Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
Flash PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
e3 |
55.5 MHz |
10 |
31.877 mm |
10 |
|||||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
64 |
CMOS |
32 |
5 |
Tube |
Chip Carrier |
LDCC44,.7SQ |
Yes |
Macrocell |
4.5 V |
40 |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
Power-Up Reset; Security Fuse |
e3 |
125 MHz |
40 s |
32 |
245 °C (473 °F) |
16.5862 mm |
Yes |
32 |
||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
128 |
5 |
Tray |
3.3/5,5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
125 MHz |
40 s |
260 °C (500 °F) |
14 mm |
Yes |
80 |
|||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
64 |
CMOS |
32 |
5 |
Tray |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Yes |
Macrocell |
4.5 V |
40 |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
Power-Up Reset; Security Fuse |
e3 |
125 MHz |
40 s |
32 |
260 °C (500 °F) |
10 mm |
Yes |
32 |
||||||
|
Microchip Technology |
Flash PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
20 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
e3 |
38.5 MHz |
10 |
32 mm |
10 |
|||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
128 |
3.3 |
Tray |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
100 MHz |
40 s |
260 °C (500 °F) |
14 mm |
Yes |
80 |
|||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
144 |
CMOS |
81 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 81 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
138.88 MHz |
30 s |
81 |
260 °C (500 °F) |
14 mm |
Yes |
81 |
|||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
64 |
CMOS |
64 |
5 |
Tray |
3.3/5,5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
40 |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Power-Up Reset; Security Fuse |
e3 |
125 MHz |
40 s |
64 |
260 °C (500 °F) |
14 mm |
Yes |
64 |
||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
36 |
CMOS |
34 |
3.3 |
Tray |
2.5/3.3,3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
138.88 MHz |
30 s |
34 |
260 °C (500 °F) |
10 mm |
Yes |
34 |
||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 33 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
Real Digital Design Technology |
e3 |
200 MHz |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
33 |
||||||||
|
Xilinx |
Flash PLD |
Industrial |
No Lead |
48 |
VQCCN |
Square |
7.5 ns |
Yes |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Chip Carrier, Very Thin Profile |
LCC48,.27SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 37 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
No |
Real Digital Design Technology |
e3 |
200 MHz |
30 s |
260 °C (500 °F) |
7 mm |
Yes |
37 |
|||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
3.3 |
Tray |
Flatpack, Thin Profile |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
100 MHz |
40 s |
260 °C (500 °F) |
10 mm |
32 |
|||||||||||||||
|
Intel |
Flash PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
1.89 V |
980 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
114 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e3 |
201.1 MHz |
20 mm |
Yes |
114 |
|||||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
64 |
CMOS |
32 |
5 |
Tube |
Chip Carrier |
LDCC44,.7SQ |
Yes |
Macrocell |
4.5 V |
40 |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
4.57 mm |
29.3116 mm |
No |
Power-Up Reset; Security Fuse |
e3 |
125 MHz |
32 |
29.3116 mm |
Yes |
32 |
|||||||||
|
Intel |
Flash PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
1.89 V |
440 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
74 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
e3 |
118.3 MHz |
14 mm |
Yes |
74 |
|||||||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
72 |
CMOS |
34 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
72 Macrocells |
e3 |
100 MHz |
30 s |
34 |
260 °C (500 °F) |
10 mm |
Yes |
34 |
||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
2 |
4.572 mm |
11.5062 mm |
No |
e3 |
55.5 MHz |
10 |
11.5062 mm |
10 |
|||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
256 |
CMOS |
80 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Real Digital Design Technology |
e3 |
108 MHz |
30 s |
80 |
260 °C (500 °F) |
14 mm |
Yes |
80 |
|||||
|
Microchip Technology |
Flash PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
e3 |
90 MHz |
10 |
31.877 mm |
10 |
|||||||||
|
Intel |
Flash PLD |
Industrial |
Gull Wing |
64 |
HTFQFP |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
64 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP64,.35SQ,16 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.4 mm |
100 °C (212 °F) |
54 I/O |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQFP-G64 |
3 |
1.2 mm |
7 mm |
No |
e3 |
118.3 MHz |
30 s |
260 °C (500 °F) |
7 mm |
Yes |
54 |
||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
e3 |
90 MHz |
10 |
11.5062 mm |
10 |
||||||||||
|
Intel |
Flash PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
192 |
CMOS |
79 |
1.8 |
1.8,1.2/3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
79 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
e3 |
118.3 MHz |
79 |
14 mm |
Yes |
79 |
||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
128 |
5 |
Tray |
3.3/5,5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
128 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e3 |
33.3 MHz |
40 s |
260 °C (500 °F) |
14 mm |
Yes |
80 |
||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
64 |
TFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
72 |
CMOS |
36 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP64,.47SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 52 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
No |
72 Macrocells |
e3 |
100 MHz |
30 s |
36 |
260 °C (500 °F) |
10 mm |
Yes |
52 |
||||||
|
Microchip Technology |
Flash PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
2.54 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
No |
e3 |
45 MHz |
8 |
25.908 mm |
8 |
|||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
3.3 |
Tray |
Flatpack, Thin Profile |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
83.3 MHz |
40 s |
260 °C (500 °F) |
10 mm |
32 |
|||||||||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
128 |
CMOS |
80 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
119 MHz |
30 s |
80 |
260 °C (500 °F) |
14 mm |
Yes |
80 |
||||||
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
3.3 |
Tape and Reel |
Flatpack, Thin Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
100 MHz |
14 mm |
80 |
||||||||||||||||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
72 |
CMOS |
72 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 72 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
72 Macrocells |
e3 |
100 MHz |
30 s |
72 |
260 °C (500 °F) |
14 mm |
Yes |
72 |
||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
5 |
Tape and Reel |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
e3 |
125 MHz |
16.5862 mm |
32 |
|||||||||||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
64 |
CMOS |
64 |
5 |
Tray |
3.3/5,5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
40 |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Power-Up Reset; Security Fuse |
e3 |
60 MHz |
40 s |
64 |
260 °C (500 °F) |
14 mm |
Yes |
64 |
||||
|
Intel |
Flash PLD |
Industrial |
Gull Wing |
64 |
HTFQFP |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
128 |
CMOS |
1.8 |
1.2/3.3,1.8 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP64,.35SQ,16 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.4 mm |
100 °C (212 °F) |
54 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G64 |
1.2 mm |
7 mm |
No |
e3 |
118.3 MHz |
7 mm |
Yes |
54 |
|||||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
10 |
CMOS |
5 |
Tube |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
e3 |
44 MHz |
31.877 mm |
No |
10 |
|||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.506 mm |
No |
e3 |
55.5 MHz |
10 |
11.506 mm |
No |
10 |
|||||||||
|
Intel |
Flash PLD |
Industrial |
Gull Wing |
64 |
HTFQFP |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
Macrocell |
1.71 V |
.4 mm |
100 °C (212 °F) |
54 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G64 |
1.2 mm |
7 mm |
No |
e3 |
118.3 MHz |
7 mm |
54 |
||||||||||||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
128 |
3.3 |
Tray |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
83.3 MHz |
40 s |
260 °C (500 °F) |
14 mm |
Yes |
80 |
|||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
1.9 V |
384 |
CMOS |
118 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 118 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
83 MHz |
30 s |
118 |
260 °C (500 °F) |
20 mm |
Yes |
118 |
||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
5 |
Tape and Reel |
Flatpack, Thin Profile |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
1 |
1.2 mm |
10 mm |
64 Macrocells; In-system programmable; JTAG boundry-scan test circuitry |
e3 |
125 MHz |
260 °C (500 °F) |
10 mm |
32 |
||||||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Small Outline |
SOP24,.4 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
No |
e3 |
38.5 MHz |
10 |
15.4 mm |
10 |
||||||||||
|
Intel |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.6 ns |
576 |
Yes |
5.25 V |
CMOS |
102 |
5 |
3.3/5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
102 |
20 mm |
102 |
||||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
64 |
CMOS |
32 |
5 |
Tray |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Yes |
Macrocell |
4.5 V |
40 |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
Power-Up Reset; Security Fuse |
e3 |
60 MHz |
40 s |
32 |
260 °C (500 °F) |
10 mm |
Yes |
32 |
||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
128 |
5 |
Tube |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
2 |
4.572 mm |
29.3115 mm |
No |
e3 |
125 MHz |
29.3115 mm |
Yes |
64 |
|||||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
72 |
CMOS |
72 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 72 I/O |
0 |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
72 Macrocells |
e4 |
100 MHz |
72 |
14 mm |
Yes |
72 |
||||||||
|
Intel |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e3 |
100 MHz |
10 mm |
Yes |
34 |
|||||||||||
|
Xilinx |
Flash PLD |
Industrial |
No Lead |
32 |
SON |
Square |
Plastic/Epoxy |
6 ns |
Yes |
1.9 V |
32 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Small Outline |
LCC32,.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
85 °C (185 °F) |
21 I/O |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-N32 |
3 |
1 mm |
5 mm |
No |
Real Digital Design Technology |
e3 |
300 MHz |
30 s |
260 °C (500 °F) |
5 mm |
Yes |
21 |
|||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
1.9 V |
32 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile |
LCC32,.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.8 mm |
85 °C (185 °F) |
33 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
Real Digital Design Technology |
e3 |
300 MHz |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
33 |
|||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
144 |
CMOS |
81 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 81 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
138.88 MHz |
30 s |
81 |
260 °C (500 °F) |
14 mm |
Yes |
81 |
|||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
128 |
3.3 |
Tube |
3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
4.572 mm |
29.3115 mm |
No |
100 MHz |
29.3115 mm |
Yes |
64 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.