Commercial Programmable Logic Devices (PLD) 2,400+

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

XC9536-6PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

6 ns

Yes

5.25 V

36

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

e0

100 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

34

XC2C256-5VQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

5 ns

Yes

1.9 V

256

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Real Digital Design Technology

e3

30 s

260 °C (500 °F)

14 mm

Yes

80

XC2C384-6PQG208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

384

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 173 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

30 s

245 °C (473 °F)

28 mm

Yes

173

XC9536XL-4PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4 ns

Yes

3.6 V

36

CMOS

3.3

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

36 Macrocells

e0

200 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

34

XC9536XL-5CS48C

Xilinx

Flash PLD

Commercial

Ball

48

FBGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

36

CMOS

36

3.3

2.5/3.3,3.3 V

Grid Array, Fine Pitch

BGA48,7X7,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

36 Macrocells

e0

178.6 MHz

30 s

36

240 °C (464 °F)

7 mm

Yes

36

XCR5064-10PQ100C

Xilinx

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

64

CMOS

5

5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

No

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e0

77 MHz

30 s

225 °C (437 °F)

20 mm

No

64

XC95216-15HQG208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Flatpack, Fine Pitch

Macrocell

4.75 V

.4 mm

70 °C (158 °F)

0 Dedicated Inputs, 166 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

55.6 MHz

30 s

245 °C (473 °F)

28 mm

166

XC95144-7TQ100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

144

CMOS

5

3.3/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 81 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

83.3 MHz

30 s

225 °C (437 °F)

14 mm

Yes

81

XC95144XL-5CS144C

Xilinx

Flash PLD

Commercial

Ball

144

TFBGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

144

CMOS

117

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 117 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

138.88 MHz

30 s

117

240 °C (464 °F)

12 mm

Yes

117

XC95216-15BGG352C

Xilinx

Flash PLD

Commercial

Ball

352

LBGA

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Grid Array, Low Profile

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 166 I/O

0

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B352

3

1.4 mm

35 mm

No

216 Macrocells; Configurable I/O operation with 3.3 V or 5 V

e1

55.6 MHz

30 s

260 °C (500 °F)

35 mm

166

XC73108-12WB225C

Xilinx

UV PLD

Commercial

Ball

225

WBGA

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Grid Array, Window

BGA225,15X15

Programmable Logic Devices

No

Macrocell

4.75 V

1.5 mm

70 °C (158 °F)

12 Dedicated Inputs, 78 I/O

12

0 °C (32 °F)

Bottom

S-CBGA-B225

1

No

108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops

55.6 MHz

No

78

XC2C32A-4PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4 ns

Yes

1.9 V

32

CMOS

1.8

1.5/3.3,1.8 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

1.27 mm

70 °C (158 °F)

33 I/O

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.572 mm

16.5862 mm

No

Real Digital Design Technology

e0

450 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

33

XC2C256-5PQ208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

5 ns

Yes

1.9 V

256

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 173 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Real Digital Design Technology

e0

30 s

225 °C (437 °F)

28 mm

Yes

173

XCR3032XL-5PC44C

Xilinx

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

32

CMOS

3.3

3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

e0

175 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

36

XCR5032-7VQ44C

Xilinx

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

80 MHz

10 mm

32

XC95432-10HQG304C

Xilinx

Flash PLD

Commercial

Gull Wing

304

HFQFP

Square

Plastic/Epoxy

10 ns

Yes

CMOS

5

Flatpack, Heat Sink/Slug, Fine Pitch

Macrocell

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 232 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G304

4.5 mm

40 mm

No

e3

40 mm

232

XC7272-30WC84C

Xilinx

UV PLD

Commercial

J Bend

84

QCCJ

Square

Ceramic

48 ns

Yes

72

CMOS

5

5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-XQCC-J84

No

No

XC2C128-4TQ144C

Xilinx

Flash PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4.5 ns

Yes

1.9 V

128

CMOS

1.8

1.5/3.3,1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

30 s

225 °C (437 °F)

20 mm

Yes

100

XC95108F-20PC84C

Xilinx

Flash PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 69 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

50 MHz

30 s

225 °C (437 °F)

29.3116 mm

Yes

69

XCR5032C-7VQ44C

Xilinx

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

32

CMOS

5

5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

80 MHz

30 s

240 °C (464 °F)

10 mm

Yes

32

XC73108-12WC84C

Xilinx

UV PLD

Commercial

J Bend

84

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.25 V

108

CMOS

5

3.3/5,5 V

Chip Carrier, Window

LDCC84,1.2SQ

Programmable Logic Devices

No

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 37 I/O

12

0 °C (32 °F)

Quad

S-CQCC-J84

1

4.826 mm

29.21 mm

No

108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops

55.6 MHz

29.21 mm

No

37

XCR3256XL-12FTG256C

Xilinx

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

256

CMOS

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

88 MHz

30 s

260 °C (500 °F)

17 mm

Yes

164

TC180E16

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

TC180E05

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

TC170C18

Toshiba

OT PLD

Commercial

5.25 V

CMOS

5

4.75 V

70 °C (158 °F)

0 °C (32 °F)

No

TC180E12

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

TC170C70

Toshiba

OT PLD

Commercial

5.25 V

CMOS

5

4.75 V

70 °C (158 °F)

0 °C (32 °F)

No

TC180E03

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

TC170C12

Toshiba

OT PLD

Commercial

5.25 V

CMOS

5

4.75 V

70 °C (158 °F)

0 °C (32 °F)

No

TC170C08

Toshiba

OT PLD

Commercial

5.25 V

CMOS

5

4.75 V

70 °C (158 °F)

0 °C (32 °F)

No

TC180C19

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

TC170C29

Toshiba

OT PLD

Commercial

5.25 V

CMOS

5

4.75 V

70 °C (158 °F)

0 °C (32 °F)

No

TC183ET4

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

240 °C (464 °F)

TC170G70

Toshiba

OT PLD

Commercial

0.26 ns

5.25 V

CMOS

5

4.75 V

70 °C (158 °F)

0 Dedicated Inputs, 0 I/O

0

0 °C (32 °F)

No

0

TC183GT8

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

240 °C (464 °F)

TC183GT7

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

240 °C (464 °F)

TC170GT5

Toshiba

OT PLD

Commercial

0.26 ns

5.25 V

CMOS

5

4.75 V

70 °C (158 °F)

0 Dedicated Inputs, 0 I/O

0

0 °C (32 °F)

No

0

TC183G61

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

240 °C (464 °F)

TC183ET5

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

240 °C (464 °F)

TC170C27

Toshiba

OT PLD

Commercial

5.25 V

CMOS

5

4.75 V

70 °C (158 °F)

0 °C (32 °F)

No

TC180C20

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

TC170C55

Toshiba

OT PLD

Commercial

5.25 V

CMOS

5

4.75 V

70 °C (158 °F)

0 °C (32 °F)

No

TC180E17

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

TC170C62

Toshiba

OT PLD

Commercial

5.25 V

CMOS

5

4.75 V

70 °C (158 °F)

0 °C (32 °F)

No

TC180E11

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

TC170GB3

Toshiba

OT PLD

Commercial

0.26 ns

5.25 V

CMOS

5

4.75 V

70 °C (158 °F)

0 Dedicated Inputs, 0 I/O

0

0 °C (32 °F)

No

0

TC180C30

Toshiba

OT PLD

Commercial

3.3 V

CMOS

3

Macrocell

2.7 V

70 °C (158 °F)

0 °C (32 °F)

No

Can also operate at 3V to 3.6V supply

TC170C01

Toshiba

OT PLD

Commercial

5.25 V

CMOS

5

4.75 V

70 °C (158 °F)

0 °C (32 °F)

No

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.