Field Programmable Gate Arrays (FPGA)

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LFXP2-17E-6FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS		201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LIF-MDF6000-6UMG64I	Lattice Semiconductor	FPGA	Industrial	Ball	64	VFBGA	Square		Plastic/Epoxy	5936	Yes	1.26 V	742			29		1.2			Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16		1.14 V	.4 mm	100 °C (212 °F)		742 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B64		1 mm	3.5 mm						29		3.5 mm
LIFCL-17-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square		Plastic/Epoxy	17000	Yes	1.05 V				48		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm					30 s	48	260 °C (500 °F)	6 mm
M1A3P400-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	1.575 V	9216	CMOS			400000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		9216 CLBS, 400000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
M2GL050-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2GL050T-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	267	225 °C (437 °F)	23 mm
M2GL090TS-1FCSG325	Microchip Technology	FPGA	Other		325				Plastic	86316	Yes			CMOS		180		1.2	Tray	1.2 V		BGA325,21X21,20	Field Programmable Gate Arrays			85 °C (185 °F)			0 °C (32 °F)				3			No					180
M2S005-1VFG400I	Microchip Technology	FPGA		Ball	400	LFBGA	Square		Plastic/Epoxy	6060	Yes	1.26 V				171		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.51 mm	17 mm					40 s	171	250 °C (482 °F)	17 mm
M2S060-FCSG325I	Microchip Technology	FPGA		Ball	325	TFBGA	Square		Plastic/Epoxy	56520	Yes	1.26 V				200		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.01 mm	11 mm					40 s	200	250 °C (482 °F)	11 mm
MPF300T-1FCSG536I	Microchip Technology	FPGA		Ball	536	LFBGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS		300		1			Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B536		1.45 mm	16 mm		It also Operates at 1.05 V nominal supply				300		16 mm
MPF300T-1FCVG484E	Microchip Technology	FPGA		Ball	484	FBGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS		284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
MPF300T-FCG1152E	Microchip Technology	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS		512		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				512		35 mm
MPF500T-FCG784E	Microchip Technology	FPGA		Ball	784	BGA	Square		Plastic/Epoxy	481000	Yes	1.03 V		CMOS		388		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				388		29 mm
MPF500TLS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	481000	Yes	1.03 V		CMOS		584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TLSFCG1152I	Microsemi	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	481000	Yes	1.03 V		CMOS		584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
RT4G150-1CB1657PROTO	Microchip Technology	FPGA
RT4G150-CB1657PROTO	Microchip Technology	FPGA	Military	Ball	1657	BGA	Square	100k Rad(Si)	Plastic/Epoxy	151824	Yes	1.26 V				720		1.2			Grid Array	BGA1657,41X41,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B1657		4.17 mm	42.5 mm						720		42.5 mm
RT4G150-LG1657B	Microchip Technology	FPGA		No Lead	1657	LGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V			MIL-STD-883 Class B	720		1.2			Grid Array	LGA1657,41X41,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-CBGA-N1657		3.51 mm	42.5 mm						720		42.5 mm
XA7A25T-2CPG238I	Xilinx	FPGA
XC7A100T-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	101440	Yes	.98 V	7925			300		0.95			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7A50T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075			250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7VX690T-1FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square		Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS		1000		1		0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No		e1	1818 MHz		1000		45 mm
XC7VX690T-2FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square		Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS		600		1		1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm	No		e1	1818 MHz		600		35 mm
XC7VX690T-3FFG1927E	Xilinx	FPGA		Ball	1927	BGA	Square		Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS		600		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No		e1	1818 MHz		600	245 °C (473 °F)	45 mm
XCVU37P-1FSVH2892E	Xilinx	FPGA																												Tin Silver Copper			4					e1		30 s		240 °C (464 °F)
XCVU37P-2FSVH2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square		Plastic/Epoxy	2851800	Yes	.876 V	162960			624		0.85			Grid Array	BGA2892,54X54,40		.825 V	1 mm	100 °C (212 °F)		162960 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892	4	4.51 mm	55 mm			e1		30 s	624	240 °C (464 °F)	55 mm
XCVU37P-3FSVH2892E	Xilinx	FPGA																												Tin Silver Copper			4					e1		30 s		240 °C (464 °F)
XCVU37P-L2FSVH2892E	Xilinx	FPGA																															4					e1
10AX016E4F29I3SG	Intel	FPGA	Industrial	Ball	780	BGA	Square		Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC		288		0.9		0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		6151 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
10CL006ZE144I8G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square		Plastic/Epoxy	6272	Yes	1.03 V	392			176		1			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		.97 V	.5 mm	100 °C (212 °F)		392 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm		-40 to 125 °C range is available as extended industrial				176		20 mm
10CL010ZE144I8G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square		Plastic/Epoxy	10320	Yes	1.03 V	645			176		1			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		.97 V	.5 mm	100 °C (212 °F)		645 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm		-40 to 125 °C range is available as extended industrial				176		20 mm
10M08DCV81C7G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular		Plastic/Epoxy	8000	Yes	1.25 V	500			250		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No					250		4.496 mm
10M08SCE144C7G	Intel	FPGA	Commercial Extended	Gull Wing	144	HLFQFP	Square		Plastic/Epoxy	8000	Yes	3.15 V	500			250		3		3/3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				250		20 mm
10M40DCF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	40000	Yes	1.25 V	2500			500		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
10M50DAF256C6G	Intel	FPGA
1SG280HN1F43E1VG	Intel	FPGA		Ball	1760	BGA	Square		Plastic/Epoxy	2753000	Yes		344125			704					Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
5962-0151801QYC	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.75 V		CMOS	MIL-PRF-38535 Class Q		32000	2.5			Flatpack, Guard Ring			2.25 V	.5 mm	125 °C (257 °F)		32000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F208		3.22 mm	29.21 mm	No	2.5 V, 3.3 V, and 5.0 V mixed voltage operation	e4					29.21 mm
5CEFA5F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	76500	Yes	1.13 V		CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
5CEFA5U19A7N	Intel	FPGA	Automotive	Ball	484	FBGA	Square		Plastic/Epoxy	77000	Yes	1.13 V		CMOS		224		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No					224		19 mm
5CGXFC5C6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square		Plastic/Epoxy	76500	Yes	1.13 V		CMOS		368		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			368		27 mm
5CGXFC7D7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square		Plastic/Epoxy	149500	Yes	1.13 V		CMOS		336		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			336		27 mm
5CSEBA6U23I7LN	Intel	FPGA
5SGXEABN1F45I2G	Intel	FPGA	Industrial	Ball	1932	BGA	Square		Plastic/Epoxy	952000	Yes	.93 V	35920	TSMC		840		.9			Grid Array	BGA1932,44X44,40		.87 V	1 mm	100 °C (212 °F)		35920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.85 mm	45 mm						840		45 mm
A3P030-VQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	1.575 V	768	CMOS			30000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		768 CLBS, 30000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz	20 s		235 °C (455 °F)	14 mm
A3P060-2TQG144	Microchip Technology	FPGA	Commercial	Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Flatpack, Low Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	350 MHz				20 mm
A42MX24-2TQG176I	Microchip Technology	FPGA	Industrial	Gull Wing	176	LFQFP	Square		Plastic/Epoxy		Yes	3.6 V	1890	CMOS			36000	3.3	Tray		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.8 ns	1890 CLBS, 36000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	Also Operates at 5 V supply		114.75 MHz				24 mm
A42MX36-1CQ208	Microchip Technology	FPGA	Commercial	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2438	CMOS			54000	3.3			Flatpack, Guard Ring			3 V	.5 mm	70 °C (158 °F)	2.3 ns	2438 CLBS, 54000 Gates	0 °C (32 °F)		Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	Also Operates at 5 V supply		83 MHz				29.21 mm
A42MX36-CQ208	Microchip Technology	FPGA	Commercial	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	2414	Yes	3.6 V	2438	CMOS			54000	3.3			Flatpack, Guard Ring			3 V	.5 mm	70 °C (158 °F)	2.7 ns	2438 CLBS, 54000 Gates	0 °C (32 °F)		Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	Also Operates at 5 V supply		73 MHz				29.21 mm

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.