Industrial

Ball

121

VFBGA

Square

Plastic/Epoxy

39000

Yes

1.05 V

9750

FDSOI

23

1

Grid Array, Very Thin Profile, Fine Pitch

BGA121,11X11,20

.95 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

6 mm

e1

30 s

23

260 °C (500 °F)

6 mm

LFE2-12E-5QN208C

Lattice Semiconductor

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

12000

Yes

1.26 V

1500

131

1.2

1.2 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.358 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

311 MHz

40 s

131

245 °C (473 °F)

28 mm

LFE2-70E-5FN900C

Lattice Semiconductor

FPGA

Other

Ball

900

BGA

Square

Plastic/Epoxy

70000

Yes

1.26 V

8500

583

1.2

1.2 V

Grid Array

BGA900,30X30,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.358 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B900

3

2.6 mm

31 mm

No

e1

311 MHz

40 s

583

250 °C (482 °F)

31 mm

LFE3-17EA-6FN484C

Lattice Semiconductor

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

17000

Yes

1.26 V

222

1.2

1.2 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.379 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e1

375 MHz

222

250 °C (482 °F)

23 mm

LFE3-17EA-6FN484I

Lattice Semiconductor

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

17000

Yes

1.26 V

222

1.2

1.2 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.379 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e1

375 MHz

222

250 °C (482 °F)

23 mm

LFE3-70EA-8FN484C

Lattice Semiconductor

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

67000

Yes

1.26 V

295

1.2

1.2 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.281 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e1

500 MHz

295

250 °C (482 °F)

23 mm

LFE5U-12F-8BG381C

Lattice Semiconductor

FPGA

3

260 °C (500 °F)

LFE5U-25F-7BG381I

Lattice Semiconductor

FPGA

3

260 °C (500 °F)

LFE5U-45F-8BG256C

Lattice Semiconductor

FPGA

Tin Silver Copper

3

e1

30 s

260 °C (500 °F)

LFE5U-85F-6BG756C

Lattice Semiconductor

FPGA

Tin Silver Copper

3

e1

30 s

260 °C (500 °F)

LFE5U-85F-8BG554C

Lattice Semiconductor

FPGA

Tin Silver Copper

3

e1

30 s

260 °C (500 °F)

LFE5UM-45F-7BG554I

Lattice Semiconductor

FPGA

Tin Silver Copper

3

e1

30 s

260 °C (500 °F)

LFE5UM5G-25F-8BG381I

Lattice Semiconductor

FPGA

3

260 °C (500 °F)

LFEC6E-3QN208I

Lattice Semiconductor

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

6100

Yes

1.26 V

768

147

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.56 ns

768 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

420 MHz

40 s

147

245 °C (473 °F)

28 mm

LFXP2-17E-7FTN256C

Lattice Semiconductor

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

17000

Yes

1.26 V

2125

CMOS

201

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.304 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

435 MHz

201

260 °C (500 °F)

17 mm

LFXP2-30E-5FTN256I

Lattice Semiconductor

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

29000

Yes

1.26 V

3625

CMOS

201

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.494 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

435 MHz

201

260 °C (500 °F)

17 mm

LFXP2-40E-6FN484C

Lattice Semiconductor

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

40000

Yes

1.26 V

5000

CMOS

363

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.399 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e1

435 MHz

363

250 °C (482 °F)

23 mm

LFXP3C-3TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

384

Yes

3.465 V

384

CMOS

100

1.8

1.8/2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.63 ns

384 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

375 MHz

40 s

100

260 °C (500 °F)

20 mm

LFXP6E-3FN256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

720

Yes

1.26 V

720

CMOS

188

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.63 ns

720 CLBS

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

375 MHz

40 s

188

250 °C (482 °F)

17 mm

LIF-MD6000-6UWG36ITR1K

Lattice Semiconductor

FPGA

Ball

36

VFBGA

Rectangular

Plastic/Epoxy

Yes

1.26 V

1500

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

1500 CLBS

Tin Silver Copper Nickel

Bottom

R-PBGA-B36

1

.6 mm

2.535 mm

e2

260 °C (500 °F)

2.585 mm

LIFCL-40-8MG289C

Lattice Semiconductor

FPGA

Other

Ball

289

TFBGA

Square

Plastic/Epoxy

39000

Yes

1.05 V

9750

FDSOI

74

1

Grid Array, Thin Profile, Fine Pitch

BGA289,17X17,20

.95 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B289

1.2 mm

9.5 mm

74

9.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.