Commercial Programmable Logic Devices (PLD) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC95288XL-7CSG280C	Xilinx	Flash PLD	Commercial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	288	CMOS	192	3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	125 MHz	30 s	192	260 °C (500 °F)	16 mm	Yes	192
XCR5064C-10PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	64	CMOS		5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	80 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XCR3064XL-6VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	64	CMOS		3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	192 MHz				10 mm	Yes	36
XC2C512-6PQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	512	CMOS		1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s		245 °C (473 °F)	28 mm	Yes	173
XC2C32-4CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	4 ns	Yes	1.9 V	32	CMOS		1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 33 I/O	1	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1		30 s		260 °C (500 °F)	6 mm	Yes	33
XC9572F-10PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	72	CMOS		5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	67 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72
XCR5032-10PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		5		Chip Carrier				Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			59 MHz				16.5862 mm		32
XC9536-7PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	36	CMOS		5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	83.3 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC7336Q-15VQ44C	Xilinx	OT PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	23 ns	Yes	5.25 V	36	CMOS		5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		240 °C (464 °F)	10 mm	No	32
XC2C128-4CPG132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	4.5 ns	Yes	1.9 V	128	CMOS		1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1		30 s		260 °C (500 °F)	8 mm	Yes	100
XCR3256XL-7.5TQ144C	Xilinx	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS		3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V	.5 mm	70 °C (158 °F)	116 I/O		0 °C (32 °F)	Nickel/Palladium/Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	167 MHz				20 mm		116
XC7372-15PQ100C	Xilinx	OT PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	33 ns	Yes	5.25 V	72	CMOS		5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	12 Dedicated Inputs, 42 I/O	12	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops	e0	52.6 MHz	30 s		225 °C (437 °F)	20 mm	No	42
XCR3128A-7TQ128C	Xilinx	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.63X.87,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1	1.6 mm	14 mm	No			111 MHz				20 mm	Yes	96
XC7272-25WC84C	Xilinx	UV PLD	Commercial	J Bend	84	QCCJ	Square	Ceramic	40 ns	Yes		72	CMOS		5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No			1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-XQCC-J84				No								No
XC9536XL-5PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	36	CMOS		3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3		30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC95144-10PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	144	CMOS		5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 133 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	67.7 MHz	30 s		225 °C (437 °F)	28 mm	Yes	133
XC2C64A-4CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	4 ns	Yes	1.9 V		CMOS		1.8		Grid Array, Low Profile, Fine Pitch				Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56		1.35 mm	6 mm	No		e0	454 MHz				6 mm		45
XC9572XV-7PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	72	CMOS		2.5	1.8/3.3,2.5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.37 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	125 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XCR5128C-12TQ128C	Xilinx	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.25 V		CMOS		5		Flatpack, Low Profile, Fine Pitch				Macrocell	4.75 V	.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			63 MHz				20 mm		96
XCR3064-12PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	64	CMOS		3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	2.97 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	67 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC7272A-25PC68C	Xilinx	OT PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	40 ns	Yes	5.25 V	72	CMOS		5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 38 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells	e0	40 MHz				24.2316 mm	No	38
XC73144-15WB225C	Xilinx	UV PLD	Commercial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	36 ns	Yes	5.25 V	144	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)		Bottom	S-CBGA-B225	1			No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops		45.5 MHz					No	120
XC95288XV-5FG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5 ns	Yes	2.62 V	288	CMOS		2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.37 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	222 MHz	30 s		225 °C (437 °F)	17 mm	Yes	192
XC2C64-5CPG56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS		1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 45 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1		30 s		260 °C (500 °F)	6 mm	Yes	45
XCR3032XL-5PCG44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	32	CMOS		3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e3	175 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	36
XCR3064A-7CVQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	QFP	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	64	CMOS	68	3.3	3.3 V	Flatpack	TQFP100,.63SQ	Programmable Logic Devices	Yes		3 V	.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3			No		e0	143 MHz	30 s	64	240 °C (464 °F)		Yes	64
XC9572-10PCG84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	72	CMOS		5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	66.7 MHz	30 s		245 °C (473 °F)	29.3116 mm	Yes	69
XC73108-7PG144C	Xilinx	UV PLD	Commercial	Pin/Peg	144	WPGA	Square	Ceramic, Metal-Sealed Cofired	18 ns	No	5.25 V	108	CMOS		5	3.3/5,5 V	Grid Array, Window	PGA144,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)		Perpendicular	S-CPGA-P144	1	3.683 mm	39.624 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		83.3 MHz				39.624 mm	No	78
XC9572XL-5PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	3.6 V	72	CMOS		3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells	e3	178.6 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9572-15PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	72	CMOS		5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	55.6 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72
XCR3128-10TQ128C	Xilinx	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	10 ns	Yes	3.63 V	128	CMOS		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.63X.87,20	Programmable Logic Devices	Yes	Macrocell	2.97 V	.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			77 MHz				20 mm	Yes	96
XC9536XV-4VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	4 ns	Yes	2.62 V	36	CMOS		2.5	1.8/3.3,2.5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0		30 s		240 °C (464 °F)	10 mm	Yes	34
XCR3384XL-7TQ144C	Xilinx	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	384	CMOS		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 118 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	135 MHz				20 mm	Yes	118
XC2C32A-4QFG32C	Xilinx	Flash PLD	Commercial	No Lead	32	SON	Square	Plastic/Epoxy	4 ns	Yes	1.9 V	32	CMOS		1.8	1.5/3.3,1.8 V	Small Outline	LCC32,.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	21 I/O		0 °C (32 °F)	Matte Tin	Dual	S-PDSO-N32	3	1 mm	5 mm	No	Real Digital Design Technology	e3	450 MHz	30 s		260 °C (500 °F)	5 mm	Yes	21
XC2C256-5VQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	256	CMOS		1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e0		30 s		240 °C (464 °F)	14 mm	Yes	80
XCR3384XL-7TQG144C	Xilinx	EE PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	384	CMOS		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 118 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	135 MHz	30 s		260 °C (500 °F)	20 mm	Yes	118
XC95576-12BG432C	Xilinx	Flash PLD	Commercial	Ball	432	LBGA	Square	Plastic/Epoxy	12 ns	Yes			CMOS		5		Grid Array, Low Profile				Macrocell		1.27 mm	70 °C (158 °F)	232 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0					40 mm		232
XCR3384XL-10FTG256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS		3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	102 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XC95108-7PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	108	CMOS		5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0		30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XCR3064XL-7CSG48C	Xilinx	EE PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS		3.3	3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 40 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	119 MHz	30 s		260 °C (500 °F)	7 mm	Yes	40
XCR3320-7BG256C	Xilinx	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	320	CMOS		3.3	3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 3 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	111 MHz	30 s		225 °C (437 °F)	27 mm	Yes	3
XC2C64-7VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS		1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 33 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e0		30 s		240 °C (464 °F)	10 mm	Yes	33
XC9572XL-10PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS		3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells	e3	100 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC7372-7PC68C	Xilinx	OT PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	18.5 ns	Yes	5.25 V	72	CMOS		5	3.3/5,5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 25 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		95.2 MHz				24.2316 mm	No	25
XC95144XL-7CSG144C	Xilinx	Flash PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	144	CMOS	117	3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	138.88 MHz	30 s	117	260 °C (500 °F)	12 mm	Yes	117
XC95108F-20PQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.25 V	108	CMOS		5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	50 MHz	30 s		225 °C (437 °F)	20 mm	Yes	81
XC9536-7CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	36	CMOS		5	3.3/5,5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	83.3 MHz	30 s		260 °C (500 °F)	7 mm	Yes	34
XC9572-15PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	72	CMOS		5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	55.6 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.