Other Programmable Logic Devices (PLD) 1,448

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K200RC240-1XN	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V		CMOS		2.5		Flatpack, Fine Pitch				Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm		174
EP20K160ETC144-3	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2.29 ns	6400	Yes	1.89 V		CMOS	80	1.8	1.8,1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 88 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	160 MHz	20 s	80	220 °C (428 °F)	20 mm		88
EP20K200EBC484-1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							376
EPF6016BC256-2	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy		1320	Yes	5.25 V		CMOS	204	5	3.3/5,5 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays		Macrocell	4.75 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 204 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.3 mm	27 mm	No	Can Also Be Used 16000 Logic Gates	e0	153 MHz	20 s	204	220 °C (428 °F)	27 mm		204
EP20K200ERC208-3X	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	2.625 V		CMOS		2.5		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3				220 °C (428 °F)	28 mm		136
EP20K200FC484-1XN	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2.5 ns	8320	Yes	2.625 V		CMOS	376	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		30 s	376	260 °C (500 °F)	23 mm		382
EPF6024AFC256-1	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V		CMOS	219	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 219 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	172 MHz		219	220 °C (428 °F)	17 mm		219
EP20K100ERC208-2X	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V		CMOS	143	2.5	1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 151 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3			143	220 °C (428 °F)	28 mm		151
EP20K400EFC672	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e1				220 °C (428 °F)	27 mm		488
EP20K200EFC672-3N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.33 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e1	160 MHz				27 mm		376
EP20K160EFC484-1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.55 ns	6400	Yes	1.89 V		CMOS	308	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	160 MHz	20 s	308	220 °C (428 °F)	23 mm		316
EP1M120F484C6	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy		4800	Yes	1.89 V		CMOS	303	1.8	1.5/3.3,1.8 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	303	220 °C (428 °F)	23 mm		303
EP20K1000EFC1020-3X	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	2.625 V		CMOS		2.5		Grid Array, Heat Sink/Slug				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 708 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1	160 MHz				33 mm		708
EP20K200BC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							382
EPF6016AFC256-3N	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy			Yes	3.6 V				3.3		Grid Array				Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1	133 MHz				17 mm		171
EP2A40F1020C9N	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2.05 ns		Yes	1.575 V		CMOS		1.5		Grid Array				Macrocell	1.425 V	1 mm	85 °C (185 °F)	735 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1		40 s		245 °C (473 °F)	33 mm		735
EP1M120FC484-7	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 303 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		303
EPM1270GM256C3N	Altera	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	6.2 ns		Yes	1.89 V	980	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	212
EP20K30EFC672	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1	160 MHz				27 mm		128
EP20K200CQ208C9N	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2 ns		Yes	1.89 V				1.8		Flatpack, Fine Pitch				Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3					28 mm		136
EPF6016ATC100-2N	Altera	Loadable PLD	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy			Yes	3.6 V				3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 81 I/O	4	0 °C (32 °F)	Matte Tin/Copper	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	Can Also Be Used 16000 Logic Gates	e2	153 MHz	40 s		260 °C (500 °F)	14 mm		81
EP20K160EBC356	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array, Low Profile				Macrocell		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 273 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1				220 °C (428 °F)	35 mm		273
EP20K200CBC652-8	Altera	Loadable PLD	Other	Ball	652	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	376 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		1.63 mm	45 mm	No		e1					45 mm		376
EP20K200EBC672-2	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes					1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							376
EP20K160EFC484-2X	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.93 ns	6400	Yes	1.89 V		CMOS	308	1.8	1.8,1.8/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0	160 MHz	20 s	308	220 °C (428 °F)	23 mm		316
EP2A25B724C7	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.69 ns	24320	Yes	1.575 V		CMOS	524	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm		536
EP20K100EFC144-2	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	85	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.7 mm	13 mm	No		e0	160 MHz	20 s	85	235 °C (455 °F)	13 mm		93
EPM570GF256C3N	Altera	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	5.4 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	17 mm	Yes	160
EP20K30EQC208-1X	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.91 ns	1200	Yes	1.89 V		CMOS	117	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 125 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	160 MHz		117	220 °C (428 °F)	28 mm		125
EP20K100FC324	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1				220 °C (428 °F)	19 mm		252
EP20K1500EFC33-3N	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2.32 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1					33 mm		808
EP20K30EQC208-3	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3.98 ns	1200	Yes	1.89 V		CMOS	117	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 125 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	160 MHz		117	220 °C (428 °F)	28 mm		125
EP20K30EFC144-3N	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	3.98 ns		Yes	1.89 V		CMOS		1.8		Grid Array, Low Profile				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144		1.7 mm	13 mm	No		e1	160 MHz				13 mm		93
EP20K200FC484-2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	3 ns	8320	Yes	2.625 V		CMOS	376	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0		20 s	376	220 °C (428 °F)	23 mm		382
EP20K200CB356C8N	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.7 mm	35 mm	No		e1					35 mm		271
EPM570ZM256C7N	Altera	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	15.1 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3			No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)		Yes	160
EP20K100FC484-1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1				220 °C (428 °F)	23 mm		252
EP1M350F780C7	Altera	Loadable PLD	Other	Ball	780	BGA	Square	Plastic/Epoxy		14400	Yes	1.89 V		CMOS	486	1.8	1.5/3.3,1.8 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		Mixed	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 486 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0			486	220 °C (428 °F)	29 mm		486
EP20K100EFC324-2X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0	160 MHz	20 s	238	220 °C (428 °F)	19 mm		246
EP20K100EFC144ES	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Low Profile				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144		1.7 mm	13 mm	No		e1					13 mm		93
EP20K200FC672-1V	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	0.3 ns		Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1	100 MHz				27 mm		382
EP20K400ERC240-1	Altera	Loadable PLD	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes					1.8		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 132 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm		132
EPF6024AFC256-3N	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy			Yes	3.6 V				3.3		Grid Array				Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 219 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1	133 MHz				17 mm		219
EPF6010ATC100-1	Altera	Loadable PLD	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		880	Yes	3.6 V		CMOS	71	3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays		Macrocell	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 71 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	Can Also Be Used 10000 Logic Gates	e0	172 MHz		71	220 °C (428 °F)	14 mm		71
EP20K60EQC208-2N	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2.41 ns	2560	Yes	1.89 V		CMOS	140	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 148 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	160 MHz	30 s	140	245 °C (473 °F)	28 mm		148
EP20K200EBC652-2XN	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.97 ns		Yes	1.89 V		CMOS		1.8		Grid Array				Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1					45 mm		376
EP20K100ERC240	Altera	Loadable PLD	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes					1.8		Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 181 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm		181
EP20K30ETC144-1X	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1.91 ns	1200	Yes	1.89 V		CMOS	84	1.8	1.8,1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 92 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	160 MHz	20 s	84	220 °C (428 °F)	20 mm		92

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.