Commercial Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

CY39100V388B-125MGC

Cypress Semiconductor

Loadable PLD

Commercial

Ball

388

BGA

Square

Plastic/Epoxy

10 ns

Yes

2.7 V

1536

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA388,26X26,50

Programmable Logic Devices

Yes

Macrocell

2.3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 294 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B388

2.46 mm

35 mm

No

Also operates at 3.3 V nominal supply

e0

35 mm

Yes

294

XC95108-10PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

XC9536-10VQG44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

66.7 MHz

30 s

260 °C (500 °F)

10 mm

Yes

34

EPM3256AQC208-7N

Intel

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 158 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

126.6 MHz

28 mm

Yes

158

EPM7256SQC208-7

Intel

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

256

CMOS

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V

e0

166.7 MHz

28 mm

Yes

164

ATF750C-15JC

Atmel

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

10

CMOS

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

2

4.572 mm

11.5062 mm

No

e0

55 MHz

225 °C (437 °F)

11.5062 mm

No

10

XC9572XL-7TQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

72

CMOS

72

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 72 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

72 Macrocells

e3

125 MHz

30 s

72

260 °C (500 °F)

14 mm

Yes

72

EP1K30QC208-3

Intel

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.6 ns

1728

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

147

28 mm

147

CY37128VP160-83AXC

Cypress Semiconductor

EE PLD

Commercial

Gull Wing

160

LFQFP

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

128

CMOS

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP160,1.0SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

1 Dedicated Inputs, 133 I/O

1

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G160

3

1.6 mm

24 mm

No

128 Macrocells

e3

62.5 MHz

20 s

260 °C (500 °F)

24 mm

Yes

133

CY39100V208B-200NTC

Cypress Semiconductor

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

7.5 ns

Yes

2.7 V

1536

CMOS

2.5

1.5/3.3,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

2.3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 136 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

3.77 mm

28 mm

No

Also operates at 3.3 V nominal supply

e0

28 mm

Yes

136

EPM3256ATC144-7N

Intel

EE PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 116 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

126.6 MHz

20 mm

Yes

116

ISPLSI1032E-70LTN

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

17.5 ns

Yes

5.25 V

128

CMOS

66

PLA-TYPE

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

56 MHz

40 s

64

260 °C (500 °F)

14 mm

No

64

EP1K30FC256-3

Intel

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

1728

Yes

2.625 V

CMOS

171

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

171 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

171

17 mm

171

EPF10K50VFC484-2

Intel

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

3.6 V

CMOS

310

3.3

3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

310

23 mm

XC95288XL-6PQ208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

288

CMOS

168

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 168 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e4

208.3 MHz

168

28 mm

Yes

168

EP1K50FC256-2

Intel

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

37.5 MHz

186

17 mm

186

EP1K50FC484-3

Intel

Loadable PLD

Commercial

Ball

484

BGA

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.625 V

CMOS

249

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

249 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

249

23 mm

249

EP1K50TC144-1N

Intel

Loadable PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

102 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

90 MHz

102

20 mm

102

EPM3256ATC144-10

Intel

EE PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 116 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

95.2 MHz

20 mm

Yes

116

EPM7032BLC44-7

Altera

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

3.5 ns

Yes

2.625 V

32

CMOS

2.5

1.8/3.3,2.5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

2.375 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

e0

303 MHz

220 °C (428 °F)

16.5862 mm

Yes

36

EPM7064SLC44-10

Intel

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

64

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e0

125 MHz

16.5862 mm

Yes

36

EPM7160SLC84-10

Intel

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

160

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 64 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

2

5.08 mm

29.3116 mm

No

Configurable I/O operation with 3.3 V or 5 V

e0

125 MHz

29.3116 mm

Yes

64

GAL16V8D-25LJN

Lattice Semiconductor

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

37 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

PZ5032CS10BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

59 MHz

10 mm

32

ATF20V8B-10PC

Atmel

Flash PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

1

5.334 mm

7.62 mm

No

8 Macrocells

e0

68 MHz

8

31.877 mm

8

ATF20V8B-15PC

Atmel

Flash PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

12 Dedicated Inputs, 8 I/O

12

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

1

5.334 mm

7.62 mm

No

8 Macrocells

e0

45 MHz

8

31.877 mm

8

ATF22V10C-10XC

Atmel

Flash PLD

Commercial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

22

PAL-TYPE

5

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP24,.25

Programmable Logic Devices

Macrocell

4.75 V

132

.65 mm

70 °C (158 °F)

10 Dedicated Inputs, 10 I/O

10

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

2

1.2 mm

4.4 mm

No

Shared Input/Clock

e0

90 MHz

10

240 °C (464 °F)

7.8 mm

10

CY7C344-25JC

Cypress Semiconductor

OT PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

24

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

320

1.27 mm

70 °C (158 °F)

7 Dedicated Inputs, 16 I/O

7

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

4.57 mm

11.5316 mm

No

Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock

e0

33.3 MHz

30 s

16

225 °C (437 °F)

11.5316 mm

16

EP1K50FC256-3

Intel

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

186

17 mm

186

EPF10K20TC144-3N

Intel

Loadable PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.5 ns

1152

Yes

5.25 V

CMOS

102

5

3.3/5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.63SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 102 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

102

20 mm

102

EPF8282LC84-3

Altera

Loadable PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

208

Yes

5.25 V

CMOS

68

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

Registered

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 64 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry

e0

64

220 °C (428 °F)

29.3116 mm

64

EPM7256SQC208-10N

Intel

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

256

CMOS

5

3.3/5,5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V

e3

125 MHz

28 mm

Yes

164

ISPLSI1016E-80LTN44

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

18.5 ns

Yes

5.25 V

64

CMOS

35

PLA-TYPE

5

5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

3 Dedicated Inputs, 32 I/O

3

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

57 MHz

32

260 °C (500 °F)

10 mm

No

32

ISPLSI1032-60LJ

Lattice Semiconductor

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

128

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 64 I/O

4

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

4.57 mm

29.3116 mm

No

In-System Programmable; 4 External Clocks

e0

38 MHz

30 s

225 °C (437 °F)

29.3116 mm

No

64

M4A3-32/32-5VNC48

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

32

CMOS

PAL-TYPE

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G48

3

1.6 mm

7 mm

No

e3

105 MHz

40 s

260 °C (500 °F)

7 mm

Yes

32

M4A5-128/64-10YC

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

128

CMOS

5

5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e0

62.5 MHz

30 s

225 °C (437 °F)

20 mm

Yes

64

MACH211SP-12VC

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

44

QFP

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

64

CMOS

5

5 V

Flatpack

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

10 mm

No

e0

66.7 MHz

240 °C (464 °F)

10 mm

No

64

XC2C512-7FTG256C

Xilinx

Flash PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

512

CMOS

212

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

119 MHz

30 s

212

260 °C (500 °F)

17 mm

Yes

212

CY7C342B-25JC

Cypress Semiconductor

OT PLD

Commercial

J Bend

68

QCCJ

Square

Plastic/Epoxy

40 ns

Yes

5.25 V

128

CMOS

5

5 V

Chip Carrier

LDCC68,1.0SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

7 Dedicated Inputs, 52 I/O

7

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J68

5.08 mm

24.2316 mm

No

Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock

e0

62.5 MHz

24.2316 mm

No

52

EP1210DC

Altera

UV PLD

Commercial

Through-Hole

40

WDIP

Rectangular

Ceramic, Glass-Sealed

90 ns

No

5.25 V

CMOS

36

PAL-TYPE

5

In-Line, Window

DIP40,.6

Programmable Logic Devices

Macrocell

4.75 V

236

2.54 mm

70 °C (158 °F)

12 Dedicated Inputs, 24 I/O

12

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T40

5.715 mm

15.24 mm

No

28 Macrocells

e0

17.5 MHz

24

220 °C (428 °F)

52.07 mm

24

EP1K100FC256-3

Intel

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

186

17 mm

186

EP1K100QC208-1N

Intel

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.4 ns

4992

Yes

2.625 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

90 MHz

147

28 mm

147

EP1K30TC144-1

Intel

Loadable PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

102

2.5

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

Mixed

2.375 V

.5 mm

70 °C (158 °F)

102 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

90 MHz

102

20 mm

102

EP22V10EDC-10

Altera

UV PLD

Commercial

Through-Hole

24

WDIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.25 V

CMOS

22

PAL-TYPE

5

5 V

In-Line, Window

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

132

2.54 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock

e0

95.2 MHz

10

220 °C (428 °F)

32 mm

10

EPF10K20RC240-3

Intel

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

0.5 ns

1152

Yes

5.25 V

CMOS

189

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

1152 Logic Elements

e0

71.43 MHz

189

32 mm

189

EPF10K250ABC600-1

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.5 ns

12160

Yes

3.6 V

CMOS

470

3.3

2.5/3.3,3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

12160 Logic Elements; 1520 Labs

e0

80 MHz

470

220 °C (428 °F)

45 mm

470

EPF10K30RC240-3

Intel

Loadable PLD

Commercial

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

0.6 ns

1728

Yes

5.25 V

CMOS

189

5

3.3/5,5 V

Flatpack, Heat Sink/Slug, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

Registered

4.75 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

1728 Logic Elements

e0

66.67 MHz

189

32 mm

189

EPM7032STC44-10

Altera

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

32

CMOS

5

5 V

Flatpack, Low Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.27 mm

10 mm

No

e0

125 MHz

220 °C (428 °F)

10 mm

Yes

36

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.