Industrial Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
CY37128P100-125AI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	128	CMOS			5		3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 69 I/O	1	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	83 MHz				14 mm	Yes	69
CY37128P100-125AXI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	128	CMOS			5		3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 69 I/O	1	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	83 MHz	40 s		260 °C (500 °F)	14 mm	Yes	69
EPF10K30RI240-4N	Intel	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	189		5		3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1728 Logic Elements	e3	62.89 MHz		189		32 mm		189
EPM7064AELI44-7N	Intel	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64	CMOS			3.3		2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e3	135.1 MHz				16.5862 mm	Yes	36
M4A5-64/32-7VNI48	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	48	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	5.5 V	64	CMOS	34	PAL-TYPE	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP48,.35SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.6 mm	7 mm	No		e3	76.9 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
XCR3032XL-7PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32	CMOS			3.3		3/3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	119 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	36
ATF1504ASL-25JI44	Atmel	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.5 V	64	CMOS			5		3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	2	4.57 mm	16.5862 mm	No		e0	60 MHz			225 °C (437 °F)	16.5862 mm	Yes	32
ISPLSI1016E-80LJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	18.5 ns		Yes	5.5 V	64	CMOS	35	PLA-TYPE	5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	3 Dedicated Inputs, 32 I/O	3	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.59 mm	No		e3	57 MHz	40 s	32	245 °C (473 °F)	16.59 mm	No	32
M4A5-32/32-12JI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	32	CMOS			5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	52.6 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
M4A5-32/32-7JI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.5 V	32	CMOS			5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	76.9 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XC2C256-7FT256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS	184	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 184 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e0	108 MHz	30 s	184	225 °C (437 °F)	17 mm	Yes	184
5M1270ZF324I5N	Intel	Flash PLD	Industrial	Ball	324	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	980	CMOS			1.8		1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	271 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e1	201.1 MHz				19 mm	Yes	271
5M80ZM64I5N	Intel	Flash PLD	Industrial	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	64	CMOS			1.8		1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	30 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	118.3 MHz				4.5 mm	Yes	30
CY37512P208-83NI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	512	CMOS	165	PLA-TYPE	5		3.3/5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 160 I/O	1	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.7 mm	28 mm	No	512 Macrocells; Configurable I/O Operation with 3.3 V or 5 V	e0	62.5 MHz		160		28 mm	Yes	160
EPM9320LI84-20	Intel	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	23 ns		Yes	5.5 V	320	CMOS			5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 60 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	100 MHz				29.3116 mm	Yes	60
ATF2500C-15JU	Microchip Technology	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	24	CMOS			5	Tube	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	13 Dedicated Inputs, 24 I/O	13	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.586 mm	No		e3	52 MHz	40 s		245 °C (473 °F)	16.586 mm	No	24
EPF10K100ARI240-3	Intel	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	0.8 ns	4992	Yes	3.6 V		CMOS	189		3.3		2.5/3.3,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			189		32 mm		189
XC95108-15PQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	15 ns		Yes	5.5 V	108	CMOS			5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3		30 s		245 °C (473 °F)	20 mm	Yes	81
XC9572-10PQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns		Yes	5.5 V	72	CMOS			5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	20 mm	Yes	72
XC2C512-10FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	512	CMOS	212	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	91 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
EPF10K20RI208-4	Intel	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	1152	Yes	5.25 V		CMOS	147		5		3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	67.11 MHz		147		28 mm		147
EPF10K30RI208-4N	Intel	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	0.6 ns	1728	Yes	5.25 V		CMOS	147		5		3.3/5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3	62.89 MHz		147		28 mm		147
GAL20V8B-25QPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.5 V		CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		31.75 mm		8
GAL22V10B-25LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.5 V		CMOS	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.953 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	33.3 MHz		10		31.877 mm		10
GAL26V12C-15LJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V		CMOS	26	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	122	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 12 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e0	55.5 MHz	30 s	12	225 °C (437 °F)	11.5062 mm		12
ISPLSI2032A-80LT44I	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	QFP	Square	Plastic/Epoxy	18.5 ns		Yes	5.5 V	32	CMOS			5		5 V	Flatpack	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Tin/Lead	Quad	S-PQFP-G44	3		10 mm	No		e0	57 MHz				10 mm	No	32
M4A3-256/128-10YNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS			3.3		3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	14 Dedicated Inputs, 128 I/O	14	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	62.5 MHz	40 s		245 °C (473 °F)	28 mm	Yes	128
XC2C256-7TQ144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS	118	PLA-TYPE	1.8		1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Real Digital Design Technology	e4	108 MHz		118		20 mm	Yes	118
XC95216-10PQ160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	216	CMOS			5		3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 133 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	3.7 mm	28 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	66.7 MHz	30 s		225 °C (437 °F)	28 mm	Yes	133
XC9536XL-10VQ64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	36	CMOS	36		3.3		2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	36 Macrocells	e4	100 MHz		36		10 mm	Yes	36
EPF10K30AQI208-3N	Intel	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.9 ns	1728	Yes	3.6 V		CMOS	147		3.3		2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	1728 Logic Elements; 216 Labs	e3	80 MHz		147		28 mm		147
EPM7064STI100-10	Altera	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	64	CMOS			5		3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	64 Macrocells	e0	125 MHz			220 °C (428 °F)	14 mm	No	68
EPM7128SLI84-10	Intel	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	128	CMOS			5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	2	5.08 mm	29.3116 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz				29.3116 mm	Yes	68
EPM7128STI100-10	Intel	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	128	CMOS			5		3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz				14 mm	Yes	84
GAL22V10C-10LJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS	22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	71.4 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10
ISPLSI1024-60LJI	Lattice Semiconductor	EE PLD	Industrial	No Lead	68	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.5 V	96	CMOS			5		5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-N68	3	4.57 mm	24.2316 mm	No	In-System Programmable; 4 External Clocks	e0	38 MHz	30 s		225 °C (437 °F)	24.2316 mm	No	48
ISPLSI2032VE-180LTN44I	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32	CMOS			3.3		3.3 V	Flatpack, Thin Profile	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	118 MHz			260 °C (500 °F)	10 mm	No	32
XC2C512-7FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	512	CMOS	212	PLA-TYPE	1.8		1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	119 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
5M160ZM100I5N	Intel	Flash PLD	Industrial	Ball	100	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	128	CMOS			1.8		1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	79 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz				6 mm	Yes	79
CY37064P100-125AXI	Cypress Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	64	CMOS			5		3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 69 I/O	1	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	64 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e4	83 MHz	40 s		260 °C (500 °F)	14 mm	Yes	69
CY7C342B-30RI	Cypress Semiconductor	UV PLD	Industrial	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	60 ns		No	5.5 V	128	CMOS			5		5 V	Grid Array, Window	PGA68,11X11	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 52 I/O	7	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P68		5.08 mm	27.9527 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	27.7 MHz				27.9527 mm	No	52
CY7C343-35HI	Cypress Semiconductor	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	35 ns		Yes	5.5 V	64	CMOS			5		5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 28 I/O	7	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J44		4.57 mm	16.51 mm	No	Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock	e0	22.2 MHz				16.51 mm	No	28
EP1K100FI484-2N	Intel	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS	333		2.5		2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	85 °C (185 °F)	333 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	37.5 MHz		333		23 mm		333
EPF10K100EQI208-2	Intel	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS	147		2.5		2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			147		28 mm		147
EPF10K10ATI144-3	Intel	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.8 ns	576	Yes	3.6 V		CMOS	102		3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	576 Logic Elements; 72 Labs	e0	80 MHz		102		20 mm		102
EPM7128AETI144-7N	Intel	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	129.9 MHz				20 mm	Yes	100
EPM7192EGI160-20	Intel	EE PLD	Industrial	Pin/Peg	160	PGA	Square	Ceramic, Metal-Sealed Cofired	20 ns		No	5.5 V	192	CMOS			5		3.3/5,5 V	Grid Array	PGA160M,15X15	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	0 Dedicated Inputs, 124 I/O	0	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P160	1	5.34 mm	39.624 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	83.3 MHz				39.624 mm	No	124
EPM7256AEFI100-7	Intel	EE PLD	Industrial	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS			3.3		2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	126.6 MHz				11 mm	Yes	84

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.