Commercial Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC7272-30PC84C	Xilinx	OT PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	48 ns	Yes		72	CMOS			5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No			1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0		30 s		225 °C (437 °F)		No
XC9536-7VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	83.3 MHz	30 s		240 °C (464 °F)	10 mm	Yes	34
XCR3256XL-7.5CS280C	Xilinx	EE PLD	Commercial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS			3.3		Grid Array, Thin Profile, Fine Pitch				Macrocell	3 V	.8 mm	70 °C (158 °F)	160 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	167 MHz				16 mm		160
XC9536XV-5CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns	Yes	2.62 V	36	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1		30 s		260 °C (500 °F)	7 mm	Yes	36
XC2C256-5CP132C	Xilinx	Flash PLD	Commercial	Ball	132	TFBGA	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	256	CMOS			1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 106 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No	Real Digital Design Technology	e0		30 s		240 °C (464 °F)	8 mm	Yes	106
XC9572F-15PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic	15 ns	Yes		72	CMOS				3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No			1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3			No		e0		30 s		225 °C (437 °F)		Yes
XC7336-5PQ44C	Xilinx	OT PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	8.5 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Flatpack	QFP44,.5SQ,20	Programmable Logic Devices	No	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	2.35 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	167 MHz	30 s		225 °C (437 °F)	10 mm	No	32
XCR3384XL-10FGG324C	Xilinx	EE PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS			3.3	3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 220 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	102 MHz	30 s		250 °C (482 °F)	23 mm	Yes	220
XCR3384XL-10FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	102 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
XC9536F-7PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS			5		Chip Carrier				Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	83 MHz	30 s		245 °C (473 °F)	16.5862 mm		34
XC9536XV-4CSG48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	4 ns	Yes	2.62 V					2.5		Grid Array, Fine Pitch				Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1		30 s		260 °C (500 °F)	7 mm		36
XCR3064XL-6CP56C	Xilinx	EE PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 48 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e0	192 MHz	30 s		240 °C (464 °F)	6 mm	Yes	48
XC95108F-15PC84C	Xilinx	Flash PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	108	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 69 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	56 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XC2C384-10TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	384	CMOS	118	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 118 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	83 MHz		118		20 mm	Yes	118
XC9536-6VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	100 MHz	30 s		260 °C (500 °F)	10 mm	Yes	34
XC95144XV-7CS144C	Xilinx	Flash PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	144	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	125 MHz	30 s		240 °C (464 °F)	12 mm	Yes	117
XC95432-10BGG432C	Xilinx	Flash PLD	Commercial	Ball	432	LBGA	Square	Plastic/Epoxy	10 ns	Yes			CMOS			5		Grid Array, Low Profile				Macrocell		1.27 mm	70 °C (158 °F)	232 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1					40 mm		232
XC2C32-3CP56C	Xilinx	Flash PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	3 ns	Yes	1.9 V	32	CMOS			1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	1 Dedicated Inputs, 33 I/O	1	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e0		30 s		240 °C (464 °F)	6 mm	Yes	33
XC7336-7PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	125 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC95576-12HQ304C	Xilinx	Flash PLD	Commercial	Gull Wing	304	HFQFP	Square	Plastic/Epoxy	12 ns	Yes			CMOS			5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 232 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No		e0					40 mm		232
XCR3256XL-7.5CSG280C	Xilinx	EE PLD	Commercial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS			3.3		Grid Array, Thin Profile, Fine Pitch				Macrocell	3 V	.8 mm	70 °C (158 °F)	160 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	167 MHz				16 mm		160
XCR3512XL-7FG324C	Xilinx	EE PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	512	CMOS			3.3	3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 260 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	135 MHz	30 s		225 °C (437 °F)	23 mm	Yes	260
XC95288XV-6FG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns	Yes	2.62 V	288	CMOS			2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.37 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	208 MHz	30 s		225 °C (437 °F)	17 mm	Yes	192
XC2C32-3VQG44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	3 ns	Yes	1.9 V	32	CMOS			1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V	.8 mm	70 °C (158 °F)	1 Dedicated Inputs, 33 I/O	1	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	10 mm	Yes	33
XC2C384-7PQG208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	384	CMOS	173	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	112 MHz	30 s	173	245 °C (473 °F)	28 mm	Yes	173
XCR5128-7PQ160C	Xilinx	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	9.5 ns	Yes	5.25 V	128	CMOS			5	5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 95 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	95 MHz	30 s		225 °C (437 °F)	28 mm	Yes	95
XC9572F-7PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic	7.5 ns	Yes		72	CMOS				3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No			1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3			No		e0		30 s		225 °C (437 °F)		Yes
XCR3320-7TQ160C	Xilinx	Loadable PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	320	CMOS			3.3	3.3 V	Flatpack	QFP160,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQFP-G160	1			No			111 MHz					Yes
XC2C32-3PCG44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	3 ns	Yes	1.9 V	32	CMOS			1.8	1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 33 I/O	1	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Real Digital Design Technology	e3		30 s		245 °C (473 °F)	16.5862 mm	Yes	33
XC73108-7PC84C	Xilinx	OT PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	18 ns	Yes	5.25 V	108	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 37 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	83.3 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	37
XC95288XV-10PQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	2.62 V	288	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	100 MHz	30 s		225 °C (437 °F)	28 mm	Yes	168
XC9536-15VQ44C	Xilinx	Flash PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	55.6 MHz	30 s		240 °C (464 °F)	10 mm	Yes	34
XC7272-25PC84C	Xilinx	OT PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	40 ns	Yes		72	CMOS			5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No			1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0		30 s		225 °C (437 °F)		No
XCR3064XL-7PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	119 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	36
XC7236-25PC44C	Xilinx	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	40 ns	Yes	5.25 V	36	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 30 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks	e0	33 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	30
XCR3384XL-12FGG324C	Xilinx	EE PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	384	CMOS			3.3	3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 220 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	83 MHz	30 s		250 °C (482 °F)	23 mm	Yes	220
XC95288XV-7TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	288	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	125 MHz	30 s		225 °C (437 °F)	20 mm	Yes	117
XCR3256XL-10FTG256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	105 MHz	30 s		260 °C (500 °F)	17 mm	Yes	164
XC95216-20PQG160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	216	CMOS			5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 133 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	3.7 mm	28 mm	No		e3	50 MHz	30 s		245 °C (473 °F)	28 mm	Yes	133
XC7372-12WC68C	Xilinx	UV PLD	Commercial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	28 ns	Yes	5.25 V	72	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 25 I/O	10	0 °C (32 °F)		Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		62.5 MHz				24.13 mm	No	25
XC2C128-4VQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	4.5 ns	Yes	1.9 V	128	CMOS			1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm	Yes	80
XCR5128-7PQ100C	Xilinx	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	9.5 ns	Yes	5.25 V	128	CMOS			5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	95 MHz	30 s		225 °C (437 °F)	20 mm	Yes	80
XC95144-15TQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	144	CMOS			5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	55.6 MHz	30 s		260 °C (500 °F)	14 mm	Yes	81
XCR3064XL-7VQ44C	Xilinx	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	119 MHz				10 mm	Yes	36
XC95108F-10PQ160C	Xilinx	Flash PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	108	CMOS			5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	67 MHz	30 s		225 °C (437 °F)	28 mm	Yes	108
XC95144XL-7TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	144	CMOS	81		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e4	125 MHz		81		14 mm	Yes	81
XC95288-10HQG304C	Xilinx	Flash PLD	Commercial	Gull Wing	304	HFQFP	Square	Plastic/Epoxy	10 ns	Yes			CMOS			5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3					40 mm		192
XCR5064C-7PC44C	Xilinx	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	64	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	105 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.