Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
3.5 ns |
Yes |
2.625 V |
32 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
e0 |
303 MHz |
220 °C (428 °F) |
16.5862 mm |
Yes |
36 |
||||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e0 |
125 MHz |
16.5862 mm |
Yes |
36 |
||||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
29.3116 mm |
Yes |
64 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
No |
e3 |
37 MHz |
40 s |
8 |
250 °C (482 °F) |
8.9662 mm |
8 |
||||||||
Lattice Semiconductor |
EE PLD |
Military |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
96 |
CMOS |
MIL-STD-883 |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
2 Dedicated Inputs, 48 I/O |
2 |
-55 °C (-67 °F) |
Quad |
S-PQCC-J68 |
4.826 mm |
24.13 mm |
No |
In-System Programmable; 4 External Clocks |
38 MHz |
30 s |
225 °C (437 °F) |
24.13 mm |
No |
48 |
|||||||||||
Cypress Semiconductor |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J28 |
4.57 mm |
11.5316 mm |
No |
Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
30 s |
16 |
225 °C (437 °F) |
11.5316 mm |
16 |
|||||||||
Altera |
Loadable PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
208 |
Yes |
5.25 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry |
e0 |
64 |
220 °C (428 °F) |
29.3116 mm |
64 |
|||||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
26 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
122 |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e0 |
55.5 MHz |
30 s |
12 |
225 °C (437 °F) |
11.5062 mm |
12 |
|||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J84 |
3 |
4.57 mm |
29.3116 mm |
No |
In-System Programmable; 4 External Clocks |
e0 |
38 MHz |
30 s |
225 °C (437 °F) |
29.3116 mm |
No |
64 |
|||||||||
Cypress Semiconductor |
OT PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.2316 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
24.2316 mm |
No |
52 |
||||||||||||
Intel |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
29.3116 mm |
Yes |
68 |
|||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
16 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 56 I/O |
4 |
0 °C (32 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
320 Macrocells |
220 °C (428 °F) |
29.3116 mm |
56 |
||||||||||||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e0 |
71.4 MHz |
30 s |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
10 Macrocells; Shared Input/Clock |
e0 |
83.3 MHz |
30 s |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e3 |
83.3 MHz |
40 s |
10 |
245 °C (473 °F) |
11.5062 mm |
10 |
||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
10 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
2 |
4.572 mm |
11.5062 mm |
No |
e0 |
44 MHz |
225 °C (437 °F) |
11.5062 mm |
No |
10 |
|||||||||||
Cypress Semiconductor |
UV PLD |
Industrial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
35 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 28 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J44 |
4.57 mm |
16.51 mm |
No |
Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
22.2 MHz |
16.51 mm |
No |
28 |
||||||||||||
Cypress Semiconductor |
Flash PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 64 I/O |
1 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
In-system re-programmable; 64 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
50 MHz |
29.3116 mm |
No |
64 |
||||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Glass-Sealed |
60 ns |
Yes |
5.25 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
240 |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-GQCC-J44 |
4.57 mm |
16.51 mm |
No |
24 Macrocells |
e0 |
20 MHz |
24 |
220 °C (428 °F) |
16.51 mm |
24 |
||||||||||
Intel |
Loadable PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
336 |
Yes |
5.25 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
336 Logic Elements |
e0 |
385 MHz |
64 |
29.3116 mm |
68 |
||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
1 |
4.572 mm |
16.5862 mm |
No |
Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
83.3 MHz |
20 s |
220 °C (428 °F) |
16.5862 mm |
No |
36 |
|||||||||
Intel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
1 |
4.572 mm |
16.5862 mm |
No |
Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
100 MHz |
16.5862 mm |
No |
36 |
|||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
30 s |
220 °C (428 °F) |
29.3116 mm |
No |
68 |
|||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
166.7 MHz |
29.3116 mm |
Yes |
68 |
|||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
16 ns |
Yes |
5.5 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
320 Macrocells |
e0 |
117.6 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
60 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e3 |
45.5 MHz |
40 s |
8 |
245 °C (473 °F) |
11.5062 mm |
8 |
|||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e0 |
37 MHz |
30 s |
8 |
225 °C (437 °F) |
11.5062 mm |
8 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e3 |
37 MHz |
40 s |
8 |
245 °C (473 °F) |
11.5062 mm |
8 |
|||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e0 |
142.8 MHz |
30 s |
8 |
225 °C (437 °F) |
11.5062 mm |
8 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
13 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
77 MHz |
40 s |
245 °C (473 °F) |
16.5862 mm |
No |
32 |
|||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
18.5 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e0 |
57 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
32 |
||||||||||
Analog Devices |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 32 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
e0 |
50 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
32 |
||||||||||
Cypress Semiconductor |
Flash PLD |
Commercial Extended |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
4.57 mm |
8.9662 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset |
e0 |
37 MHz |
8 |
8.9662 mm |
8 |
|||||||||||
Cypress Semiconductor |
Flash PLD |
Commercial Extended |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
4.57 mm |
8.9662 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset |
e0 |
100 MHz |
8 |
8.9662 mm |
8 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
26 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
136 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e0 |
105.3 MHz |
30 s |
12 |
225 °C (437 °F) |
11.5062 mm |
12 |
|||||||||
Cypress Semiconductor |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
80 |
1.27 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
No |
Asynchronous Registered; 10 Macrocells; Register Preload; Power-Up Reset |
e0 |
45.5 MHz |
10 |
10 |
||||||||||||||
Intel |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
240 |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQCC-J44 |
No |
e0 |
20 MHz |
24 |
||||||||||||||||||||||
|
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
66.7 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
34 |
|||||||||
|
Xilinx |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
72 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
72 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e3 |
66.7 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
34 |
||||||||
|
Xilinx |
Flash PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
72 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
72 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e3 |
55.6 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
34 |
||||||||
Microchip Technology |
UV PLD |
Military |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
20 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
13 Dedicated Inputs, 24 I/O |
13 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J44 |
4.57 mm |
16.5862 mm |
No |
40 MHz |
16.5862 mm |
24 |
||||||||||||||||||||
Defense Logistics Agency |
EE PLD |
Military |
J Bend |
QCCJ |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
1 Dedicated Inputs, 48 I/O |
1 |
-55 °C (-67 °F) |
Gold |
Quad |
4.826 mm |
24.13 mm |
No |
In-System Programmable; 4 External Clocks |
e4 |
38 MHz |
24.13 mm |
48 |
||||||||||||||||||||
Atmel |
Flash PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
No |
e0 |
62.5 MHz |
225 °C (437 °F) |
16.586 mm |
No |
32 |
|||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 48 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
3 |
4.57 mm |
24.2316 mm |
No |
64 Macrocells; In-system programmable; JTAG boundry-scan test circuitry |
e0 |
125 MHz |
225 °C (437 °F) |
24.2316 mm |
Yes |
48 |
||||||||||
Cypress Semiconductor |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 69 I/O |
1 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
64 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
29.3116 mm |
Yes |
69 |
|||||||||||
Cypress Semiconductor |
EE PLD |
Military |
J Bend |
84 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
3.6 V |
128 |
CMOS |
38535Q/M;38534H;883B |
3.3 |
3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
125 °C (257 °F) |
1 Dedicated Inputs, 69 I/O |
1 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J84 |
4.826 mm |
29.21 mm |
No |
128 Macrocells |
e0 |
62.5 MHz |
29.21 mm |
Yes |
69 |
|||||||||||
Cypress Semiconductor |
UV PLD |
Industrial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
60 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
27.7 MHz |
24.13 mm |
No |
52 |
||||||||||||
Cypress Semiconductor |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
35 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 28 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.572 mm |
16.6116 mm |
No |
Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
16.6116 mm |
No |
28 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.