Intel - EP1K30FC256-1N

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EP1K30FC256-1N by Intel

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Manufacturer Intel
Manufacturer's Part Number EP1K30FC256-1N
Description LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Datasheet EP1K30FC256-1N Datasheet
In Stock7
NAME DESCRIPTION
Minimum Supply Voltage: 2.375 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 0.4 ns
Organization: 171 I/O
Maximum Seated Height: 2.1 mm
No. of Inputs: 171
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 171
Position Of Terminal: Bottom
No. of Terminals: 256
No. of I/O Lines: 171
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 90 MHz
Package Shape: Square
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: BGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial
Programmable IC Type: Loadable PLD
Maximum Supply Voltage: 2.625 V
Nominal Supply Voltage (V): 2.5
Technology Used: CMOS
No. of Logic Cells: 1728
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 17 mm
Form Of Terminal: Ball
Output Function: Mixed
Pitch Of Terminal: 1 mm
Power Supplies (V): 2.5,2.5/3.3 V
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