Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Lattice Semiconductor |
FPGA |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
70000 |
Yes |
1.26 V |
8500 |
500 |
1.2 |
1.2 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 °C (185 °F) |
0.358 ns |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
3 |
2.6 mm |
27 mm |
No |
e1 |
311 MHz |
30 s |
500 |
250 °C (482 °F) |
27 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
3 |
260 °C (500 °F) |
||||||||||||||||||||||||||||||||||||||||
Lattice Semiconductor |
FPGA |
Ball |
400 |
LFBGA |
Square |
Plastic/Epoxy |
25000 |
Yes |
1.05 V |
3125 |
FDSOI |
252 |
1 |
Grid Array, Low Profile, Fine Pitch |
.95 V |
.8 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B400 |
1.7 mm |
17 mm |
252 |
17 mm |
||||||||||||||||||||
|
Lattice Semiconductor |
FPGA |
||||||||||||||||||||||||||||||||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
No Lead |
72 |
HVQCCN |
Square |
17000 |
Yes |
1.05 V |
22 |
1 |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC72,.40SQ,20 |
.95 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Quad |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
30 s |
22 |
260 °C (500 °F) |
10 mm |
|||||||||||||||||
|
Lattice Semiconductor |
FPGA |
Industrial |
Ball |
121 |
VFBGA |
Square |
Plastic/Epoxy |
7680 |
Yes |
1.26 V |
960 |
CMOS |
93 |
1.2 |
Tape and Reel |
Grid Array, Very Thin Profile, Fine Pitch |
BGA121,11X11,16 |
1.14 V |
.4 mm |
100 °C (212 °F) |
9.36 ns |
960 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B121 |
3 |
1 mm |
5 mm |
e1 |
133 MHz |
93 |
260 °C (500 °F) |
5 mm |
|||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
132 |
BGA |
Square |
Plastic/Epoxy |
1280 |
Yes |
3.465 V |
104 |
2.5 |
Tray |
2.5/3.3 V |
Grid Array |
BGA132,14X14,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B132 |
3 |
1.35 mm |
8 mm |
No |
Also Operates at 3.3 V nominal supply |
e1 |
133 MHz |
30 s |
104 |
250 °C (482 °F) |
8 mm |
|||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
81 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4300 |
Yes |
1.26 V |
540 |
63 |
1.2 |
Grid Array, Very Thin Profile, Fine Pitch |
1.14 V |
.4 mm |
100 °C (212 °F) |
540 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B81 |
1 |
.567 mm |
3.693 mm |
e1 |
63 |
260 °C (500 °F) |
3.797 mm |
|||||||||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
81 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4300 |
Yes |
1.26 V |
540 |
63 |
1.2 |
Grid Array, Very Thin Profile, Fine Pitch |
1.14 V |
.4 mm |
100 °C (212 °F) |
540 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B81 |
1 |
.567 mm |
3.693 mm |
e1 |
63 |
260 °C (500 °F) |
3.797 mm |
|||||||||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
381 |
FBGA |
Square |
Plastic/Epoxy |
Yes |
1.155 V |
1500 |
197 |
1.1 |
Grid Array, Fine Pitch |
BGA381,20X20,32 |
1.045 V |
.8 mm |
100 °C (212 °F) |
1500 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B381 |
3 |
1.76 mm |
17 mm |
197 |
260 °C (500 °F) |
17 mm |
|||||||||||||||||
|
Lattice Semiconductor |
FPGA |
3 |
260 °C (500 °F) |
||||||||||||||||||||||||||||||||||||||||
Lattice Semiconductor |
FPGA |
Ball |
400 |
LFBGA |
Square |
Plastic/Epoxy |
25000 |
Yes |
1.05 V |
3125 |
FDSOI |
252 |
1 |
Grid Array, Low Profile, Fine Pitch |
.95 V |
.8 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B400 |
1.7 mm |
17 mm |
252 |
17 mm |
||||||||||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
8000 |
Yes |
1.26 V |
1000 |
CMOS |
201 |
1.2 |
1.2,1.2/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 °C (185 °F) |
0.399 ns |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
435 MHz |
201 |
260 °C (500 °F) |
17 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
Industrial |
Ball |
81 |
VFBGA |
Square |
Plastic/Epoxy |
3520 |
Yes |
1.26 V |
440 |
CMOS |
63 |
1.2 |
Grid Array, Very Thin Profile, Fine Pitch |
1.14 V |
.4 mm |
100 °C (212 °F) |
9.36 ns |
440 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B81 |
3 |
1 mm |
4 mm |
e1 |
30 s |
63 |
260 °C (500 °F) |
4 mm |
|||||||||||
|
Lattice Semiconductor |
FPGA |
Industrial |
Ball |
121 |
VFBGA |
Square |
Plastic/Epoxy |
7680 |
Yes |
1.26 V |
960 |
CMOS |
93 |
1.2 |
Tape and Reel |
Grid Array, Very Thin Profile, Fine Pitch |
BGA121,11X11,16 |
1.14 V |
.4 mm |
100 °C (212 °F) |
9.36 ns |
960 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B121 |
3 |
1 mm |
5 mm |
e1 |
133 MHz |
93 |
260 °C (500 °F) |
5 mm |
|||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
3.465 V |
55 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
30 s |
55 |
260 °C (500 °F) |
14 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
256 |
VFBGA |
Square |
Plastic/Epoxy |
1300 |
Yes |
1.26 V |
160 |
206 |
1.2 |
Grid Array, Very Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
100 °C (212 °F) |
160 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
1 mm |
9 mm |
e1 |
206 |
260 °C (500 °F) |
9 mm |
|||||||||||||||
|
Lattice Semiconductor |
FPGA |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
20000 |
Yes |
1.26 V |
2625 |
193 |
1.2 |
1.2 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 °C (185 °F) |
0.358 ns |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
311 MHz |
40 s |
193 |
250 °C (482 °F) |
17 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
20000 |
Yes |
1.26 V |
2375 |
140 |
1.2 |
1.2 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 °C (185 °F) |
0.304 ns |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
420 MHz |
40 s |
140 |
250 °C (482 °F) |
17 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
328 |
LFBGA |
Square |
Plastic/Epoxy |
17000 |
Yes |
1.26 V |
116 |
1.2 |
1.2 V |
Grid Array, Low Profile, Fine Pitch |
BGA328,19X19,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.379 ns |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B328 |
3 |
1.5 mm |
10 mm |
No |
e1 |
375 MHz |
30 s |
116 |
260 °C (500 °F) |
10 mm |
||||||||||
Lattice Semiconductor |
FPGA |
Ball |
256 |
LFBGA |
Square |
Plastic/Epoxy |
25000 |
Yes |
1.05 V |
3125 |
FDSOI |
160 |
1 |
Grid Array, Low Profile, Fine Pitch |
.95 V |
.8 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B256 |
1.7 mm |
14 mm |
160 |
14 mm |
||||||||||||||||||||
Lattice Semiconductor |
FPGA |
Ball |
400 |
LFBGA |
Square |
Plastic/Epoxy |
25000 |
Yes |
1.05 V |
3125 |
FDSOI |
252 |
1 |
Grid Array, Low Profile, Fine Pitch |
.95 V |
.8 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B400 |
1.7 mm |
17 mm |
252 |
17 mm |
||||||||||||||||||||
Lattice Semiconductor |
FPGA |
Ball |
256 |
LFBGA |
Square |
Plastic/Epoxy |
25000 |
Yes |
1.05 V |
3125 |
FDSOI |
160 |
1 |
Grid Array, Low Profile, Fine Pitch |
.95 V |
.8 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B256 |
1.7 mm |
14 mm |
160 |
14 mm |
||||||||||||||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
8000 |
Yes |
1.26 V |
1000 |
CMOS |
201 |
1.2 |
1.2,1.2/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
100 °C (212 °F) |
0.399 ns |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
435 MHz |
201 |
260 °C (500 °F) |
17 mm |
|||||||||
|
Lattice Semiconductor |
FPGA |
Industrial |
Ball |
256 |
LFBGA |
Square |
Plastic/Epoxy |
1200 |
Yes |
3.465 V |
150 |
211 |
1.8 |
1.8/3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA256,16X16,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
100 °C (212 °F) |
150 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
1.7 mm |
14 mm |
No |
e1 |
211 |
260 °C (500 °F) |
14 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
256 |
LFBGA |
Square |
Plastic/Epoxy |
4320 |
Yes |
1.26 V |
206 |
1.2 |
Tray |
1.2 V |
Grid Array, Low Profile, Fine Pitch |
BGA256,16X16,32 |
Field Programmable Gate Arrays |
1.14 V |
.8 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B256 |
3 |
1.7 mm |
14 mm |
No |
e1 |
30 s |
206 |
260 °C (500 °F) |
14 mm |
|||||||||||
|
Lattice Semiconductor |
FPGA |
Industrial |
Ball |
256 |
LFBGA |
Square |
Plastic/Epoxy |
9400 |
Yes |
3.465 V |
1175 |
206 |
2.5 |
Grid Array, Low Profile, Fine Pitch |
BGA256,16X16,32 |
2.375 V |
.8 mm |
100 °C (212 °F) |
7 ns |
1175 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B256 |
1.7 mm |
14 mm |
Also Operates at 3.3 V nominal supply |
206 |
14 mm |
|||||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Ball |
121 |
VFBGA |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
264 |
1.2 |
Grid Array, Very Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
264 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B121 |
3 |
1 mm |
6 mm |
e1 |
260 °C (500 °F) |
6 mm |
|||||||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Ball |
256 |
LFBGA |
Square |
Plastic/Epoxy |
Yes |
3.465 V |
858 |
2.5 |
Grid Array, Low Profile, Fine Pitch |
2.375 V |
.8 mm |
85 °C (185 °F) |
858 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
1.7 mm |
14 mm |
Also Operates at 3.3 V nominal supply |
e1 |
30 s |
260 °C (500 °F) |
14 mm |
|||||||||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
49 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2100 |
Yes |
1.26 V |
264 |
38 |
1.2 |
Grid Array, Very Thin Profile, Fine Pitch |
1.14 V |
.4 mm |
100 °C (212 °F) |
264 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B49 |
3 |
.6 mm |
3.106 mm |
e1 |
38 |
260 °C (500 °F) |
3.185 mm |
|||||||||||||||
|
Lattice Semiconductor |
FPGA |
Industrial |
Ball |
121 |
VFBGA |
Square |
Plastic/Epoxy |
17000 |
Yes |
1.05 V |
4250 |
FDSOI |
23 |
1 |
Grid Array, Very Thin Profile, Fine Pitch |
BGA121,11X11,20 |
.95 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B121 |
3 |
1 mm |
6 mm |
e1 |
30 s |
23 |
260 °C (500 °F) |
6 mm |
||||||||||||
|
Lattice Semiconductor |
FPGA |
Tin Silver Copper |
3 |
e1 |
30 s |
260 °C (500 °F) |
|||||||||||||||||||||||||||||||||||||
|
Lattice Semiconductor |
FPGA |
3 |
260 °C (500 °F) |
||||||||||||||||||||||||||||||||||||||||
|
Lattice Semiconductor |
FPGA |
Tin Silver Copper |
3 |
e1 |
30 s |
260 °C (500 °F) |
|||||||||||||||||||||||||||||||||||||
|
Lattice Semiconductor |
FPGA |
3 |
260 °C (500 °F) |
||||||||||||||||||||||||||||||||||||||||
Lattice Semiconductor |
FPGA |
Ball |
400 |
LFBGA |
Square |
Plastic/Epoxy |
25000 |
Yes |
1.05 V |
3125 |
FDSOI |
252 |
1 |
Grid Array, Low Profile, Fine Pitch |
.95 V |
.8 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B400 |
1.7 mm |
17 mm |
252 |
17 mm |
||||||||||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
720 |
Yes |
3.465 V |
720 |
CMOS |
100 |
1.8 |
1.8/2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.44 ns |
720 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
375 MHz |
40 s |
100 |
260 °C (500 °F) |
20 mm |
||||||
|
Lattice Semiconductor |
FPGA |
3 |
30 s |
260 °C (500 °F) |
|||||||||||||||||||||||||||||||||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
132 |
BGA |
Square |
Plastic/Epoxy |
1280 |
Yes |
1.26 V |
104 |
1.2 |
Tray |
1.2 V |
Grid Array |
BGA132,14X14,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B132 |
3 |
1.35 mm |
8 mm |
No |
e1 |
133 MHz |
30 s |
104 |
260 °C (500 °F) |
8 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
2112 |
Yes |
3.465 V |
79 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
79 |
14 mm |
||||||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
132 |
LFBGA |
Square |
Plastic/Epoxy |
4320 |
Yes |
1.26 V |
104 |
1.2 |
Tray |
1.2 V |
Grid Array, Low Profile, Fine Pitch |
BGA132,14X14,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B132 |
3 |
1.35 mm |
8 mm |
No |
e1 |
30 s |
104 |
250 °C (482 °F) |
8 mm |
|||||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
132 |
LFBGA |
Square |
Plastic/Epoxy |
4320 |
Yes |
1.26 V |
104 |
1.2 |
Tray |
1.2 V |
Grid Array, Low Profile, Fine Pitch |
BGA132,14X14,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B132 |
3 |
1.35 mm |
8 mm |
No |
e1 |
30 s |
104 |
250 °C (482 °F) |
8 mm |
|||||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
332 |
FBGA |
Square |
Plastic/Epoxy |
6864 |
Yes |
3.465 V |
278 |
2.5 |
Tray |
2.5/3.3 V |
Grid Array, Fine Pitch |
BGA332,20X20,32 |
Field Programmable Gate Arrays |
2.375 V |
.8 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B332 |
3 |
2 mm |
17 mm |
No |
Also Operates at 3.3 V nominal supply |
e1 |
30 s |
278 |
260 °C (500 °F) |
17 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Ball |
484 |
HBGA |
Square |
Plastic/Epoxy |
6864 |
Yes |
3.465 V |
334 |
2.5 |
Tray |
2.5/3.3 V |
Grid Array, Heat Sink/Slug |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
2.375 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
No |
Also Operates at 3.3 V nominal supply |
e1 |
30 s |
334 |
250 °C (482 °F) |
23 mm |
|||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Ball |
81 |
VFBGA |
Rectangular |
Plastic/Epoxy |
Yes |
1.26 V |
540 |
1.2 |
Grid Array, Very Thin Profile, Fine Pitch |
1.14 V |
.4 mm |
85 °C (185 °F) |
540 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B81 |
1 |
.567 mm |
3.693 mm |
e1 |
260 °C (500 °F) |
3.797 mm |
|||||||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Ball |
49 |
VFBGA |
Rectangular |
Plastic/Epoxy |
Yes |
1.26 V |
264 |
1.2 |
Grid Array, Very Thin Profile, Fine Pitch |
1.14 V |
.4 mm |
85 °C (185 °F) |
264 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B49 |
3 |
.6 mm |
3.106 mm |
e1 |
260 °C (500 °F) |
3.185 mm |
|||||||||||||||||
|
Lattice Semiconductor |
FPGA |
Ball |
256 |
VFBGA |
Square |
Plastic/Epoxy |
6900 |
Yes |
1.26 V |
858 |
206 |
1.2 |
Grid Array, Very Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
100 °C (212 °F) |
858 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
1 mm |
9 mm |
e1 |
206 |
260 °C (500 °F) |
9 mm |
|||||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6000 |
Yes |
1.26 V |
750 |
90 |
1.2 |
1.2 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.331 ns |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
357 MHz |
40 s |
90 |
260 °C (500 °F) |
20 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.