Commercial Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM7128BTC100-4N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	4 ns	Yes	2.625 V	128	CMOS			2.5		1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	243.9 MHz				14 mm	Yes	84
XC9572XL-10CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	38		3.3		2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 38 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e1	100 MHz	30 s	38	260 °C (500 °F)	7 mm	Yes	38
GAL16V8D-25QPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS	18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	37 MHz		8	260 °C (500 °F)	26.162 mm		8
XC9572XL-7VQG64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS	36		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e3	125 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	52
EPM7064SLC44-10N	Intel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS			5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	125 MHz				16.5862 mm	No	36
ATF1504AS-7AX100	Microchip Technology	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	64	CMOS	64		5	Tray		Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		Yes	Macrocell	4.75 V	40	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm		Power-Up Reset; Security Fuse	e3	166.7 MHz		64		14 mm	Yes	64
ATF1504AS-7JX44	Microchip Technology	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	64	CMOS	32		5	Tube		Chip Carrier	LDCC44,.7SQ		Yes	Macrocell	4.75 V	40	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	Power-Up Reset; Security Fuse	e3	166.7 MHz	40 s	32	245 °C (473 °F)	16.5862 mm	Yes	32
ATF22V10C-7SX	Microchip Technology	Flash PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	Tube	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No		e3	125 MHz		10		15.4 mm		10
EPM7128SQC100-15N	Intel	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	128	CMOS			5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	100 MHz				20 mm	Yes	84
XC2C32A-6CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS			1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1	300 MHz	30 s		260 °C (500 °F)	6 mm	Yes	33
GAL16V8D-15QPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS	18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e3	45.5 MHz		8	260 °C (500 °F)	26.162 mm		8
XC9536XL-7VQG64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	36	CMOS	36		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3	138.88 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	36
EPM7064STC100-10N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS			5		3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz				14 mm	No	68
ATF22V10CQZ-20PC	Microchip Technology	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V		CMOS			5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		5.334 mm	7.62 mm				38.5 MHz				31.877 mm		10
XC2C32A-4VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	4 ns	Yes	1.9 V	32	CMOS			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	LCC32,.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	70 °C (158 °F)	33 I/O		0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e4	450 MHz				10 mm	Yes	33
XC95144XL-10CSG144C	Xilinx	Flash PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	144	CMOS	117		3.3		2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	138.88 MHz	30 s	117	260 °C (500 °F)	12 mm	Yes	117
EPM3032ATC44-4N	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	4.5 ns	Yes	3.6 V	32	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	227.3 MHz				10 mm	Yes	34
ATF22V10C-5JX	Microchip Technology	Flash PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	Tube	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	142 MHz		10		11.5062 mm		10
ATF1504AS-7AX44	Microchip Technology	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	64	CMOS	32		5	Tray		Flatpack, Thin Profile	TQFP44,.47SQ,32		Yes	Macrocell	4.75 V	40	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Power-Up Reset; Security Fuse	e3	166.7 MHz	40 s	32	260 °C (500 °F)	10 mm	Yes	32
XC9572XL-10VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	34		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	72 Macrocells	e4	100 MHz		34		10 mm	Yes	34
XCR3064XL-10VQG44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS			3.3		3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	95 MHz	30 s		260 °C (500 °F)	10 mm	Yes	36
EPM7128STC100-10N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	128	CMOS			5		3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	125 MHz	40 s		260 °C (500 °F)	14 mm	Yes	84
XC9536XL-10CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS	36		3.3		2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	138.88 MHz	30 s	36	260 °C (500 °F)	7 mm	Yes	36
EPM7256AETC100-10N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	95.2 MHz				14 mm	Yes	84
XC2C64A-5VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e4	333 MHz				10 mm	Yes	33
XC2C128-7TQG144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS	100	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	119 MHz	30 s	100	260 °C (500 °F)	20 mm	Yes	100
XC2C64A-7VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e4	200 MHz				10 mm	Yes	33
M4A5-64/32-7VNC48	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	64	CMOS	34	PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	76.9 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
EPM3032ALC44-10N	Intel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	32	CMOS			3.3		2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	103.1 MHz				16.5862 mm	Yes	34
XC9536XL-10VQG64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS	36		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3	138.88 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	36
ATF1502AS-7AX44-T	Microchip Technology	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V					5	Tape and Reel		Flatpack, Thin Profile				Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44		1.2 mm	10 mm			e3	166.7 MHz				10 mm		32
EPM3128ATC100-5N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	128	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	192.3 MHz				14 mm	Yes	80
XC95144XL-10TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	144	CMOS	81		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	144 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e4	81.3 MHz		81		14 mm	Yes	81
GAL16V8D-25QJN	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS	18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e3	37 MHz	40 s	8	250 °C (482 °F)	8.9662 mm		8
ATF1508AS-7JX84	Microchip Technology	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	128				5	Tube	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 64 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	2	4.572 mm	29.3115 mm	No		e3	166.7 MHz				29.3115 mm	Yes	64
M4A5-192/96-10VNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	192	CMOS			5		5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	16 Dedicated Inputs, 96 I/O	16	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	62.5 MHz	40 s		260 °C (500 °F)	20 mm	Yes	96
EPM3128ATC100-7N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	129.9 MHz				14 mm	Yes	80
EPM3032ATC44-7N	Intel	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	32	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e3	138.9 MHz				10 mm	Yes	34
EPM3256AQC208-10N	Intel	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 158 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	95.2 MHz				28 mm	Yes	158
M4A3-64/32-10VNC48	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS		PAL-TYPE	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	62.5 MHz	40 s		260 °C (500 °F)	7 mm	Yes	32
EPM3064ATC100-4N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	4.5 ns	Yes	3.6 V	64	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 66 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	222.2 MHz				14 mm	Yes	66
XCR3256XL-10TQG144C	Xilinx	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 120 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	105 MHz	30 s		260 °C (500 °F)	20 mm	Yes	120
EPM7064SLC44-5N	Intel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	5.25 V	64	CMOS			5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V	e3	250 MHz				16.5862 mm	No	36
EPM9320LC84-15	Intel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	16 ns	Yes	5.25 V	320	CMOS			5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 60 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	117.6 MHz				29.3116 mm	Yes	60
EPM3064ALC44-10N	Intel	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS			3.3		2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	100 MHz				16.5862 mm	Yes	34
EPM9320LC84-15N	Intel	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	16 ns	Yes	5.25 V		CMOS			5			Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 60 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e3	117.6 MHz				29.3116 mm		60
EPM7128AETC100-10N	Intel	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	128	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e3	98 MHz	30 s		260 °C (500 °F)	14 mm	Yes	84
XC2C64A-5CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS			1.8		1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0	333 MHz	30 s		240 °C (464 °F)	6 mm	Yes	45

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.