Commercial Extended Programmable Logic Devices (PLD) 580

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
PLUS16R4-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL			5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)	Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	Power-Up Reset	74 MHz		8.965 mm	4
PLUS173DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	TTL	22	PLA-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Combinatorial	4.75 V	42	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Output Polarity		10	11.505 mm	10
PLC18V8Z25DB-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS			5		Small Outline, Shrink Pitch			Macrocell	4.75 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Dual	R-PDSO-G20	2 mm	5.3 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock	30 MHz		7.2 mm	8
PLQ16R4-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS			5		In-Line			Mixed	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)	Dual	R-PDIP-T20			No	Register Preload; Power-Up Reset	118 MHz			4
PL22V10-10A	NXP Semiconductors	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS			5		Chip Carrier			Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset	66.6 MHz		11.505 mm	10
PLC18V8Z35N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No	5.25 V	CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	74	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Dual	R-PDIP-T20	4.2 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	21 MHz	8	26.73 mm	8
PLS100A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	50 ns	Yes	5.25 V	TTL	16	PLA-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Combinatorial	4.75 V	48	1.27 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Tri-State Output		8	11.505 mm	0
PLUS16R8DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL			5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)	Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	Power-Up Reset	60.6 MHz		26.695 mm	0
P3C18V8Z35N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	45 ns	No	3.6 V	CMOS			3.3		In-Line			Macrocell	2.7 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Dual	R-PDIP-T20	4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock	21 MHz		26.73 mm	8
LVT22V10-7D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	8.5 ns	Yes	3.6 V	BICMOS	22	PAL-TYPE	3.3	3.3 V	Small Outline	SOP24,.4	Programmable Logic Devices	Macrocell	3 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Dual	R-PDSO-G24	2.65 mm	7.5 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock	95 MHz	10	15.4 mm	10
LVT22V10-DA-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	BICMOS			3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock	74 MHz		11.5062 mm	10
PL22V10-12A	NXP Semiconductors	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS			5		Chip Carrier			Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset	58.8 MHz		11.505 mm	10
PLUS105-55N3	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL			5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)	Dual	R-PDIP-T28	5.33 mm	7.62 mm	No	Programmable Logic Sequencer; 1 External Clock	35.7 MHz		35.505 mm	0
PLQ20R6-5A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	BICMOS			5		Chip Carrier			Mixed	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)	Quad	S-PQCC-J28			No	Register Preload; Power-Up Reset	118 MHz			2
PML2852-50KA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	84	QCCJ	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	CMOS			5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	29 Dedicated Inputs, 24 I/O	29	0 °C (32 °F)	Quad	S-CQCC-J84	4.83 mm	29.145 mm	No	52 Flip Flops			29.145 mm	24
PLC18V8Z35A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	21 MHz	8	8.965 mm	8
LVT16V8-7DB	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	9 ns	Yes	3.6 V	BICMOS			3.3		Small Outline, Shrink Pitch			Macrocell	3 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Dual	R-PDSO-G20	2 mm	5.3 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock	91 MHz		7.2 mm	8
PLS168A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	30 ns	Yes	5.25 V	TTL			5		Chip Carrier			Registered	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock	9.8 MHz		11.505 mm	0
PLC415-16FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.25 V	CMOS			5		In-Line			Registered	4.75 V			75 °C (167 °F)	15 Dedicated Inputs, 0 I/O	15	0 °C (32 °F)	Dual	R-GDIP-T28			No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock	13.3 MHz			0
PLS157A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	55 ns	Yes	5.25 V	TTL			5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	4 Dedicated Inputs, 12 I/O	4	0 °C (32 °F)	Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	Programmable Logic Sequencer; 1 External Clock	14 MHz		8.965 mm	12
PLUS105-70A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	6.5 ns	Yes	5.25 V	TTL			5		Chip Carrier			Registered	4.75 V		1.27 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock	47.6 MHz		11.505 mm	0
PLS167A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	30 ns	Yes	5.25 V	TTL			5		Chip Carrier			Registered	4.75 V		1.27 mm	75 °C (167 °F)	14 Dedicated Inputs, 0 I/O	14	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock	9.8 MHz		11.505 mm	0
PLC18V8Z25A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	30 MHz	8	8.965 mm	8
PLUS20R8-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	TTL			5		Chip Carrier			Registered	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Power-Up Reset	74 MHz		11.505 mm	0
PML2852-35A-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	CMOS			5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	29 Dedicated Inputs, 24 I/O	29	0 °C (32 °F)	Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No	52 Flip Flops			29.3116 mm	24
LVT16V8-7D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	9 ns	Yes	3.6 V	BICMOS			3.3		Small Outline			Macrocell	3 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock	91 MHz		12.8 mm	8
ABT22V10A7A-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	BICMOS			5		Chip Carrier			Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock	111 MHz		11.5062 mm	10
LVT22V10-BA-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	BICMOS			3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock	50 MHz		11.5062 mm	10
PLUS16R6DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL			5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)	Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	Power-Up Reset	60.6 MHz		8.965 mm	2
LVT22V10B7A-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS			3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Programmable Output Polarity	95 MHz		11.5062 mm	10
PLUS153DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V	TTL	18	PLA-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial	4.75 V	42	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)	Dual	R-PDIP-T20			No	Programmable Output Polarity		10		10
PLUS173-10A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL			5		Chip Carrier			Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Output Polarity			11.505 mm	10
LVT16V8-6N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7 ns	No	3.6 V	BICMOS			3.3		In-Line			Macrocell	3 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Dual	R-PDIP-T20	4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock	111 MHz		26.73 mm	8
P3C18V8Z40D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	3.6 V	CMOS			3.3		Small Outline			Macrocell	3 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	Programmable Output Polarity	22 MHz		12.8 mm	8
LVT22V10-DD	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.6 V	BICMOS			3.3		Small Outline			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Dual	R-PDSO-G24	2.65 mm	7.5 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock	74 MHz		15.4 mm	10
LVT22V10-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	8.5 ns	No	3.6 V	BICMOS	22	PAL-TYPE	3.3	3.3 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	3 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock	95 MHz	10	31.7 mm	10
PLC18V8Z35D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS	18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	21 MHz	8	12.8 mm	8
LVT22V10BBA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	BICMOS			3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	Programmable Output Polarity; Shared Input/Clock	50 MHz		11.5062 mm	10
LVT22V10-7D-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	8.5 ns	Yes	3.6 V	BICMOS			3.3		Small Outline			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Dual	R-PDSO-G24	2.65 mm	7.5 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock	95 MHz		15.4 mm	10
PLQ16L8-5A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	BICMOS			5		Chip Carrier			Combinatorial	4.75 V			75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)	Quad	S-PQCC-J20			No					6
PLUS20R8DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL			5		Chip Carrier			Registered	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Power-Up Reset	60.6 MHz		11.505 mm	0
PLUS173BA-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	TTL			5		Chip Carrier			Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Output Polarity			11.505 mm	10
P3C18V8Z40A-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	40 ns	Yes	3.6 V	CMOS			3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Programmable Output Polarity	22 MHz		8.9662 mm	8
PLUS16R6DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL			5		In-Line			Mixed	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)	Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	Power-Up Reset	60.6 MHz		26.695 mm	2
LVT22V10-7A-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	8.5 ns	Yes	3.6 V	BICMOS			3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock	95 MHz		11.5062 mm	10
PLUS405-45N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	TTL	16	PLS-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices	Registered	4.75 V	64	2.54 mm	75 °C (167 °F)	15 Dedicated Inputs, 8 I/O	15	0 °C (32 °F)	Dual	R-PDIP-T28	5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock	29.4 MHz	8	36.51 mm	8
PLUS173BN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	TTL	22	PLA-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial	4.75 V	42	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Programmable Output Polarity		10	31.7 mm	10
PLC415-16A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	40 ns	Yes	5.25 V	CMOS			5		Chip Carrier			Registered	4.75 V		1.27 mm	75 °C (167 °F)	15 Dedicated Inputs, 0 I/O	15	0 °C (32 °F)	Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock	13.3 MHz		11.505 mm	0

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.