Industrial Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

GAL20V8S-20HB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

20 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

33.3 MHz

8

GAL16V8AS-15EB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDIP-T20

3.93 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

41.6 MHz

25.15 mm

8

GAL16V8S-20QC3

STMicroelectronics

EE PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

No

e0

33.3 MHz

8

GAL16V8AS-20QB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

20 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

3.93 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

25.15 mm

8

GAL20V8AS-15HB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 8 I/O

12

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

8

GAL16V8AS-20HB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

20 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

3.93 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

25.15 mm

8

GAL20V8AS-15EC3J

STMicroelectronics

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 8 I/O

12

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

11.5062 mm

8

GAL20V8S-25HC3J

STMicroelectronics

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

28.5 MHz

8

GAL20V8S-20EC3J

STMicroelectronics

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 8 I/O

12

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

11.5062 mm

8

GAL20V8S-20EB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

20 ns

No

5.5 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 8 I/O

12

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

8

GAL16V8AS-20HC3

STMicroelectronics

EE PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

4.57 mm

8.9662 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

8.9662 mm

8

GAL20V8AS-20QC3J

STMicroelectronics

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 8 I/O

12

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

11.5062 mm

8

GAL16V8S-25QB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

No

e0

28.5 MHz

8

GAL20V8S-25QB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

28.5 MHz

8

GAL20V8AS-15HC3J

STMicroelectronics

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 8 I/O

12

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

11.5062 mm

8

GAL20V8AS-25HC3J

STMicroelectronics

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

28.5 MHz

8

GAL20V8S-25HB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

28.5 MHz

8

GAL16V8S-25HB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

No

e0

28.5 MHz

8

GAL16V8AS-15HB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

3.93 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

25.15 mm

8

GAL16V8AS-20QC3

STMicroelectronics

EE PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

4.57 mm

8.9662 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

33.3 MHz

8

8.9662 mm

8

PZ5128NS10BE-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

12 ns

Yes

5.5 V

CMOS

5

Flatpack, Low Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

128 Macrocells

66 MHz

20 mm

96

P3C18V8ZIDH

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

50 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Thin Profile, Shrink Pitch

Macrocell

2.7 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

1.1 mm

4.4 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

17 MHz

6.5 mm

8

PLC18V8ZIADB-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

5

Small Outline, Shrink Pitch

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocell; Power Up Reset; Shared Input/Clock

30 MHz

7.2 mm

8

PZ5128NS10BP-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

12 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

128 Macrocells

66 MHz

14 mm

80

5962-9176012NXA

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

55 MHz

10

5962-9176011NXA

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

55 MHz

10

PZ3064I12BC

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

67 MHz

10 mm

32

PZ3032DS10A44-T

NXP Semiconductors

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

59 MHz

16.5862 mm

32

PZ5128NS15BP-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

128 Macrocells

63 MHz

14 mm

80

PZ5064I10BB1

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

12.5 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

77 MHz

20 mm

64

P3C18V8ZIN

NXP Semiconductors

OT PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

50 ns

No

3.6 V

CMOS

3.3

In-Line

Macrocell

2.7 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

17 MHz

26.73 mm

8

PZ5064I12A68-T

NXP Semiconductors

EE PLD

Industrial

J Bend

68

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 48 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J68

4.57 mm

24.2316 mm

No

67 MHz

24.2316 mm

48

PZ3128IS15A84

NXP Semiconductors

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

59 MHz

29.3116 mm

64

PZ3128IS12BP-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

3 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

66 MHz

14 mm

80

PZ5064N12BP-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

14.5 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

64 Macrocells

67 MHz

14 mm

64

PZ3032I12BC-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

19 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

47 MHz

10 mm

32

PLC18V8ZZID-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

40 ns

Yes

5.5 V

CMOS

5

Small Outline

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocell; Power Up Reset; Shared Input/Clock

18 MHz

12.8 mm

8

PZ3128IS15BB1-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

59 MHz

20 mm

80

P3Z22V10IBDH-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Thin Profile, Shrink Pitch

Macrocell

3 V

.65 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Dual

R-PDSO-G24

1.1 mm

4.4 mm

No

65 MHz

7.8 mm

10

PZ5064I12A84

NXP Semiconductors

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

67 MHz

29.3116 mm

64

PZ5128IS10BB2

NXP Semiconductors

EE PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

66 MHz

28 mm

96

P3C18V8ZIAFA

NXP Semiconductors

UV PLD

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

45 ns

No

3.6 V

CMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-CDIP-T20

5.08 mm

7.62 mm

No

Programmable Output Polarity

18 MHz

24.305 mm

8

PZ5128IS15A84-T

NXP Semiconductors

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

63 MHz

29.3116 mm

64

PZ5128NS15BP

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

128 Macrocells

63 MHz

14 mm

80

PZ3128IS12BB1-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

66 MHz

20 mm

80

PZ5128IS15BB2-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

63 MHz

28 mm

96

PZ5064I12BB1

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

14.5 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

67 MHz

20 mm

64

PZ5128NS15BE-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Flatpack, Low Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

128 Macrocells

63 MHz

20 mm

96

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.