Commercial Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
MACH210AQ-15JC	Analog Devices	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	64	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 32 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	50 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC2C384-7TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	384	CMOS	118	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 118 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	112 MHz	30 s	118	260 °C (500 °F)	20 mm	Yes	118
XC95144-7PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns		Yes	5.25 V	144	CMOS			5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	83.3 MHz	30 s		245 °C (473 °F)	20 mm	Yes	81
XC95216-10PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	216	CMOS			5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 133 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	3.7 mm	28 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	28 mm	Yes	133
XC9536-10PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	66.7 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9536XL-7VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS	36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e4	125 MHz		36		10 mm	Yes	36
XC9572-10PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	66.7 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9572-10PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns		Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72
XCR3032A-7VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V		CMOS			3.3		Flatpack, Thin Profile				Macrocell	3 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	105 MHz	30 s		240 °C (464 °F)	10 mm		32
XCR3256XL-12PQ208C	Xilinx	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS			3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	88 MHz				28 mm	Yes	164
XCR3256XL-12TQG144C	Xilinx	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS			3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 120 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	88 MHz	30 s		260 °C (500 °F)	20 mm	Yes	120
XCR3512XL-7FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	135 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
ATF1500A-12JC	Atmel	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns		Yes	5.25 V	32	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	2	4.572 mm	16.586 mm	No		e0	62.5 MHz			225 °C (437 °F)	16.586 mm	No	32
ATF1500AL-20AC	Atmel	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	32	CMOS			5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	40 MHz				10 mm	No	32
ATF1502ASV-20AC44	Atmel	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	20 ns		Yes	3.6 V	32	CMOS			3.3	3 V	Flatpack, Thin Profile	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	83.3 MHz				10 mm	Yes	32
ATF1504AS-10JC68	Atmel	EE PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	64	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 48 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	3	4.57 mm	24.2316 mm	No	64 Macrocells; In-system programmable; JTAG boundry-scan test circuitry	e0	125 MHz			225 °C (437 °F)	24.2316 mm	Yes	48
ATF1508ASV-15QC100	Atmel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns		Yes	3.6 V	128				3.3	3.3 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	3 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	100 MHz			225 °C (437 °F)	20 mm	Yes	80
ATF22V10B-15PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.06 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Register Preload; Power-Up Reset; Shared Input/Clock	e0	55.5 MHz		10		32 mm		10
ATF750C-15PC	Atmel	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V	10	CMOS			5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No		e0	55 MHz				31.877 mm	No	10
ATF750CL-15SC	Atmel	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns		Yes	5.25 V	10	CMOS			5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24	2	2.65 mm	7.5 mm	No		e0	44 MHz				15.4 mm	No	10
CY37064P100-125AC	Cypress Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	64	CMOS			5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 69 I/O	1	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	64 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	83 MHz				14 mm	Yes	69
CY37064P100-200AXC	Cypress Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	6 ns		Yes	5.25 V	64	CMOS			5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 69 I/O	1	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	64 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz	40 s		260 °C (500 °F)	14 mm	Yes	69
CY37064P84-200JC	Cypress Semiconductor	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	6 ns		Yes	5.25 V	64	CMOS			5	3.3/5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 69 I/O	1	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	64 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz				29.3116 mm	Yes	69
CY37128P160-125AC	Cypress Semiconductor	EE PLD	Commercial	Gull Wing	160	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	128	CMOS			5	3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP160,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 133 I/O	1	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	1.6 mm	24 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	83 MHz				24 mm	Yes	133
CY39100V256B-83BBC	Cypress Semiconductor	Loadable PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	15 ns		Yes	2.7 V	1536	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 180 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.6 mm	17 mm	No	Also operates at 3.3 V nominal supply	e0					17 mm	Yes	180
CY7C344-20WC	Cypress Semiconductor	UV PLD	Commercial	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	20 ns		No	5.25 V		CMOS	24	PAL-TYPE	5	5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	41.6 MHz		16		37.0205 mm		16
EP1810LC-20T	Altera	OT PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	22 ns		Yes	5.25 V	48	CMOS			5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 48 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68		5.08 mm	24.23 mm	No	Macrocells Interconnected By Global And/Or Local Bus; 48 Macrocells; 4 External Clocks	e0	50 MHz			220 °C (428 °F)	24.23 mm	No	48
EP1K100QC208-1	Intel	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V		CMOS	147		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	90 MHz		147		28 mm		147
EP1K30TC144-3	Intel	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	2.625 V		CMOS	102		2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	102 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0			102		20 mm		102
EP1K50FC256-1N	Intel	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V		CMOS	186		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	90 MHz		186		17 mm		186
EP22V10ELC-15	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V		CMOS	22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock	e0	64.5 MHz		10	220 °C (428 °F)	11.505 mm		10
EP22V10PC-7	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	9 ns		No	5.25 V		CMOS	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.32 mm	7.62 mm	No	Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock	e0	109.8 MHz		10	220 °C (428 °F)	31.68 mm		10
EP320IPC-35	Altera	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns		No			CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		72	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20				No		e0	25 MHz		8	220 °C (428 °F)
EP330PC-15	Rochester Electronics	OT PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	16 ns		No	5.25 V		CMOS			5		In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		4.318 mm	7.62 mm		8 Macrocells; 1 External Clock; Shared Input/Clock	e0	83.3 MHz				26.162 mm		8
EPF10K100ABC356-3	Intel	Loadable PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	0.8 ns	4992	Yes	3.6 V		CMOS	274		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	3 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 274 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			274		35 mm		274
EPF10K100ARC240-1N	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	4992	Yes	3.6 V		CMOS	189		3.3	2.5/3.3,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			189		32 mm		189
EPF10K100EQC240-1	Intel	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.4 ns	4992	Yes	2.625 V		CMOS	189		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			189		32 mm		189
EPF10K100GC503-4	Altera	Loadable PLD	Commercial	Pin/Peg	503	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.7 ns	4992	No	5.25 V		CMOS	406		5	3.3/5,5 V	Grid Array, Interstitial Pitch	SPGA503,43X43	Field Programmable Gate Arrays		Registered	4.75 V		2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 406 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P503	1	5.077 mm	57.4 mm	No	4992 Logic elements Configurable I/O operation with 3.3 V or 5 V	e0	49 MHz		406	220 °C (428 °F)	57.4 mm		406
EPF10K10TC144-3	Intel	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.5 ns	576	Yes	5.25 V		CMOS	102		5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 102 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	333 MHz		102		20 mm		102
EPF10K10TC144-4	Intel	Loadable PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.6 ns	576	Yes	5.25 V		CMOS	102		5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 102 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	294 MHz		102		20 mm		102
EPF10K130EFC484-1	Intel	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	6656	Yes	2.625 V		CMOS	369		2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	369 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			369		23 mm		369
EPF10K30AQC240-2	Intel	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	0.7 ns	1728	Yes	3.6 V		CMOS	246		3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements; 216 Labs	e0	80 MHz		246		32 mm		189
EPF10K30RC240-3N	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	189		5	3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements	e3	66.67 MHz		189		32 mm		189
EPF10K30RC240-4	Intel	Loadable PLD	Commercial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	189		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements	e0	62.89 MHz		189		32 mm		189
EPF10K50SFC484-1	Intel	Loadable PLD	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V		CMOS	254		2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	254 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			254		23 mm		254
EPF10K50SQC208-3N	Intel	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.5 ns	2880	Yes	2.625 V		CMOS	147		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3			147		28 mm		147
EPF8282ATC100-4N	Intel	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		208	Yes	5.25 V		CMOS	78		5	3.3,3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 78 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	208 Logic Elements	e3			78		14 mm		78
EPF8282TC100-3	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		208	Yes	5.25 V		CMOS	78		5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 74 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry	e0			74	220 °C (428 °F)	14 mm		74

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.