Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intel |
EE PLD |
Industrial |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
No |
5.5 V |
256 |
CMOS |
5 |
3.3/5,5 V |
Grid Array |
PGA192M,17X17 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P192 |
1 |
5.43 mm |
45.15 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
76.9 MHz |
220 °C (428 °F) |
45.15 mm |
No |
160 |
||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
16 ns |
Yes |
5.5 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
320 Macrocells |
e0 |
117.6 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
60 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
10 Macrocells; Shared Input/Clock |
e0 |
83.3 MHz |
10 |
31.75 mm |
10 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
3 |
1.6 mm |
10 mm |
No |
e3 |
100 MHz |
30 s |
260 °C (500 °F) |
10 mm |
No |
32 |
|||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
18 ns |
Yes |
5.5 V |
256 |
CMOS |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 128 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
e0 |
50 MHz |
30 s |
225 °C (437 °F) |
28 mm |
Yes |
128 |
||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
14 Dedicated Inputs, 128 I/O |
14 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
62.5 MHz |
30 s |
225 °C (437 °F) |
28 mm |
Yes |
128 |
||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
No |
e0 |
62.5 MHz |
30 s |
240 °C (464 °F) |
7 mm |
Yes |
32 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e3 |
62.5 MHz |
40 s |
245 °C (473 °F) |
20 mm |
Yes |
64 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
256 |
CMOS |
5 |
5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
14 Dedicated Inputs, 128 I/O |
14 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
62.5 MHz |
40 s |
245 °C (473 °F) |
28 mm |
Yes |
128 |
|||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
512 |
CMOS |
5 |
5 V |
Flatpack, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
71.4 MHz |
30 s |
225 °C (437 °F) |
28 mm |
Yes |
160 |
||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms |
e0 |
83.3 MHz |
10 |
30.734 mm |
10 |
|||||||||||
Intel |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Macrocell |
240 |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQCC-J44 |
No |
e0 |
20 MHz |
24 |
||||||||||||||||||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
256 |
CMOS |
AEC-Q100 |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Real digital design technology, XILIK00225-1 |
e3 |
141 MHz |
30 s |
260 °C (500 °F) |
14 mm |
Yes |
80 |
|||||||
|
Xilinx |
Flash PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
1.9 V |
256 |
CMOS |
AEC-Q100 |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
1.7 V |
.5 mm |
105 °C (221 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Real Digital Design Technology |
e3 |
130 MHz |
30 s |
260 °C (500 °F) |
14 mm |
Yes |
80 |
|||||||
|
Xilinx |
Flash PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
72 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
72 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e3 |
55.6 MHz |
30 s |
245 °C (473 °F) |
16.5862 mm |
Yes |
34 |
||||||||
Xilinx |
EE PLD |
Industrial |
Ball |
48 |
FBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
3.3 V |
Grid Array, Fine Pitch |
BGA48,7X7,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 40 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B48 |
3 |
1.8 mm |
7 mm |
No |
e0 |
119 MHz |
30 s |
240 °C (464 °F) |
7 mm |
Yes |
40 |
||||||||||
|
Xilinx |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
512 |
CMOS |
184 |
PLA-TYPE |
3.3 |
3/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
2.7 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 180 I/O |
0 |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e4 |
67.56 MHz |
180 |
28 mm |
Yes |
180 |
||||||||
|
Intel |
Flash PLD |
Industrial |
Ball |
324 |
LBGA |
Square |
Plastic/Epoxy |
11.2 ns |
Yes |
1.89 V |
1700 |
CMOS |
271 |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Low Profile |
BGA324,18X18,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
100 °C (212 °F) |
271 I/O |
0 |
-40 °C (-40 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B324 |
3 |
1.55 mm |
19 mm |
No |
e1 |
201.1 MHz |
30 s |
271 |
260 °C (500 °F) |
19 mm |
Yes |
271 |
|||||||
Atmel |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
50 MHz |
10 |
32 mm |
10 |
|||||||||||
Atmel |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
128 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
100 MHz |
30 s |
240 °C (464 °F) |
14 mm |
Yes |
80 |
|||||||||||
Atmel |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
128 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
83.3 MHz |
240 °C (464 °F) |
14 mm |
Yes |
80 |
||||||||||||
Cypress Semiconductor |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
32 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
1 Dedicated Inputs, 37 I/O |
1 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
1.6 mm |
10 mm |
No |
32 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
105 MHz |
10 mm |
Yes |
37 |
||||||||||||
Cypress Semiconductor |
UV PLD |
Industrial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
60 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
27.7 MHz |
24.13 mm |
No |
52 |
||||||||||||
Cypress Semiconductor |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
35 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 28 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.572 mm |
16.6116 mm |
No |
Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
16.6116 mm |
No |
28 |
||||||||||||
Intel |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
2880 |
Yes |
2.625 V |
CMOS |
186 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,50 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
85 °C (185 °F) |
186 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
37.5 MHz |
186 |
17 mm |
186 |
|||||||||||||
|
Intel |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.4 ns |
2880 |
Yes |
2.625 V |
CMOS |
186 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
85 °C (185 °F) |
186 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
37.5 MHz |
186 |
17 mm |
186 |
||||||||||||
Altera |
UV PLD |
Industrial |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
60 ns |
No |
5.5 V |
CMOS |
36 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP40,.6 |
Programmable Logic Devices |
Macrocell |
4.5 V |
240 |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T40 |
5.715 mm |
15.24 mm |
No |
24 Macrocells |
e0 |
20 MHz |
24 |
220 °C (428 °F) |
52.07 mm |
24 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.8 ns |
576 |
Yes |
3.6 V |
CMOS |
150 |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 134 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
576 Logic Elements; 72 Labs |
e0 |
80 MHz |
150 |
220 °C (428 °F) |
28 mm |
134 |
||||||||||
Intel |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.5 ns |
6656 |
Yes |
2.625 V |
CMOS |
186 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
186 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
186 |
32 mm |
186 |
||||||||||||||
|
Intel |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.5 ns |
6656 |
Yes |
2.625 V |
CMOS |
186 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
186 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
186 |
32 mm |
186 |
|||||||||||||
Intel |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
9984 |
Yes |
2.625 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
85 °C (185 °F) |
470 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
470 |
27 mm |
470 |
||||||||||||||
Intel |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.6 ns |
1152 |
Yes |
5.25 V |
CMOS |
102 |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
294 MHz |
102 |
20 mm |
102 |
||||||||||||
Intel |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
0.4 ns |
1728 |
Yes |
2.625 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
147 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
147 |
28 mm |
147 |
||||||||||||||
Intel |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12.5 ns |
1728 |
Yes |
2.7 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
147 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
147 |
28 mm |
147 |
||||||||||||||
Intel |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.6 ns |
2880 |
Yes |
2.7 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
189 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
2880 Logic Elements |
e0 |
140 MHz |
189 |
32 mm |
189 |
||||||||||||
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
452 Flip Flops; 336 Logic Elements |
29.3116 mm |
64 |
||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e0 |
138.9 MHz |
220 °C (428 °F) |
10 mm |
Yes |
34 |
|||||||||||
Intel |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 116 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
95.2 MHz |
20 mm |
Yes |
116 |
||||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
44 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 28 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J44 |
4.57 mm |
16.51 mm |
No |
Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
16.51 mm |
No |
28 |
|||||||||||
Intel |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
1 |
4.57 mm |
16.5862 mm |
No |
64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
135.1 MHz |
16.5862 mm |
Yes |
36 |
|||||||||||
Intel |
EE PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 52 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
3 |
5.08 mm |
24.2316 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
24.2316 mm |
No |
52 |
|||||||||||
Intel |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
29.3116 mm |
No |
68 |
|||||||||||
|
Intel |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
38 |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
4.75 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
16.585 mm |
No |
83.33 MHz |
32 |
16.585 mm |
No |
32 |
||||||||||||||
|
Intel |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.25 V |
64 |
CMOS |
72 |
3.3/5,5 V |
Flatpack |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
4.75 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
14 mm |
No |
e3 |
164 MHz |
68 |
14 mm |
No |
68 |
||||||||||||||
Intel |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
166.7 MHz |
10 mm |
Yes |
36 |
|||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
96 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 52 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
3 |
5.08 mm |
24.2316 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
24.2316 mm |
No |
52 |
||||||||||
Intel |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
83.3 MHz |
29.3116 mm |
No |
64 |
|||||||||||
Intel |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
126.6 MHz |
28 mm |
Yes |
164 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.