Xilinx - XC73144-7BG225C

XC73144-7BG225C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC73144-7BG225C
Description OT PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC73144-7BG225C Datasheet
In Stock235
NAME DESCRIPTION
Minimum Supply Voltage: 4.75 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 18 ns
Organization: 12 Dedicated Inputs, 120 I/O
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 3.5 mm
Sub-Category: Programmable Logic Devices
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 225
JTAG Boundary Scan Test: No
No. of I/O Lines: 120
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B225
Maximum Clock Frequency: 83.3 MHz
Package Shape: Square
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: BGA
Width: 27 mm
No. of Dedicated Inputs: 12
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial
Programmable IC Type: OT PLD
Maximum Supply Voltage: 5.25 V
Nominal Supply Voltage (V): 5
Technology Used: CMOS
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA225,15X15
Finishing Of Terminal Used: Tin Lead
Length: 27 mm
Form Of Terminal: Ball
In-System Programmable: No
Additional Features: 144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops
Output Function: Macrocell
Pitch Of Terminal: 1.5 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
No. of Macro Cells: 144
Power Supplies (V): 3.3/5,5 V
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