Lattice Semiconductor Field Programmable Gate Arrays (FPGA) 914

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LFXP2-17E-6FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS		201	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LIF-MDF6000-6UMG64I	Lattice Semiconductor	FPGA	Industrial	Ball	64	VFBGA	Square	Plastic/Epoxy	5936	Yes	1.26 V	742			29	1.2			Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16		1.14 V	.4 mm	100 °C (212 °F)		742 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B64		1 mm	3.5 mm						29		3.5 mm
LIFCL-17-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V				48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm					30 s	48	260 °C (500 °F)	6 mm
ICE5LP4K-SWG36ITR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS		26	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9 ns	440 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36	1	.491 mm	2.078 mm					30 s	26	260 °C (500 °F)	2.078 mm
LAE5UM-25F-6BG381E	Lattice Semiconductor	FPGA																													3							30 s		260 °C (500 °F)
LCMXO1200C-3TN144I	Lattice Semiconductor	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1200	Yes	3.465 V	150			113	1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		150 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		40 s	113	260 °C (500 °F)	20 mm
LCMXO1200C-4MN132I	Lattice Semiconductor	FPGA	Industrial	Ball	132	LFBGA	Square	Plastic/Epoxy	1200	Yes	3.465 V	150			101	1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		40 s	101	260 °C (500 °F)	8 mm
LCMXO1200C-4TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1200	Yes	3.465 V	150			113	1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		40 s	113	260 °C (500 °F)	20 mm
LCMXO2-2000UHC-4FG484C	Lattice Semiconductor	FPGA	Other	Ball	484	HBGA	Square	Plastic/Epoxy	2112	Yes	3.465 V				278	2.5	Tray	2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	278	250 °C (482 °F)	23 mm
LCMXO2-4000HC-4FG484C	Lattice Semiconductor	FPGA	Other	Ball	484	HBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				278	2.5	Tray	2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	278	250 °C (482 °F)	23 mm
LCMXO2-640HC-5TG100I	Lattice Semiconductor	FPGA		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	640	Yes	3.465 V	80			78	2.5	Tray	2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e3			78		14 mm
LCMXO3D-9400HC-6BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175			335	2.5			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		2.375 V	.8 mm	85 °C (185 °F)	6.7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm		Also Operates at 3.3 V nominal supply				335		17 mm
LCMXO3L-2100E-5MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	2100	Yes	1.26 V	264			206	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1			206	260 °C (500 °F)	9 mm
LCMXO3L-2100E-5UWG49ITR1K	Lattice Semiconductor	FPGA		Ball	49	VFBGA	Rectangular	Plastic/Epoxy	2100	Yes	1.26 V	264			38	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1			38	260 °C (500 °F)	3.185 mm
LCMXO3L-2100E-5UWG49ITR50	Lattice Semiconductor	FPGA		Ball	49	VFBGA	Rectangular	Plastic/Epoxy	2100	Yes	1.26 V	264			38	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1			38	260 °C (500 °F)	3.185 mm
LCMXO3LF-6900E-6MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	858				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1				260 °C (500 °F)	9 mm
LFCPNX-100-7ASG256C	Lattice Semiconductor	FPGA																													3									260 °C (500 °F)
LFD2NX-17-8MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI		23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFE2-20E-6QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	20000	Yes	1.26 V	2625			131	1.2		1.2 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.331 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	357 MHz	40 s	131	245 °C (473 °F)	28 mm
LFE2-35E-5FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	35000	Yes	1.26 V	4000			331	1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	311 MHz		331	250 °C (482 °F)	23 mm
LFE5U-25F-7TG144I	Lattice Semiconductor	FPGA																													3							30 s		260 °C (500 °F)
LFE5U-85F-8MG285C	Lattice Semiconductor	FPGA	Other	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	10500				1.1			Grid Array, Low Profile, Fine Pitch			1.045 V	.5 mm	85 °C (185 °F)		10500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
LFE5UM-85F-6BG381C	Lattice Semiconductor	FPGA																													3
LFXP3C-3TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	384	Yes	3.465 V	384	CMOS		62	1.8		1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.63 ns	384 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	375 MHz	40 s	62	260 °C (500 °F)	14 mm
LFXP6E-3FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	720	Yes	1.26 V	720	CMOS		188	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.63 ns	720 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	375 MHz	40 s	188	250 °C (482 °F)	17 mm
LIFCL-17-8BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V				48	1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	48	260 °C (500 °F)	14 mm
LIFCL-40-9BG400I	Lattice Semiconductor	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		74	1			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.7 mm	17 mm					30 s	74	260 °C (500 °F)	17 mm
ICE40HX4K-BG121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	440	CMOS			1.2			Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)		440 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm			e2				260 °C (500 °F)	9 mm
ICE40LP1K-CM36TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS		25	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm			e1			25	260 °C (500 °F)	2.5 mm
LAMXO256E-3TN100E	Lattice Semiconductor	FPGA	Automotive	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	256	Yes	1.26 V	32		AEC-Q100	78	1.2		1.2 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		32 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		40 s	78	260 °C (500 °F)	14 mm
LCMXO2-2000ZE-1TG144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2112	Yes	1.26 V				111	1.2	Tray	1.2 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s	111	260 °C (500 °F)	20 mm
LCMXO2-4000HC-5FTG256I	Lattice Semiconductor	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	17 mm
LCMXO2-7000HE-4BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6864	Yes	1.26 V				206	1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2280C-3BN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285			211	1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.71 V	.8 mm	100 °C (212 °F)		285 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1			211	260 °C (500 °F)	14 mm
LCMXO3LF-4300E-5UWG81CTR	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1				260 °C (500 °F)	3.797 mm
LCMXO640C-3BN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80			159	1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.71 V	.8 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1			159	260 °C (500 °F)	14 mm
LFD2NX-40-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-8BG196C	Lattice Semiconductor	FPGA	Other	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		92	1						.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B196			12 mm						92		12 mm
LFE2-12E-5F484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V				297	1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	311 MHz	30 s	297	225 °C (437 °F)	23 mm
LFE2-12E-6F484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V				297	1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	357 MHz	30 s	297	225 °C (437 °F)	23 mm
LFE2-12E-6FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500			193	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	357 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2-12SE-5FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500			297	1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	311 MHz		297	250 °C (482 °F)	23 mm
LFE2-6SE-6FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	6000	Yes	1.26 V	750			190	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	357 MHz	40 s	190	250 °C (482 °F)	17 mm
LFE3-35EA-7FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V				295	1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.335 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	420 MHz		295	250 °C (482 °F)	23 mm
LFE5U-25F-6MG285I	Lattice Semiconductor	FPGA																										Tin Silver Copper			3					e1		30 s		260 °C (500 °F)
LFE5U-25F-8TG144C	Lattice Semiconductor	FPGA																													3							30 s		260 °C (500 °F)
LFE5UM-85F-7BG381C	Lattice Semiconductor	FPGA																													3

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.