Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
29.3116 mm |
Yes |
68 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
62.5 MHz |
40 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
32 |
|||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
36 |
CMOS |
34 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e4 |
138.88 MHz |
34 |
10 mm |
Yes |
34 |
|||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
72 |
CMOS |
36 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP64,.47SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 52 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
No |
72 Macrocells |
e3 |
178.6 MHz |
30 s |
36 |
260 °C (500 °F) |
10 mm |
Yes |
52 |
||||||
|
Intel |
Loadable PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
1728 |
Yes |
2.625 V |
CMOS |
171 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
70 °C (158 °F) |
171 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
90 MHz |
171 |
17 mm |
171 |
||||||||||||
Intel |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
98 MHz |
14 mm |
Yes |
80 |
||||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
No |
e3 |
66.7 MHz |
8 |
260 °C (500 °F) |
26.162 mm |
8 |
||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Ball |
132 |
TFBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
256 |
CMOS |
106 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA132,14X14,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 106 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B132 |
3 |
1.1 mm |
8 mm |
No |
Real Digital Design Technology |
e1 |
300 MHz |
30 s |
106 |
260 °C (500 °F) |
8 mm |
Yes |
106 |
|||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
72 |
CMOS |
36 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP64,.47SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 52 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
No |
72 Macrocells |
e4 |
125 MHz |
36 |
10 mm |
Yes |
52 |
||||||||
|
Cypress Semiconductor |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 69 I/O |
1 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
128 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e3 |
80 MHz |
40 s |
260 °C (500 °F) |
14 mm |
Yes |
69 |
||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
18.5 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e0 |
57 MHz |
30 s |
240 °C (464 °F) |
14 mm |
No |
64 |
||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Ball |
132 |
TFBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
128 |
CMOS |
100 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA132,14X14,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B132 |
3 |
1.1 mm |
8 mm |
No |
e1 |
119 MHz |
30 s |
100 |
260 °C (500 °F) |
8 mm |
Yes |
100 |
||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 108 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
95 MHz |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
108 |
|||||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
88 MHz |
20 mm |
Yes |
120 |
|||||||||||
Microchip Technology |
Flash PLD |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
5 |
Small Outline |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
38.5 MHz |
15.4 mm |
10 |
||||||||||||||||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
0.6 ns |
2880 |
Yes |
5.25 V |
CMOS |
189 |
5 |
3.3/5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
2880 Logic Elements |
e3 |
66.67 MHz |
189 |
32 mm |
189 |
||||||||||
|
Intel |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 66 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e3 |
135.1 MHz |
14 mm |
Yes |
66 |
|||||||||||
|
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
29.3116 mm |
Yes |
68 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
No |
e3 |
100 MHz |
30 s |
8 |
260 °C (500 °F) |
26.162 mm |
8 |
|||||||||
|
Xilinx |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
119 MHz |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
36 |
|||||||||
Xilinx |
EE PLD |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
95 MHz |
30 s |
240 °C (464 °F) |
14 mm |
Yes |
84 |
||||||||||
Microchip Technology |
Flash PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.506 mm |
38.5 MHz |
11.506 mm |
10 |
||||||||||||||||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
0.5 ns |
2880 |
Yes |
3.6 V |
CMOS |
189 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
189 |
32 mm |
189 |
||||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
128 |
CMOS |
80 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e4 |
119 MHz |
80 |
14 mm |
Yes |
80 |
||||||||
Xilinx |
Flash PLD |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
288 |
CMOS |
192 |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 192 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2 mm |
17 mm |
No |
e0 |
208.3 MHz |
30 s |
192 |
225 °C (437 °F) |
17 mm |
Yes |
192 |
||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
72 |
CMOS |
72 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 72 I/O |
0 |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
72 Macrocells |
e4 |
178.6 MHz |
72 |
14 mm |
Yes |
72 |
||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
72 |
CMOS |
72 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 72 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
72 Macrocells |
e3 |
178.6 MHz |
30 s |
72 |
260 °C (500 °F) |
14 mm |
Yes |
72 |
||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3 V |
Flatpack, Thin Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
100 MHz |
10 mm |
Yes |
32 |
||||||||||||
Intel |
Loadable PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.5 ns |
2880 |
Yes |
2.625 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
147 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
147 |
28 mm |
147 |
||||||||||||||
Intel |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
14 mm |
Yes |
84 |
|||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Ball |
132 |
TFBGA |
Square |
Plastic/Epoxy |
6 ns |
Yes |
1.9 V |
128 |
CMOS |
100 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA132,14X14,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B132 |
3 |
1.1 mm |
8 mm |
No |
e1 |
152 MHz |
30 s |
100 |
260 °C (500 °F) |
8 mm |
Yes |
100 |
||||||
Atmel |
Flash PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
5.334 mm |
7.62 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
45 MHz |
8 |
25.908 mm |
8 |
||||||||||
Atmel |
Flash PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
2 |
4.57 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Register Preload; Power-Up Reset; Shared Input/Clock |
e0 |
125 MHz |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
|||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
14 mm |
80 |
||||||||||||||||||
Altera |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
|||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
4.57 mm |
29.3116 mm |
No |
64 Macrocells; In-system programmable; JTAG boundry-scan test circuitry |
e0 |
125 MHz |
225 °C (437 °F) |
29.3116 mm |
Yes |
64 |
||||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.6 ns |
1152 |
Yes |
5.25 V |
CMOS |
102 |
5 |
3.3/5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
102 |
20 mm |
102 |
||||||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e3 |
166.7 MHz |
16.5862 mm |
Yes |
36 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
5.334 mm |
7.62 mm |
No |
e0 |
45.5 MHz |
30 s |
8 |
225 °C (437 °F) |
26.162 mm |
8 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
13 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Flatpack, Thin Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
77 MHz |
260 °C (500 °F) |
10 mm |
No |
32 |
||||||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
1.9 V |
512 |
CMOS |
173 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 173 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
91 MHz |
30 s |
173 |
245 °C (473 °F) |
28 mm |
Yes |
173 |
||||||
|
Xilinx |
Flash PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
288 |
CMOS |
117 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
125 MHz |
30 s |
117 |
260 °C (500 °F) |
20 mm |
Yes |
117 |
|||||||
Atmel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
3.3,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
No |
e0 |
125 MHz |
225 °C (437 °F) |
16.586 mm |
Yes |
32 |
|||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
3.3,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
No |
e0 |
100 MHz |
225 °C (437 °F) |
16.586 mm |
Yes |
32 |
|||||||||||
Atmel |
EE PLD |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
100 MHz |
240 °C (464 °F) |
14 mm |
Yes |
64 |
|||||||||||
Intel |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.8 ns |
9984 |
Yes |
2.625 V |
CMOS |
182 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
70 °C (158 °F) |
182 I/O |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
182 |
32 mm |
182 |
||||||||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.9 ns |
1728 |
Yes |
3.6 V |
CMOS |
102 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Registered |
3 V |
.5 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
1728 Logic Elements; 216 Labs |
e3 |
80 MHz |
102 |
20 mm |
102 |
||||||||||
|
Intel |
Loadable PLD |
Commercial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.8 ns |
2880 |
Yes |
2.7 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
70 °C (158 °F) |
189 I/O |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
2880 Logic Elements |
e3 |
140 MHz |
189 |
32 mm |
189 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.