20 Programmable Logic Devices (PLD) 1,360

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
GAL16V8D-25LJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e3	37 MHz	40 s	8	250 °C (482 °F)	8.9662 mm		8
GAL16V8D-25LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz	30 s	8	225 °C (437 °F)	26.162 mm		8
GAL16V8D-25LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz		8		26.162 mm		8
GAL16V8D-25QJNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e3	37 MHz	40 s	8	250 °C (482 °F)	8.9662 mm		8
GAL16V8D-25QP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz		8		26.162 mm		8
SLG46538V	Renesas Electronics	OT PLD		No Lead	20	HVQCCN	Rectangular			Yes	1.89 V	17			17	PLA-TYPE	1.8			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC20,.08X.12,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 16 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N20		.6 mm	2 mm		Can also operate at 3.3 V or 5 V supply				16		3 mm	No	16
5962-8983901RA	Defense Logistics Agency	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	MIL-STD-883			5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	1 External Clock; Register Preload	e0	22.2 MHz				25.27 mm		8
5962-89839022A	Defense Logistics Agency	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.5 V		CMOS	MIL-STD-883			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		2.54 mm	8.89 mm	No	1 External Clock; Register Preload	e0	33.3 MHz				8.89 mm		8
5962-8983903RA	National Semiconductor	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset	e0	41.6 MHz				24.257 mm		8
ATF16V8BQL-15PI	Atmel	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No		e0	45 MHz		8		25.908 mm		8
GAL16V8D-10LJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No	Programmable Output Polarity	e0	66.7 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
GAL16V8D-10QJ	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e0	66.7 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
JM38510/50401BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No			TTL	MIL-M-38510 Class B			5			In-Line				Combinatorial				125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20				No		e0
JM38510/50605BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		TTL	MIL-M-38510 Class B	16	PAL-TYPE	5	Tube		In-Line			No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	25 MHz		8		24.2 mm	No	6
JM38510/50606BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		TTL	MIL-M-38510 Class B	8	PAL-TYPE	5	Tube		In-Line			No	Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	25 MHz		8		24.2 mm	No	0
PAL16L8AMJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	25 MHz		8		24.195 mm	No	6
SLG46580V	Renesas Electronics	OT PLD		No Lead	20	VQCCN	Rectangular			Yes	5.5 V	15			9	PLA-TYPE	3.3			Chip Carrier, Very Thin Profile	LCC20,.08X.12,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 8 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N20		.6 mm	2 mm						8		3 mm	No	8
SLG46580VTR	Renesas Electronics	OT PLD		No Lead	20	VQCCN	Rectangular			Yes	5.5 V	15			9	PLA-TYPE	3.3	Box, Tape and Reel, 7 in		Chip Carrier, Very Thin Profile	LCC20,.08X.12,16		No	Macrocell	2.3 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 8 I/O	1	-40 °C (-40 °F)		Quad	R-XQCC-N20		.6 mm	2 mm						8		3 mm	No	8
SLG46827-AG	Renesas Electronics	OT PLD		Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy		Yes	5.5 V	19		AEC-Q100	13	PLA-TYPE	3.3			Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25		No	Macrocell	2.3 V		.65 mm	105 °C (221 °F)	0 Dedicated Inputs, 13 I/O	0	-40 °C (-40 °F)		Dual	R-PDSO-G20	1	1.2 mm	4.4 mm						15		6.5 mm	No	13
8103610SA	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	40 ns	Yes	5.5 V		TTL	MIL-STD-883	12	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDFP-F20		2.54 mm	6.92 mm	Yes		e0	25 MHz		8		13.09 mm	No	4
GAL16V8-20HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No			CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20				No		e0	33.3 MHz		8
GAL16V8D-25QJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e0	37 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
JM38510/50604BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		TTL	MIL-M-38510 Class B	12	PAL-TYPE	5	Tube		In-Line			No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	6.92 mm	No		e0	40 MHz		8		24.2 mm	No	4
TIBPAL16L8-25CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		TTL	MIL-STD-883	16	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Combinatorial	4.75 V	64	1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQCC-J20	3	4.57 mm	8.965 mm	No		e4	30 MHz	30 s	8	245 °C (473 °F)	8.965 mm		6
M38510/50601BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	6.92 mm	Yes		e0	40 MHz		8		24.2 mm	No	6
GAL16V8D-25LJN	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e3	37 MHz	40 s	8	250 °C (482 °F)	8.9662 mm		8
GAL18V10B-20LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	96	2.54 mm	75 °C (167 °F)	7 Dedicated Inputs, 10 I/O	7	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20	1	4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	41.6 MHz		10		26.125 mm		10
PALC16R4-30DMB	Cypress Semiconductor	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	1 External Clock	e0	22 MHz		4		24.13 mm		4
PALCE16V8H-25PC/4	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20		4.953 mm	7.62 mm	No		e0	37 MHz		8		26.1366 mm		8
5962-8983904RA	Defense Logistics Agency	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		CMOS	MIL-STD-883			5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	Yes	1 External Clock; Register Preload	e0	58.8 MHz				25.27 mm		8
ATF16V8B-10PC	Atmel	Flash PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	68 MHz		8		25.908 mm		8
GAL16V8B-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		26.125 mm		8
PALCE16V8-25JC	Cypress Semiconductor	Flash PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20		4.57 mm	8.9662 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset	e0	37 MHz		8		8.9662 mm		8
PALCE16V8-7JC	Cypress Semiconductor	Flash PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20		4.57 mm	8.9662 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset	e0	100 MHz		8		8.9662 mm		8
5962-8867805RA	Defense Logistics Agency	UV PLD	Military	Through-Hole	20	WDIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS				5			In-Line, Window				Combinatorial	4.5 V		2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0					24.13 mm		6
5962-89839032A	Defense Logistics Agency	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V		CMOS	MIL-STD-883			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		2.54 mm	8.89 mm	No	1 External Clock; Register Preload	e0	41.6 MHz				8.89 mm		8
ATF16V8B-15GM	Atmel	Flash PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	45 MHz		8		24.35 mm		8
EP320IPC-35	Altera	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No			CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		72	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20				No		e0	25 MHz		8	220 °C (428 °F)
EP330PC-15	Rochester Electronics	OT PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	16 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		4.318 mm	7.62 mm		8 Macrocells; 1 External Clock; Shared Input/Clock	e0	83.3 MHz				26.162 mm		8
EPM5016DC-20	Altera	UV PLD	Commercial	Through-Hole	20	WDIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		CMOS		16	PAL-TYPE	5		5 V	In-Line, Window	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 8 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T20		5.334 mm	7.62 mm	No	Macrocells interconnected by PIA; 16 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		8	220 °C (428 °F)	24.13 mm		8
GAL16V8B-10LJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20	1	4.57 mm	8.9662 mm	No	Register Preload; Power-Up Reset	e0	58.8 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
GAL16V8B-10LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	58.8 MHz		8		26.125 mm		8
GAL16V8B-15LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	1	4.57 mm	8.9662 mm	No	Register Preload; Power-Up Reset	e0	45.5 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
GAL16V8D-10LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	Programmable Output Polarity	e0	66.7 MHz		8		26.162 mm		8
GAL16V8D-15LD/883	Lattice Semiconductor	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-STD-883	18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20	1	5.08 mm	7.62 mm	No		e0	41.6 MHz		8		25.27 mm		8
GAL16V8D-5LJ	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No	Programmable Output Polarity	e0	142.8 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
GAL16V8Z-15QP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	7 Dedicated Inputs, 8 I/O	7	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20		4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	40 MHz		8		26.125 mm		8
GAL18V10B-20LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	96	1.27 mm	75 °C (167 °F)	7 Dedicated Inputs, 10 I/O	7	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.57 mm	8.9662 mm	No	Register Preload; Power-Up Reset	e0	41.6 MHz	30 s	10	225 °C (437 °F)	8.9662 mm		10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.