Lattice Semiconductor Field Programmable Gate Arrays (FPGA) 914

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

LCMXO3LF-2100C-5BG324I

Lattice Semiconductor

FPGA

Ball

324

LFBGA

Square

Plastic/Epoxy

2100

Yes

3.465 V

264

279

2.5

Grid Array, Low Profile, Fine Pitch

2.375 V

.8 mm

100 °C (212 °F)

264 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.7 mm

15 mm

Also Operates at 3.3 V nominal supply

e1

30 s

279

260 °C (500 °F)

15 mm

LFE2M20E-5FN484I

Lattice Semiconductor

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

20000

Yes

1.26 V

2375

304

1.2

1.2 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.358 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e1

311 MHz

304

250 °C (482 °F)

23 mm

LFE2M35E-5FN256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

35000

Yes

1.26 V

4250

140

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.358 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

311 MHz

40 s

140

250 °C (482 °F)

17 mm

LFE3-17EA-8FTN256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

17000

Yes

1.26 V

133

1.2

1.2 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.281 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

500 MHz

30 s

133

260 °C (500 °F)

17 mm

LFE3-35EA-6FTN256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

33000

Yes

1.26 V

133

1.2

1.2 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.379 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

375 MHz

30 s

133

260 °C (500 °F)

17 mm

LFE3-70EA-7FN484C

Lattice Semiconductor

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

67000

Yes

1.26 V

295

1.2

1.2 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.335 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e1

420 MHz

295

250 °C (482 °F)

23 mm

LFE3-70EA-7FN484I

Lattice Semiconductor

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

67000

Yes

1.26 V

295

1.2

1.2 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.335 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e1

420 MHz

295

250 °C (482 °F)

23 mm

LIA-MD6000-6JMG80E

Lattice Semiconductor

FPGA

3

30 s

260 °C (500 °F)

ICE40LM2K-CM49TR1K

Lattice Semiconductor

FPGA

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

Yes

1.26 V

256

CMOS

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

256 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B49

1 mm

3 mm

3 mm

ICE40LP1K-SWG16TR1K

Lattice Semiconductor

FPGA

Industrial

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

1280

Yes

1.26 V

160

CMOS

10

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.35 mm

100 °C (212 °F)

9.36 ns

160 CLBS

-40 °C (-40 °F)

Bottom

R-PBGA-B16

.491 mm

1.4 mm

10

1.48 mm

ICE40LP4K-CM121TR

Lattice Semiconductor

FPGA

Industrial

Ball

121

VFBGA

Square

Plastic/Epoxy

3520

Yes

1.26 V

440

CMOS

93

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

9.36 ns

440 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

5 mm

e1

93

260 °C (500 °F)

5 mm

ICE40LP4K-CM121TR1K

Lattice Semiconductor

FPGA

Industrial

Ball

121

VFBGA

Square

Plastic/Epoxy

Yes

1.26 V

440

CMOS

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

440 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B121

1 mm

5 mm

5 mm

ICE40LP4K-CM225

Lattice Semiconductor

FPGA

Industrial

Ball

225

VFBGA

Square

Plastic/Epoxy

3520

Yes

1.26 V

440

CMOS

167

1.2

1.2 V

Grid Array, Very Thin Profile, Fine Pitch

BGA225,15X15,16

Field Programmable Gate Arrays

1.14 V

.4 mm

100 °C (212 °F)

9.36 ns

440 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B225

3

1 mm

7 mm

No

e1

133 MHz

30 s

167

260 °C (500 °F)

7 mm

ICE40UP3K-UWG30ITR1K

Lattice Semiconductor

FPGA

Ball

30

VFBGA

Rectangular

Plastic/Epoxy

2800

Yes

1.26 V

350

CMOS

21

1.2

Tape and Reel

Grid Array, Very Thin Profile, Fine Pitch

BGA30,5X6,16

1.14 V

.4 mm

100 °C (212 °F)

9 ns

350 CLBS

-40 °C (-40 °F)

Bottom

R-PBGA-B30

1

.6 mm

2.114 mm

30 s

21

260 °C (500 °F)

2.537 mm

LAMXO640C-3TN100E

Lattice Semiconductor

FPGA

Automotive

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

640

Yes

3.465 V

80

AEC-Q100

74

1.8

Tray

1.8/2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

125 °C (257 °F)

80 CLBS

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

Also Operates at 2.5 V and 3.3 V nominal supply

e3

40 s

74

260 °C (500 °F)

14 mm

LAMXO640E-3TN144E

Lattice Semiconductor

FPGA

Automotive

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

640

Yes

1.26 V

80

AEC-Q100

113

1.2

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

125 °C (257 °F)

80 CLBS

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

40 s

113

260 °C (500 °F)

20 mm

LAXP2-17E-5FTN256E

Lattice Semiconductor

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

17000

Yes

1.26 V

AEC-Q100

201

17000

1.2

1.2,1.2/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

125 °C (257 °F)

17000 Gates

-40 °C (-40 °F)

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

435 MHz

40 s

201

260 °C (500 °F)

17 mm

LCMXO2-2000HC-5MG132I

Lattice Semiconductor

FPGA

Ball

132

BGA

Square

Plastic/Epoxy

2112

Yes

3.465 V

104

2.5

Tray

2.5/3.3 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

133 MHz

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-2000HE-6TG100I

Lattice Semiconductor

FPGA

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

2112

Yes

1.26 V

79

1.2

Tray

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

79

14 mm

LCMXO2-4000HC-6BG256C

Lattice Semiconductor

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

4320

Yes

3.465 V

206

2.5

Tray

2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

2.375 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

No

Also Operates at 3.3 V nominal supply

e1

30 s

206

260 °C (500 °F)

14 mm

LCMXO2-4000HC-6FTG256I

Lattice Semiconductor

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

4320

Yes

3.465 V

206

2.5

Tray

2.5/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

2.375 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Also Operates at 3.3 V nominal supply

e1

30 s

206

260 °C (500 °F)

17 mm

LCMXO2-4000HE-5MG132I

Lattice Semiconductor

FPGA

Ball

132

BGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-4000HE-5TG144I

Lattice Semiconductor

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4320

Yes

1.26 V

114

1.2

Tray

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

114

260 °C (500 °F)

20 mm

LCMXO2-4000HE-6TG144I

Lattice Semiconductor

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4320

Yes

1.26 V

114

1.2

Tray

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

114

260 °C (500 °F)

20 mm

LCMXO2-4000ZE-1FTG256C

Lattice Semiconductor

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

206

1.2

Tray

1.2 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

30 s

206

260 °C (500 °F)

17 mm

LCMXO2-4000ZE-2TG144I

Lattice Semiconductor

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4320

Yes

1.26 V

114

1.2

Tray

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

114

260 °C (500 °F)

20 mm

LCMXO2-4000ZE-3MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-4000ZE-3TG144I

Lattice Semiconductor

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4320

Yes

1.26 V

114

1.2

Tray

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

114

260 °C (500 °F)

20 mm

LCMXO2-7000HC-5TG144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6864

Yes

3.465 V

114

2.5

Tray

2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Also Operates at 3.3 V nominal supply

e3

30 s

114

260 °C (500 °F)

20 mm

LCMXO2-7000HE-4BG256C

Lattice Semiconductor

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

6864

Yes

1.26 V

206

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.14 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

No

e1

30 s

206

260 °C (500 °F)

14 mm

LCMXO2280C-5FTN324C

Lattice Semiconductor

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

2280

Yes

3.465 V

285

271

1.8

1.8/3.3 V

Grid Array, Low Profile

BGA324,18X18,40

Field Programmable Gate Arrays

1.71 V

1 mm

85 °C (185 °F)

285 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.7 mm

19 mm

No

e1

30 s

271

260 °C (500 °F)

19 mm

LCMXO3D-4300HC-6SG72C

Lattice Semiconductor

FPGA

Other

No Lead

72

HVQCCN

Square

4300

Yes

3.465 V

537

58

2.5

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.40SQ,20

2.375 V

.5 mm

85 °C (185 °F)

6.7 ns

537 CLBS

0 °C (32 °F)

Quad

S-XQCC-N72

.9 mm

10 mm

Also Operates at 3.3 V nominal supply

58

10 mm

LCMXO3LF-2100C-6BG324I

Lattice Semiconductor

FPGA

Ball

324

LFBGA

Square

Plastic/Epoxy

2100

Yes

3.465 V

264

279

2.5

Grid Array, Low Profile, Fine Pitch

2.375 V

.8 mm

100 °C (212 °F)

264 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.7 mm

15 mm

Also Operates at 3.3 V nominal supply

e1

30 s

279

260 °C (500 °F)

15 mm

LCMXO3LF-4300C-6BG324I

Lattice Semiconductor

FPGA

Ball

324

LFBGA

Square

Plastic/Epoxy

4300

Yes

3.465 V

540

279

2.5

Grid Array, Low Profile, Fine Pitch

2.375 V

.8 mm

100 °C (212 °F)

540 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.7 mm

15 mm

Also Operates at 3.3 V nominal supply

e1

30 s

279

260 °C (500 °F)

15 mm

LCMXO3LF-9400E-5BG400I

Lattice Semiconductor

FPGA

Tin Silver Copper

3

e1

30 s

260 °C (500 °F)

LFD2NX-40-9BG196I

Lattice Semiconductor

FPGA

Industrial

Ball

196

Square

Plastic/Epoxy

39000

Yes

1.05 V

9750

FDSOI

92

1

.95 V

.8 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B196

12 mm

92

12 mm

LFE2-12E-5FN256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12000

Yes

1.26 V

1500

193

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.358 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

311 MHz

40 s

193

250 °C (482 °F)

17 mm

LFE2-20E-7FN256C

Lattice Semiconductor

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

20000

Yes

1.26 V

2625

193

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.304 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

420 MHz

40 s

193

250 °C (482 °F)

17 mm

LFE2-6E-5FN256C

Lattice Semiconductor

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

6000

Yes

1.26 V

750

190

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.358 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

311 MHz

40 s

190

250 °C (482 °F)

17 mm

LFE2-6E-6FN256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

6000

Yes

1.26 V

750

190

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.331 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

357 MHz

40 s

190

250 °C (482 °F)

17 mm

LFE2-70SE-5FN672I

Lattice Semiconductor

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

70000

Yes

1.26 V

8500

500

1.2

1.2 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.358 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.6 mm

27 mm

No

e1

311 MHz

30 s

500

250 °C (482 °F)

27 mm

LFE2M100E-6FN900I

Lattice Semiconductor

FPGA

Industrial

Ball

900

BGA

Square

Plastic/Epoxy

100000

Yes

1.26 V

416

1.2

1.2 V

Grid Array

BGA900,30X30,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.331 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B900

3

2.6 mm

31 mm

No

e1

357 MHz

40 s

416

250 °C (482 °F)

31 mm

LFE2M35E-6FN256C

Lattice Semiconductor

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

35000

Yes

1.26 V

4250

140

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.331 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

357 MHz

40 s

140

250 °C (482 °F)

17 mm

LFE2M35E-7FN484C

Lattice Semiconductor

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

35000

Yes

1.26 V

4250

303

1.2

1.2 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.304 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

e1

420 MHz

303

250 °C (482 °F)

23 mm

LFE3-150EA-7FN1156I

Lattice Semiconductor

FPGA

Industrial

Ball

1156

BGA

Square

Plastic/Epoxy

149000

Yes

1.26 V

586

1.2

1.2 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.335 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

3

2.6 mm

35 mm

No

e1

420 MHz

30 s

586

250 °C (482 °F)

35 mm

LFE3-150EA-8FN672I

Lattice Semiconductor

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

149000

Yes

1.26 V

380

1.2

1.2 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.281 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.6 mm

27 mm

No

e1

500 MHz

30 s

380

250 °C (482 °F)

27 mm

LFE3-35EA-6FN672C

Lattice Semiconductor

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

33000

Yes

1.26 V

310

1.2

1.2 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.379 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.6 mm

27 mm

No

e1

375 MHz

30 s

310

250 °C (482 °F)

27 mm

LFE3-35EA-6FN672I

Lattice Semiconductor

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

33000

Yes

1.26 V

310

1.2

1.2 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.379 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.6 mm

27 mm

No

e1

375 MHz

30 s

310

250 °C (482 °F)

27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.