28 Programmable Logic Devices (PLD) 916

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
GAL22V10D-10QJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e3	83.3 MHz	40 s	10	245 °C (473 °F)	11.5062 mm		10
5962-9061102XA	Defense Logistics Agency	UV PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed		No			CMOS				5			In-Line				Macrocell				125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28				Yes		e0
ATF750CL-15JC	Atmel	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	10	CMOS				5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	2	4.572 mm	11.5062 mm	No		e0	44 MHz			225 °C (437 °F)	11.5062 mm	No	10
CY7C344-25WMB	Cypress Semiconductor	UV PLD	Military	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	24	PAL-TYPE	5		5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.5 V	320	2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 16 I/O	7	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz		16		37.0205 mm		16
GAL20V8B-15LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e3	45.5 MHz	40 s	8	245 °C (473 °F)	11.5062 mm		8
GAL20V8B-25LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	37 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
GAL20V8B-25LJN	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e3	37 MHz	40 s	8	245 °C (473 °F)	11.5062 mm		8
GAL20V8C-5LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	142.8 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
PALCE26V12H-7JC/4	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS		26	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	136	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 12 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e0	105.3 MHz	30 s	12	225 °C (437 °F)	11.5062 mm		12
PLDC20RA10-15JC	Cypress Semiconductor	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	80	1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28				No	Asynchronous Registered; 10 Macrocells; Register Preload; Power-Up Reset	e0	45.5 MHz		10				10
CY7C330-40WMB	Cypress Semiconductor	UV PLD	Military	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	23	PAL-TYPE	5		5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.5 V	256	2.54 mm	125 °C (257 °F)	9 Dedicated Inputs, 12 I/O	9	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Synchronous State Machine; 12 I/O Macrocells; 3 External Clocks; Shared Input/Clock	e0	40 MHz		12		37.0205 mm		12
CY7C344-20WC	Cypress Semiconductor	UV PLD	Commercial	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	41.6 MHz		16		37.0205 mm		16
EP22V10ELC-15	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock	e0	64.5 MHz		10	220 °C (428 °F)	11.505 mm		10
EPM5032DC-25	Altera	UV PLD	Commercial	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)	36.83 mm		16
GAL20V8B-15LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	45.5 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
GAL22LV10C-10LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS		22	PAL-TYPE	3.3		3.3 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	3 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	71 MHz		10		11.5062 mm		10
GAL22V10C-5LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	142.8 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10
ISPGAL22LV10-10LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes			CMOS		22	PAL-TYPE	3.3		3.3 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	3 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	In-System Programmable	e0	74 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10
PALCE20RA10H-20JC	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	80	1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e0	37 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10
PALCE22V10Z-25JC	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms	e0	33.3 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10
PALCE26V12H-10JC/4	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS		26	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	136	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 12 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e0	71.4 MHz	30 s	12	225 °C (437 °F)	11.5062 mm		12
PLDC20RA10-15JCT	Cypress Semiconductor	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5			Chip Carrier				Macrocell	4.5 V			75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J28				No	Asynchronous Registered; 10 Macrocells; Register Preload; Power-Up Reset		45.5 MHz						10
ATF22LV10CQZ-30JU	Microchip Technology	Flash PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	30 ns	Yes	5.5 V		CMOS		22	PAL-TYPE	3.3	Tube	3.3/5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	3 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No		e3	25 MHz		10		11.5062 mm		10
TIBPAL20L8-7CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	9 ns	Yes	5.25 V		TTL		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Combinatorial	4.75 V	64	1.27 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No			74 MHz		8		11.5062 mm		6
TIBPAL20R6-10MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	12 ns	Yes	5.5 V		TTL		14	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No	Register Preload; Power-Up Reset		50 MHz		8		11.43 mm		2
82S105ACN	Texas Instruments	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy		No			TTL		16	PLS-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices				48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T28				No			12.5 MHz		8
TIBPAL20L8-10CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V		TTL		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Combinatorial	4.75 V	64	1.27 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No					8		11.5062 mm		6
TIBPALR19L8MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		TTL		19	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	2 Dedicated Inputs, 6 I/O	2	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No					8		11.43 mm		6
TIBPAL20L10-25MFKB	Texas Instruments	EE PLD	Military	No Lead	28	QCCN	Square	Ceramic	25 ns	Yes			TTL	38535Q/M;38534H;883B	20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial		40	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28				No					10
TIBPALT19R6MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes			TTL	38535Q/M;38534H;883B	19	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28				No					8
5962-87671193X	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Chip Carrier				Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28				No			74 MHz						0
TIBPAL20R6-25CNL	Texas Instruments	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V		TTL		14	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Mixed	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28				No	Register Preload; Power-Up Reset		25 MHz		8				2
PAL20R6AMFH	Texas Instruments	OT PLD	Military	J Bend	28	QCCJ	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		TTL		14	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J28		2.54 mm	11.43 mm	No	1 External Clock; Register Preload		20 MHz		8		11.43 mm		2
TIBPAL20R6-15CNL	Texas Instruments	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	18 ns	Yes	5.25 V		TTL		14	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Mixed	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28				No	Register Preload; Power-Up Reset		37 MHz		8				2
82S105AMJDB	Texas Instruments	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic		No			TTL	38535Q/M;38534H;883B	16	PLS-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices				48	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T28				No					8
82S105ACJDB	Texas Instruments	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Ceramic		No			TTL	38535Q/M;38534H;883B	16	PLS-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices				48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T28				No			12.5 MHz		8
5962-86053013X	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Chip Carrier				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Quad	S-CQCC-N28				No			22 MHz						10
TIBPAL20R6-7MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic	7 ns	Yes			TTL	38535Q/M;38534H;883B	14	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28				No			74 MHz		8
TIBPAL20R6-20MFKB	Texas Instruments	OT PLD	Military	No Lead	28	HQCCN	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.25 V		TTL	38535Q/M;38534H;883B	14	PAL-TYPE	5		5 V	Chip Carrier, Heat Sink/Slug	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.75 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No			28.5 MHz		8		11.43 mm		2
TIBPAL22V10-35CFN	Texas Instruments	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	40 ns	Yes			TTL		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell		132	1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J28				No			18 MHz		10
TIEPAL10016ET6CFN	Texas Instruments	OT PLD	Other	J Bend	28	QCCJ	Square	Plastic/Epoxy	6 ns	Yes	5.5 V		ECL100K		10	PAL-TYPE	5		5,-5.2 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Latched	4.5 V	48	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 0 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No					6		11.5062 mm		0
TIBPAL20R4-20MFKB	Texas Instruments	OT PLD	Military	No Lead	28	HQCCN	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.25 V		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	Chip Carrier, Heat Sink/Slug	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.75 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No			28.5 MHz		8		11.43 mm		4
TIBPAL20R6-30MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		TTL		14	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No			25 MHz		8		11.43 mm		2
TIBPAL20L10-30CFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	30 ns	Yes	5.25 V		TTL		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Combinatorial	4.75 V	40	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No					10		11.5062 mm		8
82S105ACFK	Texas Instruments	OT PLD	Commercial	No Lead	28	QCCN	Square	Ceramic		Yes			TTL		16	PLS-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices				48	1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-XQCC-N28				No			12.5 MHz		8
M38510/50803B3X	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square		20 ns	Yes	5.5 V		CMOS	MIL-M-38510 Class B			5			Chip Carrier				Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Quad	S-XQCC-N28				No			31.2 MHz						10
5962-87671163X	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Chip Carrier				Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28				No			50 MHz						0
TIBPSG507ACFN	Texas Instruments	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V		TTL		13	PLS-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	80	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	F_Max for 6-bit couner CNT_/HLD0 application = 33 MHz; Programmable sequence generator		45 MHz		8		11.5062 mm		0

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.