J Bend Programmable Logic Devices (PLD) 2,387

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
GAL16V8D-10LJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No	Programmable Output Polarity	e0	66.7 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
GAL16V8D-10QJ	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e0	66.7 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
M4A5-32/32-10JNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	62.5 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
M4A5-32/32-12JNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	52.6 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
XC95108-15PC84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	108	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0		30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC9536-15PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	36	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9572-15PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	55.6 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC9572-15PCG84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	29.3116 mm	Yes	69
ATF1508ASL-20JC84	Atmel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	128					5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	2	4.572 mm	29.3115 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	41.7 MHz			225 °C (437 °F)	29.3115 mm	Yes	64
EPM5032JC	Intel	OT PLD	Commercial	J Bend	28		Square	Plastic/Epoxy	25 ns		Yes	5.25 V	32	CMOS		24	PAL-TYPE	5						No	Macrocell	4.75 V	320		70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)		Quad	S-XQCC-J28							50 MHz		16			No	16
EPM5032JC-20	Altera	UV PLD	Commercial	J Bend	28	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	20 ns		Yes	5.25 V		CMOS		24	PAL-TYPE	5		5 V	Chip Carrier, Window	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Quad	S-CQCC-J28		4.57 mm	11.43 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)	11.43 mm		16
EPM5032JM-25	Altera	UV PLD	Military	J Bend	28	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns		Yes			CMOS		24	PAL-TYPE	5		5 V	Chip Carrier, Window	LDCC28,.5SQ	Programmable Logic Devices		Macrocell		320	1.27 mm	125 °C (257 °F)	7 Dedicated Inputs, 16 I/O	7	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-J28		4.57 mm	11.43 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	50 MHz		16	220 °C (428 °F)	11.43 mm		16
EPM5032LC-15	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V		CMOS		24	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	76.9 MHz		16	220 °C (428 °F)			16
EPM5032LC-20	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V		CMOS		24	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)			16
EPM7032SLC44-10	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J44	1	4.572 mm	16.5862 mm	No		e0	125 MHz	30 s		220 °C (428 °F)	16.5862 mm	Yes	36
EPM7160ELC84-20	Intel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	160	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	2	5.08 mm	29.3116 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	83.3 MHz				29.3116 mm	No	64
GAL16V8D-25QJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e0	37 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
GAL20V8C-10LJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	58.8 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
GAL20V8C-10LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e3	58.8 MHz	40 s	8	245 °C (473 °F)	11.5062 mm		8
GAL20V8C-10LJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e3	58.8 MHz	40 s	8	245 °C (473 °F)	11.5062 mm		8
M4A5-32/32-10JC	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	62.5 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
M4A5-32/32-10JNC	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	62.5 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
TIBPAL16L8-25CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V		TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Combinatorial	4.75 V	64	1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQCC-J20	3	4.57 mm	8.965 mm	No		e4	30 MHz	30 s	8	245 °C (473 °F)	8.965 mm		6
XC9572-15PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	55.6 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XCR3064XL-10PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS				3.3		3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	95 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	36
ATF1504ASVL-20JI84	Atmel	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	3.6 V	64	CMOS				3.3		2.5/3.3,3.3 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	2	4.572 mm	29.3115 mm	No		e0	83.3 MHz			225 °C (437 °F)	29.3115 mm	Yes	64
EPF8282ALC84-3	Intel	Loadable PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		208	Yes	5.25 V		CMOS		68		5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		Registered	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 68 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	208 Logic Elements	e0	385 MHz		64		29.3116 mm		68
EPF8282ALC84-3N	Intel	Loadable PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy			Yes	5.25 V		CMOS				5			Chip Carrier				Registered	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 68 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	208 Logic Elements	e3					29.3116 mm		68
EPM3064ALC44-10	Intel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS				3.3		2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	1	4.572 mm	16.5862 mm	No		e0	100 MHz				16.5862 mm	Yes	34
EPM7064AELI44-7N	Intel	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64	CMOS				3.3		2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e3	135.1 MHz				16.5862 mm	Yes	36
GAL20V8C-10LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	58.8 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
MACH211-15JC	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	64	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	50 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	64
XC9536XL-10PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	36	CMOS				3.3		2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e0	100 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC9572-7PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	83.3 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC9572-7PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	83.3 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XCR3032XL-7PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32	CMOS				3.3		3/3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	119 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	36
ATF1504ASL-20JC44	Atmel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	64	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	2	4.57 mm	16.5862 mm	No		e0	83.3 MHz			225 °C (437 °F)	16.5862 mm	Yes	32
ATF1504ASL-25JI44	Atmel	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.5 V	64	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	2	4.57 mm	16.5862 mm	No		e0	60 MHz			225 °C (437 °F)	16.5862 mm	Yes	32
EPM7032SLC44-6	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	6 ns		Yes	5.25 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	1	4.572 mm	16.5862 mm	No		e0	200 MHz			220 °C (428 °F)	16.5862 mm	Yes	36
ISPLSI1016E-80LJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	18.5 ns		Yes	5.5 V	64	CMOS		35	PLA-TYPE	5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	3 Dedicated Inputs, 32 I/O	3	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.59 mm	No		e3	57 MHz	40 s	32	245 °C (473 °F)	16.59 mm	No	32
M4A5-32/32-12JI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	52.6 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
M4A5-32/32-7JC	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	76.9 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
M4A5-32/32-7JI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.5 V	32	CMOS				5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	76.9 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XC95108-10PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	108	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0		30 s		225 °C (437 °F)	29.3116 mm	Yes	69
GAL26CLV12D-5LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	5 ns		Yes	3.6 V		CMOS		26	PAL-TYPE	3.3		3.3 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	3 V	122	1.27 mm	75 °C (167 °F)	13 Dedicated Inputs, 12 I/O	13	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.57 mm	11.5062 mm	No	Programmable Output Polarity	e0	143 MHz	30 s	12	225 °C (437 °F)	11.5062 mm		12
ATF750C-15JC	Atmel	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	10	CMOS				5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	2	4.572 mm	11.5062 mm	No		e0	55 MHz			225 °C (437 °F)	11.5062 mm	No	10
EPM9320LI84-20	Intel	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	23 ns		Yes	5.5 V	320	CMOS				5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 60 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	100 MHz				29.3116 mm	Yes	60
ATF2500C-15JU	Microchip Technology	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	24	CMOS				5	Tube	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	13 Dedicated Inputs, 24 I/O	13	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.586 mm	No		e3	52 MHz	40 s		245 °C (473 °F)	16.586 mm	No	24

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.