225 Programmable Logic Devices (PLD) 48

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC73144-10WB225C	Xilinx	UV PLD	Commercial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	25 ns		Yes	5.25 V	144	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)		Bottom	S-CBGA-B225	1			No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops		62.5 MHz					No	120
XC73108-20BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	45 ns		Yes	5.25 V	108	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	35.7 MHz	30 s		225 °C (437 °F)	27 mm	No	78
XC73108-7WB225C	Xilinx	UV PLD	Commercial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	18 ns		Yes	5.25 V	108	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		83.3 MHz					No	78
XC73108-15WB225C	Xilinx	UV PLD	Commercial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	36 ns		Yes	5.25 V	108	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		45.5 MHz					No	78
XC73108-15BG225I	Xilinx	OT PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	36 ns		Yes	5.5 V	108	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 78 I/O	12	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	45.5 MHz	30 s		225 °C (437 °F)	27 mm	No	78
XC73144-12WB225C	Xilinx	UV PLD	Commercial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	30 ns		Yes	5.25 V	144	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)		Bottom	S-CBGA-B225	1			No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops		55.6 MHz					No	120
XC73108-7BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	18 ns		Yes	5.25 V	108	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	83.3 MHz	30 s		225 °C (437 °F)	27 mm	No	78
XC73144-12BG225I	Xilinx	OT PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	30 ns		Yes	5.5 V	144	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 120 I/O	12	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	55.6 MHz	30 s		225 °C (437 °F)	27 mm	No	120
XC73108-20WB225I	Xilinx	UV PLD	Industrial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	45 ns		Yes	5.5 V	108	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 78 I/O	12	-40 °C (-40 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		35.7 MHz					No	78
XC73108-12WB225I	Xilinx	UV PLD	Industrial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	30 ns		Yes	5.5 V	108	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 78 I/O	12	-40 °C (-40 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		55.6 MHz					No	78
XC73108-10WB225C	Xilinx	UV PLD	Commercial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	25 ns		Yes	5.25 V	108	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		62.5 MHz					No	78
XC73144-7WB225C	Xilinx	UV PLD	Commercial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	18 ns		Yes	5.25 V	144	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)		Bottom	S-CBGA-B225	1			No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops		83.3 MHz					No	120
XC73108-15BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	36 ns		Yes	5.25 V	108	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	45.5 MHz	30 s		225 °C (437 °F)	27 mm	No	78
XC73108-10BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	25 ns		Yes	5.25 V	108	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	62.5 MHz	30 s		225 °C (437 °F)	27 mm	No	78
XC73108-15WB225I	Xilinx	UV PLD	Industrial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	36 ns		Yes	5.5 V	108	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 78 I/O	12	-40 °C (-40 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		45.5 MHz					No	78
XC73144-12WB225I	Xilinx	UV PLD	Industrial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	30 ns		Yes	5.5 V	144	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 120 I/O	12	-40 °C (-40 °F)		Bottom	S-CBGA-B225	1			No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops		55.6 MHz					No	120
XC73144-15BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	36 ns		Yes	5.25 V	144	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	45.5 MHz	30 s		225 °C (437 °F)	27 mm	No	120
XC73108-12BG225I	Xilinx	OT PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	30 ns		Yes	5.5 V	108	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 78 I/O	12	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	55.6 MHz	30 s		225 °C (437 °F)	27 mm	No	78
XC73108-20BG225I	Xilinx	OT PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	45 ns		Yes	5.5 V	108	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 78 I/O	12	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	35.7 MHz	30 s		225 °C (437 °F)	27 mm	No	78
XC73144-15WB225C	Xilinx	UV PLD	Commercial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	36 ns		Yes	5.25 V	144	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)		Bottom	S-CBGA-B225	1			No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops		45.5 MHz					No	120
XC73108-20WB225C	Xilinx	UV PLD	Commercial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	45 ns		Yes	5.25 V	108	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		35.7 MHz					No	78
XC73108-12WB225C	Xilinx	UV PLD	Commercial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	30 ns		Yes	5.25 V	108	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		55.6 MHz					No	78
XC73144-15BG225I	Xilinx	OT PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	36 ns		Yes	5.5 V	144	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 120 I/O	12	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	45.5 MHz	30 s		225 °C (437 °F)	27 mm	No	120
XC73108-12BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	30 ns		Yes	5.25 V	108	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	55.6 MHz	30 s		225 °C (437 °F)	27 mm	No	78
XC73144-7BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	18 ns		Yes	5.25 V	144	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	83.3 MHz	30 s		225 °C (437 °F)	27 mm	No	120
XC73144-10BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	22 ns		Yes	5.25 V	144	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	62.5 MHz	30 s		225 °C (437 °F)	27 mm	No	120
XC73144-15WB225I	Xilinx	UV PLD	Industrial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	36 ns		Yes	5.5 V	144	CMOS		5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 120 I/O	12	-40 °C (-40 °F)		Bottom	S-CBGA-B225	1			No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops		45.5 MHz					No	120
XC73144-12BG225C	Xilinx	OT PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	30 ns		Yes	5.25 V	144	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.75 V	1.5 mm	70 °C (158 °F)	12 Dedicated Inputs, 120 I/O	12	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	55.6 MHz	30 s		225 °C (437 °F)	27 mm	No	120
EPF8820BM225-2	Altera	Loadable PLD	Military	Ball	225	BGA	Square	Plastic/Epoxy			Yes	5.5 V		CMOS		5		Grid Array				Registered	4.5 V	1.5 mm	125 °C (257 °F)	4 Dedicated Inputs, 148 I/O	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e1					27 mm		148
EPF8820ABC225-2	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		Registered	4.75 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		148	220 °C (428 °F)	27 mm		152
EPF8820ABI225-2	Altera	Loadable PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.5 V		CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	672 Logic elements; 84 Labs; Configurable I/O operation with 3.3 V or 5 V	e0			148	220 °C (428 °F)	27 mm		152
EPF8820ABI225-A-3	Altera	Loadable PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	1.8 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	Can also operate at 5 V supply	e1					27 mm		152
EPF8820ABC225-A-2	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	1.7 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	Can also operate at 5 V supply	e1					27 mm		152
EPF8820ABM225-4	Altera	Loadable PLD	Military	Ball	225	BGA	Square	Plastic/Epoxy			Yes	5.5 V		CMOS		5		Grid Array				Registered	4.5 V	1.5 mm	125 °C (257 °F)	4 Dedicated Inputs, 148 I/O	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e1					27 mm		148
EPF8820ABC225-4N	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy			Yes	5.25 V		CMOS		5		Grid Array				Registered	4.75 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	2.3 mm	27 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e1					27 mm		152
EPF8820BC225-3	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		Registered	4.75 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 148 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0			148	220 °C (428 °F)	27 mm		148
EPF8820BI225-2	Altera	Loadable PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy			Yes	5.5 V		CMOS		5		Grid Array				Registered	4.5 V	1.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 148 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e1					27 mm		148
EPF8820ABC225-A-3	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	1.8 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	Can also operate at 5 V supply	e1					27 mm		152
EPF8820BC225-2	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		Registered	4.75 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 148 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0			148	220 °C (428 °F)	27 mm		148
EPF8820BM225-3	Altera	Loadable PLD	Military	Ball	225	BGA	Square	Plastic/Epoxy			Yes	5.5 V		CMOS		5		Grid Array				Registered	4.5 V	1.5 mm	125 °C (257 °F)	4 Dedicated Inputs, 148 I/O	4	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e1					27 mm		148
EPF8820BI225-3	Altera	Loadable PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy			Yes	5.5 V		CMOS		5		Grid Array				Registered	4.5 V	1.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 148 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e1					27 mm		148
EPF8820ABI225-A-4	Altera	Loadable PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	1.9 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	Can also operate at 5 V supply	e1					27 mm		152
EPF8820ABI225-A-2	Altera	Loadable PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	1.7 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	Can also operate at 5 V supply	e1					27 mm		152
EPF8820ABI225-4	Altera	Loadable PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.5 V		CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		Registered	4.5 V	1.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 148 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0			148	220 °C (428 °F)	27 mm		148
EPF8820ABC225-3	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		Registered	4.75 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		148	220 °C (428 °F)	27 mm		152
EPF8820ABI225-3	Altera	Loadable PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.5 V		CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		Registered	4.5 V	1.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 152 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		148	220 °C (428 °F)	27 mm		152
EPF8820ABC225-A-4	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy	1.9 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		2.3 mm	27 mm	No	Can also operate at 5 V supply	e1					27 mm		152
EPF8820ABC225-4	Altera	Loadable PLD	Commercial	Ball	225	BGA	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS	152	5	3.3/5,5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays		Registered	4.75 V	1.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B225	3	2.3 mm	27 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	357 MHz		148	220 °C (428 °F)	27 mm		152

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.