Lattice Semiconductor Field Programmable Gate Arrays (FPGA) 914

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

LFXP2-5E-7TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

5000

Yes

1.26 V

625

CMOS

100

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.304 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

435 MHz

40 s

100

260 °C (500 °F)

20 mm

LFXP2-8E-7FTN256C

Lattice Semiconductor

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

201

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.304 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

435 MHz

201

260 °C (500 °F)

17 mm

LAV-AT-300E-2LBG484I

Lattice Semiconductor

FPGA

LCMXO2-1200ZE-3TG100C

Lattice Semiconductor

FPGA

Other

Gull Wing

100

QFP

Square

Plastic/Epoxy

1280

Yes

1.26 V

79

1.2

Tray

1.2 V

Flatpack

QFP100,.63SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

133 MHz

79

14 mm

LCMXO2-2000HC-5TG100C

Lattice Semiconductor

FPGA

Other

Gull Wing

100

QFP

Square

Plastic/Epoxy

2112

Yes

3.465 V

79

2.5

Tray

2.5/3.3 V

Flatpack

QFP100,.63SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

Also Operates at 3.3 V nominal supply

e3

133 MHz

79

14 mm

LCMXO2-2000HC-5TG144I

Lattice Semiconductor

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2112

Yes

3.465 V

111

2.5

Tray

2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Also Operates at 3.3 V nominal supply

e3

30 s

111

260 °C (500 °F)

20 mm

LCMXO2-7000HC-6TG144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6864

Yes

3.465 V

114

2.5

Tray

2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Also Operates at 3.3 V nominal supply

e3

30 s

114

260 °C (500 °F)

20 mm

LCMXO3L-2100E-5MG121I

Lattice Semiconductor

FPGA

Ball

121

VFBGA

Square

Plastic/Epoxy

2100

Yes

1.26 V

264

100

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.5 mm

100 °C (212 °F)

264 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

6 mm

e1

100

260 °C (500 °F)

6 mm

LCMXO3LF-1300E-5UWG36ITR

Lattice Semiconductor

FPGA

Ball

36

VFBGA

Rectangular

Plastic/Epoxy

1300

Yes

1.26 V

160

28

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

160 CLBS

-40 °C (-40 °F)

Bottom

R-PBGA-B36

.576 mm

2.487 mm

28

2.541 mm

LCMXO3LF-1300E-6MG121C

Lattice Semiconductor

FPGA

Other

Ball

121

VFBGA

Square

Plastic/Epoxy

Yes

1.26 V

160

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

160 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

6 mm

e1

260 °C (500 °F)

6 mm

LCMXO3LF-2100E-5MG121C

Lattice Semiconductor

FPGA

Other

Ball

121

VFBGA

Square

Plastic/Epoxy

Yes

1.26 V

264

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

264 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

6 mm

e1

260 °C (500 °F)

6 mm

LCMXO3LF-9400C-6BG484I

Lattice Semiconductor

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

9400

Yes

3.465 V

1175

384

2.5

Grid Array

2.375 V

.8 mm

100 °C (212 °F)

1175 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B484

19 mm

Also Operates at 3.3 V nominal supply

384

19 mm

LFXP2-8E-5QN208I

Lattice Semiconductor

FPGA

Gull Wing

208

FQFP

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

146

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.494 ns

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

435 MHz

40 s

146

245 °C (473 °F)

28 mm

LCMXO256C-3MN100I

Lattice Semiconductor

FPGA

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

256

Yes

3.465 V

32

78

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA100,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

100 °C (212 °F)

32 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

1.35 mm

8 mm

No

e1

30 s

78

260 °C (500 °F)

8 mm

LFE2-12E-5FN256C

Lattice Semiconductor

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

12000

Yes

1.26 V

1500

193

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.358 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

311 MHz

40 s

193

250 °C (482 °F)

17 mm

LCMXO2-4000HC-6MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

3.465 V

104

2.5

Tray

2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO3D-4300HC-5SG72I

Lattice Semiconductor

FPGA

Industrial

No Lead

72

HVQCCN

Square

4300

Yes

3.465 V

537

58

2.5

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.40SQ,20

2.375 V

.5 mm

100 °C (212 °F)

7 ns

537 CLBS

-40 °C (-40 °F)

Quad

S-XQCC-N72

.9 mm

10 mm

Also Operates at 3.3 V nominal supply

58

10 mm

LCMXO3LF-2100E-5MG256C

Lattice Semiconductor

FPGA

Other

Ball

256

VFBGA

Square

Plastic/Epoxy

Yes

1.26 V

264

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

264 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1 mm

9 mm

e1

260 °C (500 °F)

9 mm

LIFCL-40-9BG256C

Lattice Semiconductor

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

39000

Yes

1.05 V

9750

FDSOI

74

1

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

.95 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

30 s

74

260 °C (500 °F)

14 mm

LCMXO2-4000HE-4MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-1200ZE-1SG32I

Lattice Semiconductor

FPGA

Industrial

No Lead

32

HVQCCN

Square

1280

Yes

1.26 V

160

21

1.2

Tray

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

1.14 V

.5 mm

100 °C (212 °F)

160 CLBS

-40 °C (-40 °F)

Quad

S-XQCC-N32

1

1 mm

5 mm

21

260 °C (500 °F)

5 mm

LCMXO3LF-1300C-5BG256I

Lattice Semiconductor

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

1300

Yes

3.465 V

160

206

2.5

Grid Array, Low Profile, Fine Pitch

2.375 V

.8 mm

100 °C (212 °F)

160 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

Also Operates at 3.3 V nominal supply

e1

30 s

206

260 °C (500 °F)

14 mm

LCMXO3LF-6900E-5MG256C

Lattice Semiconductor

FPGA

Other

Ball

256

VFBGA

Square

Plastic/Epoxy

Yes

1.26 V

858

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

858 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1 mm

9 mm

e1

260 °C (500 °F)

9 mm

LFE2-70E-7FN672C

Lattice Semiconductor

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

70000

Yes

1.26 V

8500

500

1.2

1.2 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.304 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.6 mm

27 mm

No

e1

420 MHz

30 s

500

250 °C (482 °F)

27 mm

LFE3-17EA-8MG328C

Lattice Semiconductor

FPGA

Other

Ball

328

LFBGA

Square

Plastic/Epoxy

17000

Yes

1.26 V

116

1.2

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA328,19X19,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.281 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B328

3

1.5 mm

10 mm

No

e1

500 MHz

30 s

116

260 °C (500 °F)

10 mm

LFE3-95EA-6FN672I

Lattice Semiconductor

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

92000

Yes

1.26 V

380

1.2

1.2 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.379 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.6 mm

27 mm

No

e1

375 MHz

30 s

380

250 °C (482 °F)

27 mm

LFEC1E-4TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1500

Yes

1.26 V

192

97

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.48 ns

192 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

420 MHz

40 s

97

260 °C (500 °F)

20 mm

LFXP2-5E-5FTN256I

Lattice Semiconductor

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

5000

Yes

1.26 V

625

CMOS

172

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.494 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

435 MHz

172

260 °C (500 °F)

17 mm

LAE5UM-45F-7BG381E

Lattice Semiconductor

FPGA

3

30 s

260 °C (500 °F)

LCMXO2-1200HC-6TG144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

QFP

Square

Plastic/Epoxy

1280

Yes

3.465 V

107

2.5

Tray

2.5/3.3 V

Flatpack

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Also Operates at 3.3 V nominal supply

e3

133 MHz

30 s

107

260 °C (500 °F)

20 mm

LCMXO2-2000HC-6TG100C

Lattice Semiconductor

FPGA

Other

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

2112

Yes

3.465 V

79

2.5

Tray

2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

Also Operates at 3.3 V nominal supply

e3

79

14 mm

LCMXO2-2000ZE-1UWG49ITR1K

Lattice Semiconductor

FPGA

Ball

49

VFBGA

Rectangular

Plastic/Epoxy

2112

Yes

1.26 V

264

38

1.2

Tape and Reel

Grid Array, Very Thin Profile, Fine Pitch

BGA49,7X7,16

1.14 V

.4 mm

100 °C (212 °F)

264 CLBS

-40 °C (-40 °F)

Bottom

R-PBGA-B49

.6 mm

3.106 mm

38

3.185 mm

LCMXO2-4000HC-6QN84C

Lattice Semiconductor

FPGA

Other

No Lead

84

HVQCCN

Square

Plastic/Epoxy

4320

Yes

3.6 V

68

2.5

Tray

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC84,.27SQ,20

2.375 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-N84

3

.95 mm

7 mm

Also Operates at 3.3 V nominal supply

e3

68

260 °C (500 °F)

7 mm

LCMXO256C-4TN100I

Lattice Semiconductor

FPGA

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

256

Yes

3.465 V

32

78

1.8

1.8/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

100 °C (212 °F)

32 CLBS

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

40 s

78

260 °C (500 °F)

14 mm

LCMXO3LF-4300E-5MG121C

Lattice Semiconductor

FPGA

Other

Ball

121

VFBGA

Square

Plastic/Epoxy

Yes

1.26 V

540

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

540 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

6 mm

e1

260 °C (500 °F)

6 mm

LCMXO640C-4TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

640

Yes

3.465 V

80

113

1.8

1.8/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

80 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

40 s

113

260 °C (500 °F)

20 mm

LFE3-17EA-8LMG328I

Lattice Semiconductor

FPGA

Ball

328

LFBGA

Square

Plastic/Epoxy

17000

Yes

1.26 V

116

1.2

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA328,19X19,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.281 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B328

3

1.5 mm

10 mm

No

e1

500 MHz

30 s

116

260 °C (500 °F)

10 mm

LFE5UM5G-45F-8BG554I

Lattice Semiconductor

FPGA

Tin Silver Copper

3

e1

30 s

260 °C (500 °F)

ICE40LP1K-CB81

Lattice Semiconductor

FPGA

Industrial

Ball

81

VFBGA

Square

Plastic/Epoxy

1280

Yes

1.26 V

160

CMOS

62

1.2

1.2 V

Grid Array, Very Thin Profile, Fine Pitch

BGA81,9X9,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

9.36 ns

160 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B81

3

1 mm

5 mm

No

e1

133 MHz

30 s

62

260 °C (500 °F)

5 mm

ICE40LP1K-SWG16TR

Lattice Semiconductor

FPGA

Industrial

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

1280

Yes

1.26 V

160

CMOS

10

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.35 mm

100 °C (212 °F)

9.36 ns

160 CLBS

-40 °C (-40 °F)

Bottom

R-PBGA-B16

.491 mm

1.4 mm

10

1.48 mm

LCMXO2-2000HC-5BG256C

Lattice Semiconductor

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

2112

Yes

3.465 V

206

2.5

Tray

2.5/3.3 V

Grid Array

BGA256,16X16,32

Field Programmable Gate Arrays

2.375 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

No

Also Operates at 3.3 V nominal supply

e1

133 MHz

30 s

206

260 °C (500 °F)

14 mm

LCMXO2-4000HC-5TG144I

Lattice Semiconductor

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4320

Yes

3.465 V

114

2.5

Tray

2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Also Operates at 3.3 V nominal supply

e3

30 s

114

260 °C (500 °F)

20 mm

LCMXO2-4000HE-4TG144I

Lattice Semiconductor

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4320

Yes

1.26 V

114

1.2

Tray

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

114

260 °C (500 °F)

20 mm

LCMXO2-4000ZE-2MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-7000HE-4TG144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6864

Yes

1.26 V

114

1.2

Tray

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

114

260 °C (500 °F)

20 mm

LCMXO2280C-4BN256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

LFBGA

Square

Plastic/Epoxy

2280

Yes

3.465 V

285

211

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.71 V

.8 mm

100 °C (212 °F)

285 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

No

e1

211

260 °C (500 °F)

14 mm

LCMXO3L-6900C-5BG256I

Lattice Semiconductor

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

6900

Yes

3.465 V

858

206

2.5

Grid Array, Low Profile, Fine Pitch

2.375 V

.8 mm

100 °C (212 °F)

858 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

Also Operates at 3.3 V nominal supply

e1

30 s

206

260 °C (500 °F)

14 mm

LCMXO3LF-1300E-5UWG36CTR1K

Lattice Semiconductor

FPGA

Other

Ball

36

VFBGA

Rectangular

Plastic/Epoxy

Yes

1.26 V

160

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

85 °C (185 °F)

160 CLBS

0 °C (32 °F)

Bottom

R-PBGA-B36

.576 mm

2.487 mm

2.541 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.