Field Programmable Gate Arrays (FPGA)

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10M16SAU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square		Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3			Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
XC7A75T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	75520	Yes	1.05 V	5900	CMOS	285		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K160T-1FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS	400		1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
EP3C40Q240C8N	Intel	FPGA	Other	Gull Wing	240	FQFP	Rectangular		Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	128		1.2			Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G240	3	4.1 mm	32 mm	No		e3	472.5 MHz		128		32 mm
ICE40HX8K-CT256	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square		Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	206		1.2		1.2 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm	No			133 MHz		206		14 mm
10M16SCU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square		Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3		3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	320	260 °C (500 °F)	11 mm
XC7A50T-3FGG484E	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075	CMOS	250		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1412 MHz	30 s	250	250 °C (482 °F)	23 mm
ICE40LP1K-CM121	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square		Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	95		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm	No		e1	133 MHz		95	260 °C (500 °F)	5 mm
LCMXO2-1200HC-4SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square			1280	Yes	3.6 V	160		21		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply				21	260 °C (500 °F)	5 mm
LCMXO2-2000HC-4BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	2112	Yes	3.465 V			206		2.5	Tray	2.5/3.3 V	Grid Array	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	206	260 °C (500 °F)	14 mm
EP4CE15F17C7N	Intel	FPGA	Other	Ball	256	LBGA	Square		Plastic/Epoxy	15408	Yes	1.25 V	963		165		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		165		17 mm
LFXP2-8E-5FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square		Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
XC6SLX45-3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	316		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	862 MHz	30 s	316	250 °C (482 °F)	23 mm
XC7A35T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
LFE5U-45F-7BG256I	Lattice Semiconductor	FPGA																											Tin Silver Copper			3					e1		30 s		260 °C (500 °F)
XC7A200T-2FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A35T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	33280	Yes	1.05 V	2600	CMOS	250		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm		1.27 ns	2600 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	250	250 °C (482 °F)	23 mm
XCAU25P-2SFVB784I	Xilinx	FPGA
XC7A12T-1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square		Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		150		10 mm
XQR5VFX130-1CN1752V	Xilinx	FPGA	Military		1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired	131072	Yes	1.05 V	10240	CMOS			1			Grid Array			.95 V	1 mm	125 °C (257 °F)	0.11 ns	10240 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1752		8.8 mm	45 mm	No							45 mm
EP3C25F256C8N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular		Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	156	260 °C (500 °F)	17 mm
LFE5U-45F-8BG381I	Lattice Semiconductor	FPGA																														3									260 °C (500 °F)
M2S090-FCSG325I	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular		Plastic/Epoxy	86184	Yes	1.26 V			180		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B325	3	1.16 mm	11 mm					40 s	180	250 °C (482 °F)	13.5 mm
XC7S25-1CSGA324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square		Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		150		15 mm
10M02SCM153C8G	Intel	FPGA	Other	Ball	153	BGA	Square		Plastic/Epoxy	2000	Yes	3.15 V	125		246		3			Grid Array	BGA153,15X15,20		2.85 V	.5 mm	85 °C (185 °F)		125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				246		8 mm
EP4CGX30CF23C7N	Intel	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	29440	Yes	1.24 V	1840		290		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		290		23 mm
M2GL005-VF256I	Microchip Technology	FPGA	Industrial	Ball	256	LFBGA	Square		Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		1.56 mm	14 mm			e0					14 mm
XC6SLX75-3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	400		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	400	250 °C (482 °F)	27 mm
XCAU25P-2FFVB676E	Xilinx	FPGA
XC6VLX760-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square		Plastic/Epoxy	758784	Yes	1.05 V		CMOS	1200		1		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
LCMXO3LF-9400C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square		Plastic/Epoxy		Yes	3.465 V	1175				2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
10CL040YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.25 V	2475				1.2			Grid Array			1.15 V	1 mm	100 °C (212 °F)		2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm								23 mm
LCMXO2-256ZE-1TG100I	Lattice Semiconductor	FPGA		Gull Wing	100	LFQFP	Square		Plastic/Epoxy	256	Yes	1.26 V			55		1.2	Tray	1.2 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3			55		14 mm
LCMXO3LF-4300C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square		Plastic/Epoxy	4300	Yes	3.465 V	540		206		2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
XC7A200T-2SBG484I	Xilinx	FPGA		Ball	484	FBGA	Square		Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1		1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	19 mm
XCAU10P-2SBVB484E	Xilinx	FPGA
EP4CE22F17I7N	Intel	FPGA		Ball	256	LBGA	Square		Plastic/Epoxy	22320	Yes	1.25 V	1395		153		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			1395 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	153	260 °C (500 °F)	17 mm
LCMXO2-256ZE-1UMG64I	Lattice Semiconductor	FPGA		Ball	64	VFBGA	Square		Plastic/Epoxy	256	Yes	1.26 V			44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LCMXO2-640HC-4SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square			640	Yes	3.6 V	80		40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
XC7A35T-3FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square		Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1412 MHz	30 s	250	260 °C (500 °F)	17 mm
ICE40HX8K-CB132	Lattice Semiconductor	FPGA	Industrial	Ball	132	VFBGA	Square		Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	95		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1 mm	8 mm	No		e1	133 MHz	30 s	95	260 °C (500 °F)	8 mm
LCMXO2-256ZE-1SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square			256	Yes	1.26 V	32		21		1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No					21		5 mm
XC3SD1800A-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	519	1800000	1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	4160 CLBS, 1800000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	250 MHz	30 s	409	260 °C (500 °F)	27 mm
LCMXO2-1200HC-4TG144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	QFP	Square		Plastic/Epoxy	1280	Yes	3.465 V			107		2.5	Tray	2.5/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3	133 MHz	30 s	107	260 °C (500 °F)	20 mm
LCMXO2-256ZE-1UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square		Plastic/Epoxy	256	Yes	1.26 V			44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LFE5U-25F-8BG381I	Lattice Semiconductor	FPGA																														3									260 °C (500 °F)
XCAU10P-L1UBVA368I	Xilinx	FPGA
EP3C25Q240C8N	Intel	FPGA	Other	Gull Wing	240	FQFP	Rectangular		Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	148		1.2			Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G240	3	4.1 mm	32 mm	No		e3	472.5 MHz		148		32 mm

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.