Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intel |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
256 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
28 mm |
Yes |
164 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
10 Macrocells; Shared Input/Clock |
e3 |
55.5 MHz |
10 |
31.75 mm |
10 |
||||||||||
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
108 |
CMOS |
81 |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 81 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e0 |
66.7 MHz |
30 s |
81 |
225 °C (437 °F) |
20 mm |
Yes |
81 |
||||||||
|
Xilinx |
Flash PLD |
Industrial |
Ball |
48 |
FBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
36 |
CMOS |
36 |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Fine Pitch |
BGA48,7X7,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B48 |
3 |
1.8 mm |
7 mm |
No |
e1 |
138.88 MHz |
30 s |
36 |
260 °C (500 °F) |
7 mm |
Yes |
36 |
|||||||
|
Intel |
Flash PLD |
Industrial |
Ball |
100 |
TFBGA |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
192 |
CMOS |
79 |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA100,11X11,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
79 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
1.2 mm |
6 mm |
No |
e1 |
118.3 MHz |
79 |
6 mm |
Yes |
79 |
||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
Tube |
5 V |
Small Outline |
SOP20,.4 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
No |
8 Macrocells |
e3 |
100 MHz |
8 |
12.8 mm |
8 |
|||||||||
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.506 mm |
38.5 MHz |
11.506 mm |
10 |
||||||||||||||||||||||
Intel |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.6 ns |
2880 |
Yes |
2.7 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
102 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
102 |
20 mm |
102 |
||||||||||||||
|
Intel |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.6 ns |
2880 |
Yes |
2.7 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
102 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
102 |
20 mm |
102 |
|||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
20 mm |
80 |
||||||||||||||||||
|
Xilinx |
Flash PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 33 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
Real Digital Design Technology |
e3 |
200 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
33 |
||||||||
|
Xilinx |
Flash PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
288 |
CMOS |
192 |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 192 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2 mm |
17 mm |
No |
e1 |
100 MHz |
30 s |
192 |
260 °C (500 °F) |
17 mm |
Yes |
192 |
|||||||
|
Xilinx |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
3/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 108 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
119 MHz |
30 s |
260 °C (500 °F) |
20 mm |
Yes |
108 |
|||||||||
|
Intel |
Flash PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic |
10 ns |
Yes |
1.89 V |
980 |
CMOS |
AEC-Q100 |
1.8,1.2/3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
1.71 V |
1 mm |
105 °C (221 °F) |
0 Dedicated Inputs, 211 I/O |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B256 |
17 mm |
No |
17 mm |
Yes |
|||||||||||||||||||
Atmel |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3 V |
Flatpack, Thin Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
100 MHz |
10 mm |
Yes |
32 |
||||||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
128 |
QFP |
Square |
Plastic/Epoxy |
18.5 ns |
Yes |
5.5 V |
192 |
CMOS |
5 |
5 V |
Flatpack |
QFP128,1.2SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 96 I/O |
8 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G128 |
3 |
4.1 mm |
28 mm |
No |
Use ISPLSI1048EA for new designs; Use 1048E-70 for new 1048E-50 designs |
e3 |
56 MHz |
40 s |
245 °C (473 °F) |
28 mm |
No |
96 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
32 |
CMOS |
34 |
PAL-TYPE |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
No |
e3 |
52.6 MHz |
40 s |
32 |
260 °C (500 °F) |
7 mm |
Yes |
32 |
||||||
|
Xilinx |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3/3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
95 MHz |
30 s |
260 °C (500 °F) |
10 mm |
Yes |
36 |
|||||||||
|
Altera |
Flash PLD |
Industrial |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
440 |
CMOS |
1.8,1.2/3.3 V |
Flatpack |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
.5 mm |
105 °C (221 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
No |
Yes |
|||||||||||||||||||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
64 |
CMOS |
34 |
PAL-TYPE |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e3 |
76.9 MHz |
40 s |
32 |
260 °C (500 °F) |
10 mm |
Yes |
32 |
||||||
|
Intel |
Flash PLD |
Industrial |
Gull Wing |
100 |
QFP |
Square |
Plastic |
14 ns |
Yes |
64 |
CMOS |
AEC-Q100 |
1.8,1.2/3.3 V |
Flatpack |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
.5 mm |
105 °C (221 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G100 |
No |
Yes |
||||||||||||||||||||||||
|
Intel |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.4 ns |
1728 |
Yes |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
102 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
37.5 MHz |
102 |
20 mm |
102 |
||||||||||||
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
336 |
Yes |
5.5 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
336 Logic Elements |
e0 |
385 MHz |
64 |
220 °C (428 °F) |
29.3116 mm |
68 |
||||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
2.54 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Tin/Lead |
Dual |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
No |
e0 |
45.5 MHz |
30 s |
8 |
225 °C (437 °F) |
26.162 mm |
8 |
||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
128 |
QFP |
Square |
Plastic/Epoxy |
18.5 ns |
Yes |
5.5 V |
192 |
CMOS |
5 |
5 V |
Flatpack |
QFP128,1.2SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 96 I/O |
8 |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQFP-G128 |
3 |
4.1 mm |
28 mm |
No |
Use ISPLSI1048EA for new designs; Use 1048E-70 for new 1048E-50 designs |
e0 |
56 MHz |
30 s |
225 °C (437 °F) |
28 mm |
No |
96 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
96 |
CMOS |
PAL-TYPE |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 48 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
62.5 MHz |
40 s |
260 °C (500 °F) |
14 mm |
Yes |
48 |
||||||||
|
Xilinx |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3/3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
95 MHz |
30 s |
260 °C (500 °F) |
14 mm |
Yes |
68 |
|||||||||
Microchip Technology |
Flash PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
55.5 MHz |
31.877 mm |
10 |
||||||||||||||||||||||
|
Xilinx |
Flash PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
288 |
CMOS |
192 |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,20X20,50 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 192 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.55 mm |
27 mm |
No |
e1 |
125 MHz |
30 s |
192 |
250 °C (482 °F) |
27 mm |
Yes |
192 |
|||||||
Atmel |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
32 |
CMOS |
5 |
3.3,5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
60 MHz |
10 mm |
Yes |
32 |
||||||||||||
Microchip Technology |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
CMOS |
1.8 |
Tray |
Flatpack, Thin Profile |
Macrocell |
1.7 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 33 I/O |
0 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
10 mm |
33 |
||||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 8 I/O |
7 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
No |
8 Macrocells |
e3 |
100 MHz |
8 |
25.908 mm |
8 |
|||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
144 |
CMOS |
117 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 117 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
138.88 MHz |
30 s |
117 |
260 °C (500 °F) |
20 mm |
Yes |
117 |
|||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
288 |
CMOS |
168 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 168 I/O |
0 |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e4 |
100 MHz |
168 |
28 mm |
Yes |
168 |
|||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
288 |
CMOS |
168 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 168 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
100 MHz |
30 s |
168 |
245 °C (473 °F) |
28 mm |
Yes |
168 |
|||||||
|
Xilinx |
Flash PLD |
Industrial |
Ball |
48 |
FBGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
36 |
CMOS |
36 |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Fine Pitch |
BGA48,7X7,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B48 |
3 |
1.8 mm |
7 mm |
No |
e1 |
138.88 MHz |
30 s |
36 |
260 °C (500 °F) |
7 mm |
Yes |
36 |
|||||||
Atmel |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
32 |
CMOS |
5 |
3.3,5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
100 MHz |
30 s |
240 °C (464 °F) |
10 mm |
Yes |
32 |
||||||||||
Cypress Semiconductor |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
512 |
CMOS |
5 |
3.3/5 V |
Grid Array |
BGA256,20X20,50 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 197 I/O |
1 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.46 mm |
27 mm |
No |
512 Macrocells; Configurable I/O Operation with 3.3 V or 5 V |
e0 |
80 MHz |
27 mm |
Yes |
197 |
|||||||||||
Intel |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.5 ns |
4992 |
Yes |
2.625 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
147 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
37.5 MHz |
147 |
28 mm |
147 |
|||||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
No |
e0 |
52.6 MHz |
30 s |
240 °C (464 °F) |
7 mm |
Yes |
32 |
||||||||||
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
36 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
55.6 MHz |
30 s |
240 °C (464 °F) |
10 mm |
Yes |
34 |
||||||||||
Intel |
Flash PLD |
Industrial |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
11.2 ns |
Yes |
1.89 V |
1700 |
CMOS |
203 |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
100 °C (212 °F) |
203 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
No |
e0 |
201.1 MHz |
203 |
17 mm |
Yes |
203 |
|||||||||||
Intel |
Flash PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Thin Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
74 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
e0 |
118.3 MHz |
14 mm |
74 |
|||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
PAL-TYPE |
5 |
Tube |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
.65 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
No |
e3 |
45 MHz |
40 s |
8 |
260 °C (500 °F) |
6.5 mm |
8 |
||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
e3 |
125 MHz |
10 |
11.5062 mm |
10 |
||||||||||
Intel |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.4 ns |
2880 |
Yes |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
102 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
37.5 MHz |
102 |
20 mm |
102 |
|||||||||||||
|
Intel |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.9 ns |
1728 |
Yes |
3.6 V |
CMOS |
102 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
1728 Logic Elements; 216 Labs |
e3 |
80 MHz |
102 |
20 mm |
102 |
||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
No |
e0 |
41.6 MHz |
30 s |
8 |
225 °C (437 °F) |
8.9662 mm |
8 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.