Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
2 |
4.572 mm |
11.5062 mm |
No |
e3 |
55.5 MHz |
10 |
11.5062 mm |
10 |
|||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
e3 |
90 MHz |
10 |
11.5062 mm |
10 |
||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.506 mm |
No |
e3 |
55.5 MHz |
10 |
11.506 mm |
No |
10 |
|||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
No |
e3 |
38.5 MHz |
10 |
11.5062 mm |
10 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e3 |
83.3 MHz |
40 s |
10 |
245 °C (473 °F) |
11.5062 mm |
10 |
||||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
10 |
CMOS |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
e3 |
44 MHz |
11.5062 mm |
No |
10 |
|||||||||||
|
Microchip Technology |
Flash PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
70 °C (158 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
142 MHz |
10 |
11.5062 mm |
10 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e3 |
111 MHz |
40 s |
10 |
245 °C (473 °F) |
11.5062 mm |
10 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e3 |
55.5 MHz |
40 s |
10 |
245 °C (473 °F) |
11.5062 mm |
10 |
||||||||
Cypress Semiconductor |
Flash PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5316 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
76.9 MHz |
10 |
11.5316 mm |
10 |
|||||||||||
|
Microchip Technology |
Flash PLD |
Other |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
3.3 |
Tube |
3.3/5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
3 V |
132 |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
e3 |
71.4 MHz |
10 |
11.5062 mm |
10 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e3 |
142.8 MHz |
40 s |
10 |
245 °C (473 °F) |
11.5062 mm |
10 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e3 |
33.3 MHz |
40 s |
10 |
245 °C (473 °F) |
11.5062 mm |
10 |
||||||||
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
55.5 MHz |
11.5062 mm |
10 |
||||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
5 |
Tape and Reel |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.506 mm |
38.5 MHz |
11.506 mm |
10 |
||||||||||||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
4 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e3 |
167 MHz |
40 s |
10 |
245 °C (473 °F) |
11.5062 mm |
10 |
||||||||
Microchip Technology |
Flash PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.506 mm |
38.5 MHz |
11.506 mm |
10 |
||||||||||||||||||||||
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.506 mm |
38.5 MHz |
11.506 mm |
10 |
||||||||||||||||||||||
Atmel |
Flash PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
2 |
4.57 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Register Preload; Power-Up Reset; Shared Input/Clock |
e0 |
125 MHz |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
|||||||||
Defense Logistics Agency |
EE PLD |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
No |
e0 |
50 MHz |
10 |
||||||||||||||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
10 Macrocells; Shared Input/Clock |
e0 |
33.3 MHz |
30 s |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
||||||||
Cypress Semiconductor |
Flash PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
76.9 MHz |
10 |
||||||||||||||||||||||||
Cypress Semiconductor |
Flash PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5316 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
76.9 MHz |
11.5316 mm |
10 |
||||||||||||||||||||
|
Microchip Technology |
Flash PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
No |
e3 |
125 MHz |
10 |
11.5062 mm |
10 |
||||||||||
Microchip Technology |
Flash PLD |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LCC28,.45SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-55 °C (-67 °F) |
Quad |
S-CQCC-N28 |
2.54 mm |
11.4554 mm |
No |
90 MHz |
10 |
11.455 mm |
10 |
||||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP28,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
76.9 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
Altera |
UV PLD |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP28,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
Intel |
OT PLD |
Commercial |
J Bend |
28 |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
32 |
CMOS |
24 |
PAL-TYPE |
5 |
No |
Macrocell |
4.75 V |
320 |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Quad |
S-XQCC-J28 |
50 MHz |
16 |
No |
16 |
|||||||||||||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
20 ns |
Yes |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier, Window |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-CQCC-J28 |
4.57 mm |
11.43 mm |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
11.43 mm |
16 |
||||||||||
Altera |
UV PLD |
Military |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
Yes |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier, Window |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
320 |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J28 |
4.57 mm |
11.43 mm |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
50 MHz |
16 |
220 °C (428 °F) |
11.43 mm |
16 |
||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
76.9 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP28,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
76.9 MHz |
30 s |
16 |
220 °C (428 °F) |
16 |
||||||||||||
Altera |
OT PLD |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
20 ns |
No |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP28,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e0 |
58.8 MHz |
30 s |
8 |
225 °C (437 °F) |
11.5062 mm |
8 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e3 |
58.8 MHz |
40 s |
8 |
245 °C (473 °F) |
11.5062 mm |
8 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e3 |
58.8 MHz |
40 s |
8 |
245 °C (473 °F) |
11.5062 mm |
8 |
|||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
80 ns |
No |
5.5 V |
TTL |
5 |
In-Line |
Combinatorial |
4.5 V |
125 °C (257 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T28 |
No |
0 |
||||||||||||||||||||||||||
Qp Semiconductor |
OT PLD |
Military |
Through-Hole |
28 |
Rectangular |
Ceramic, Metal-Sealed Cofired |
80 ns |
No |
5.5 V |
Bipolar |
5 |
In-Line |
Combinatorial |
4.5 V |
125 °C (257 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
-55 °C (-67 °F) |
Dual |
R-CDIP-T28 |
No |
0 |
|||||||||||||||||||||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e0 |
58.8 MHz |
30 s |
8 |
225 °C (437 °F) |
11.5062 mm |
8 |
||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
CMOS |
26 |
PAL-TYPE |
3.3 |
3.3 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
3 V |
122 |
1.27 mm |
75 °C (167 °F) |
13 Dedicated Inputs, 12 I/O |
13 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J28 |
1 |
4.57 mm |
11.5062 mm |
No |
Programmable Output Polarity |
e0 |
143 MHz |
30 s |
12 |
225 °C (437 °F) |
11.5062 mm |
12 |
||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
10 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
2 |
4.572 mm |
11.5062 mm |
No |
e0 |
55 MHz |
225 °C (437 °F) |
11.5062 mm |
No |
10 |
|||||||||||
Defense Logistics Agency |
EE PLD |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
1.9812 mm |
11.43 mm |
Yes |
e0 |
76.9 MHz |
11.43 mm |
10 |
||||||||||||||||||
Cypress Semiconductor |
OT PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
320 |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J28 |
4.57 mm |
11.5316 mm |
No |
Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
30 s |
16 |
225 °C (437 °F) |
11.5316 mm |
16 |
|||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
26 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
122 |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
e0 |
55.5 MHz |
30 s |
12 |
225 °C (437 °F) |
11.5062 mm |
12 |
|||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
50 ns |
No |
5.25 V |
TTL |
16 |
PLA-TYPE |
5 |
5 V |
In-Line |
DIP28,.6 |
Programmable Logic Devices |
Combinatorial |
4.75 V |
48 |
2.54 mm |
75 °C (167 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
0 °C (32 °F) |
Dual |
R-PDIP-T28 |
No |
Tri-State Output |
8 |
0 |
|||||||||||||||||
Lattice Semiconductor |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e0 |
71.4 MHz |
30 s |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
||||||||
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
10 Macrocells; Shared Input/Clock |
e0 |
83.3 MHz |
30 s |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.