Lattice Semiconductor Field Programmable Gate Arrays (FPGA) 914

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

LFE2-70SE-5FN672C

Lattice Semiconductor

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

70000

Yes

1.26 V

8500

500

1.2

1.2 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.358 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.6 mm

27 mm

No

e1

311 MHz

30 s

500

250 °C (482 °F)

27 mm

LFE5UM5G-85F-8BG381I

Lattice Semiconductor

FPGA

3

260 °C (500 °F)

LFMXO5-25-8BBG400I

Lattice Semiconductor

FPGA

Ball

400

LFBGA

Square

Plastic/Epoxy

25000

Yes

1.05 V

3125

FDSOI

252

1

Grid Array, Low Profile, Fine Pitch

.95 V

.8 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B400

1.7 mm

17 mm

252

17 mm

LIF-MD6000-6KMG80I

Lattice Semiconductor

FPGA

LIFCL-17-8SG72C

Lattice Semiconductor

FPGA

Other

No Lead

72

HVQCCN

Square

17000

Yes

1.05 V

22

1

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.40SQ,20

.95 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Quad

S-XQCC-N72

3

.9 mm

10 mm

30 s

22

260 °C (500 °F)

10 mm

ICE40LP8K-CM121TR1K

Lattice Semiconductor

FPGA

Industrial

Ball

121

VFBGA

Square

Plastic/Epoxy

7680

Yes

1.26 V

960

CMOS

93

1.2

Tape and Reel

Grid Array, Very Thin Profile, Fine Pitch

BGA121,11X11,16

1.14 V

.4 mm

100 °C (212 °F)

9.36 ns

960 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

5 mm

e1

133 MHz

93

260 °C (500 °F)

5 mm

LCMXO2-1200HC-6MG132I

Lattice Semiconductor

FPGA

Ball

132

BGA

Square

Plastic/Epoxy

1280

Yes

3.465 V

104

2.5

Tray

2.5/3.3 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

133 MHz

30 s

104

250 °C (482 °F)

8 mm

LCMXO3L-4300E-5UWG81ITR

Lattice Semiconductor

FPGA

Ball

81

VFBGA

Rectangular

Plastic/Epoxy

4300

Yes

1.26 V

540

63

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

540 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B81

1

.567 mm

3.693 mm

e1

63

260 °C (500 °F)

3.797 mm

LCMXO3LF-4300E-5UWG81ITR

Lattice Semiconductor

FPGA

Ball

81

VFBGA

Rectangular

Plastic/Epoxy

4300

Yes

1.26 V

540

63

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

540 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B81

1

.567 mm

3.693 mm

e1

63

260 °C (500 °F)

3.797 mm

LFE5U-12F-6BG381I

Lattice Semiconductor

FPGA

Ball

381

FBGA

Square

Plastic/Epoxy

Yes

1.155 V

1500

197

1.1

Grid Array, Fine Pitch

BGA381,20X20,32

1.045 V

.8 mm

100 °C (212 °F)

1500 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B381

3

1.76 mm

17 mm

197

260 °C (500 °F)

17 mm

LFE5UM5G-45F-8BG381C

Lattice Semiconductor

FPGA

3

260 °C (500 °F)

LFMXO5-25-8BBG400C

Lattice Semiconductor

FPGA

Ball

400

LFBGA

Square

Plastic/Epoxy

25000

Yes

1.05 V

3125

FDSOI

252

1

Grid Array, Low Profile, Fine Pitch

.95 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B400

1.7 mm

17 mm

252

17 mm

LFXP2-8E-6FTN256C

Lattice Semiconductor

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

201

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.399 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

435 MHz

201

260 °C (500 °F)

17 mm

ICE40LP4K-CM81TR1K

Lattice Semiconductor

FPGA

Industrial

Ball

81

VFBGA

Square

Plastic/Epoxy

3520

Yes

1.26 V

440

CMOS

63

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

9.36 ns

440 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B81

3

1 mm

4 mm

e1

30 s

63

260 °C (500 °F)

4 mm

ICE40LP8K-CM121TR

Lattice Semiconductor

FPGA

Industrial

Ball

121

VFBGA

Square

Plastic/Epoxy

7680

Yes

1.26 V

960

CMOS

93

1.2

Tape and Reel

Grid Array, Very Thin Profile, Fine Pitch

BGA121,11X11,16

1.14 V

.4 mm

100 °C (212 °F)

9.36 ns

960 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

5 mm

e1

133 MHz

93

260 °C (500 °F)

5 mm

LCMXO2-256HC-5TG100I

Lattice Semiconductor

FPGA

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

256

Yes

3.465 V

55

2.5

Tray

2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

Also Operates at 3.3 V nominal supply

e3

30 s

55

260 °C (500 °F)

14 mm

LCMXO3L-1300E-5MG256I

Lattice Semiconductor

FPGA

Ball

256

VFBGA

Square

Plastic/Epoxy

1300

Yes

1.26 V

160

206

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.5 mm

100 °C (212 °F)

160 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1 mm

9 mm

e1

206

260 °C (500 °F)

9 mm

LFE2-20E-5FN256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

20000

Yes

1.26 V

2625

193

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.358 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

311 MHz

40 s

193

250 °C (482 °F)

17 mm

LFE2M20SE-7FN256C

Lattice Semiconductor

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

20000

Yes

1.26 V

2375

140

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.304 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

420 MHz

40 s

140

250 °C (482 °F)

17 mm

LFE3-17EA-6LMG328I

Lattice Semiconductor

FPGA

Ball

328

LFBGA

Square

Plastic/Epoxy

17000

Yes

1.26 V

116

1.2

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA328,19X19,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.379 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B328

3

1.5 mm

10 mm

No

e1

375 MHz

30 s

116

260 °C (500 °F)

10 mm

LFMXO5-25-7BBG256C

Lattice Semiconductor

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

25000

Yes

1.05 V

3125

FDSOI

160

1

Grid Array, Low Profile, Fine Pitch

.95 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

1.7 mm

14 mm

160

14 mm

LFMXO5-25-7BBG400C

Lattice Semiconductor

FPGA

Ball

400

LFBGA

Square

Plastic/Epoxy

25000

Yes

1.05 V

3125

FDSOI

252

1

Grid Array, Low Profile, Fine Pitch

.95 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B400

1.7 mm

17 mm

252

17 mm

LFMXO5-25-8BBG256C

Lattice Semiconductor

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

25000

Yes

1.05 V

3125

FDSOI

160

1

Grid Array, Low Profile, Fine Pitch

.95 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

1.7 mm

14 mm

160

14 mm

LFXP2-8E-6FTN256I

Lattice Semiconductor

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

201

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.399 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

435 MHz

201

260 °C (500 °F)

17 mm

LCMXO1200C-3BN256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

LFBGA

Square

Plastic/Epoxy

1200

Yes

3.465 V

150

211

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.71 V

.8 mm

100 °C (212 °F)

150 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

No

e1

211

260 °C (500 °F)

14 mm

LCMXO2-4000HE-4BG256I

Lattice Semiconductor

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

206

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.14 V

.8 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

No

e1

30 s

206

260 °C (500 °F)

14 mm

LCMXO3D-9400HC-5BG256I

Lattice Semiconductor

FPGA

Industrial

Ball

256

LFBGA

Square

Plastic/Epoxy

9400

Yes

3.465 V

1175

206

2.5

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

2.375 V

.8 mm

100 °C (212 °F)

7 ns

1175 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B256

1.7 mm

14 mm

Also Operates at 3.3 V nominal supply

206

14 mm

LCMXO3L-2100E-6MG121C

Lattice Semiconductor

FPGA

Other

Ball

121

VFBGA

Square

Plastic/Epoxy

Yes

1.26 V

264

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

264 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

6 mm

e1

260 °C (500 °F)

6 mm

LCMXO3L-6900C-5BG256C

Lattice Semiconductor

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

Yes

3.465 V

858

2.5

Grid Array, Low Profile, Fine Pitch

2.375 V

.8 mm

85 °C (185 °F)

858 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

Also Operates at 3.3 V nominal supply

e1

30 s

260 °C (500 °F)

14 mm

LCMXO3LF-2100E-5UWG49ITR1K

Lattice Semiconductor

FPGA

Ball

49

VFBGA

Rectangular

Plastic/Epoxy

2100

Yes

1.26 V

264

38

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

264 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B49

3

.6 mm

3.106 mm

e1

38

260 °C (500 °F)

3.185 mm

LFD2NX-17-7MG121I

Lattice Semiconductor

FPGA

Industrial

Ball

121

VFBGA

Square

Plastic/Epoxy

17000

Yes

1.05 V

4250

FDSOI

23

1

Grid Array, Very Thin Profile, Fine Pitch

BGA121,11X11,20

.95 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

6 mm

e1

30 s

23

260 °C (500 °F)

6 mm

LFE5U-45F-7BG256C

Lattice Semiconductor

FPGA

Tin Silver Copper

3

e1

30 s

260 °C (500 °F)

LFE5U-85F-6BG381C

Lattice Semiconductor

FPGA

3

260 °C (500 °F)

LFE5U-85F-8BG554I

Lattice Semiconductor

FPGA

Tin Silver Copper

3

e1

30 s

260 °C (500 °F)

LFE5UM-25F-7BG381C

Lattice Semiconductor

FPGA

3

260 °C (500 °F)

LFMXO5-25-9BBG400C

Lattice Semiconductor

FPGA

Ball

400

LFBGA

Square

Plastic/Epoxy

25000

Yes

1.05 V

3125

FDSOI

252

1

Grid Array, Low Profile, Fine Pitch

.95 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B400

1.7 mm

17 mm

252

17 mm

LFXP6C-5TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

720

Yes

3.465 V

720

CMOS

100

1.8

1.8/2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.44 ns

720 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

375 MHz

40 s

100

260 °C (500 °F)

20 mm

ICE5LP4K-CM36ITR50

Lattice Semiconductor

FPGA

3

30 s

260 °C (500 °F)

LCMXO2-1200ZE-1MG132IR1

Lattice Semiconductor

FPGA

Ball

132

BGA

Square

Plastic/Epoxy

1280

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

133 MHz

30 s

104

260 °C (500 °F)

8 mm

LCMXO2-2000HC-6TG100I

Lattice Semiconductor

FPGA

Gull Wing

100

QFP

Square

Plastic/Epoxy

2112

Yes

3.465 V

79

2.5

Tray

2.5/3.3 V

Flatpack

QFP100,.63SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

Also Operates at 3.3 V nominal supply

e3

79

14 mm

LCMXO2-4000HE-6MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-4000ZE-1MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-7000HC-4BG332I

Lattice Semiconductor

FPGA

Ball

332

FBGA

Square

Plastic/Epoxy

6864

Yes

3.465 V

278

2.5

Tray

2.5/3.3 V

Grid Array, Fine Pitch

BGA332,20X20,32

Field Programmable Gate Arrays

2.375 V

.8 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B332

3

2 mm

17 mm

No

Also Operates at 3.3 V nominal supply

e1

30 s

278

260 °C (500 °F)

17 mm

LCMXO2-7000HC-4FG484C

Lattice Semiconductor

FPGA

Other

Ball

484

HBGA

Square

Plastic/Epoxy

6864

Yes

3.465 V

334

2.5

Tray

2.5/3.3 V

Grid Array, Heat Sink/Slug

BGA484,22X22,40

Field Programmable Gate Arrays

2.375 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.6 mm

23 mm

No

Also Operates at 3.3 V nominal supply

e1

30 s

334

250 °C (482 °F)

23 mm

LCMXO3L-4300E-5UWG81CTR

Lattice Semiconductor

FPGA

Other

Ball

81

VFBGA

Rectangular

Plastic/Epoxy

Yes

1.26 V

540

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

85 °C (185 °F)

540 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B81

1

.567 mm

3.693 mm

e1

260 °C (500 °F)

3.797 mm

LCMXO3LF-2100E-5UWG49CTR50

Lattice Semiconductor

FPGA

Other

Ball

49

VFBGA

Rectangular

Plastic/Epoxy

Yes

1.26 V

264

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

85 °C (185 °F)

264 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B49

3

.6 mm

3.106 mm

e1

260 °C (500 °F)

3.185 mm

LCMXO3LF-6900E-5MG256I

Lattice Semiconductor

FPGA

Ball

256

VFBGA

Square

Plastic/Epoxy

6900

Yes

1.26 V

858

206

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.5 mm

100 °C (212 °F)

858 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1 mm

9 mm

e1

206

260 °C (500 °F)

9 mm

LFE2-6E-6TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6000

Yes

1.26 V

750

90

1.2

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.331 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

357 MHz

40 s

90

260 °C (500 °F)

20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.